PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-4: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH J LEADS ON TWO SIDES

Available format(s)

Hardcopy , PDF

Language(s)

German

Published date

01-01-2008

Publisher

German Institute for Standardisation (Deutsches Institut für Normung)

INTRODUCTION
1 Scope
2 Normative references
3 General information
  3.1 General component description
  3.2 Marking
  3.3 Packaging
  3.4 Process considerations
4 Small outlined J packages (SOJ)
  4.1 Component description
  4.2 Component dimensions
  4.3 Solder joint fillet design
  4.4 Land pattern dimensions
Annex ZA (normative) - Normative references to international
         publications with their corresponding European
         publications
Bibliography

Provides the component and land pattern dimensions for small outline integrated circuits with "J" leads on two sides (SOJ components) used in the reflow soldering process.

DocumentType	Standard
Pages	17
PublisherName	German Institute for Standardisation (Deutsches Institut für Normung)
Status	Current

Standards	Relationship
BS EN 61188-5-4:2007	Identical
I.S. EN 61188-5-4:2007	Identical
IEC 61188-5-4:2007	Identical
EN 61188-5-4 : 2007	Identical
NF EN 61188-5-4 : 2016	Identical