ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-1: REQUIREMENTS FOR SOLDERING FLUXES FOR HIGH-QUALITY INTERCONNECTIONS IN ELECTRONICS ASSEMBLY

Available format(s)

Hardcopy , PDF

Language(s)

German

Published date

01-01-2003

Publisher

German Institute for Standardisation (Deutsches Institut für Normung)

1 Scope and object
2 Normative references
3 Terms and definitions
4 Requirements
  4.1 Conflict
  4.2 Flux classification and testing
5 Quality assurance provisions
  5.1 Responsibility for inspection
  5.2 Classification of inspections
  5.3 Materials inspection
  5.4 Quality inspection
  5.5 Performance inspection
  5.6 Quality conformance
  5.7 Preparation of fluxes for testing
6 Preparation for delivery
  6.1 Preservation-packing and packaging
7 Additional information
  7.1 Flux activity
  7.2 Flux and cleaning relationship
  7.3 Ordering data
Annex A (normative)
Annex ZA (normative) Normative references to international
         publications with their corresponding European
         publications
Bibliography
Figures
Tables

Describes general requirements for the classifications and testing of soldering fluxes for high-quality interconnections in electronics assembly.

DevelopmentNote	Supersedes DIN IEC 91-141-CD (01/2003)
DocumentType	Standard
Pages	22
PublisherName	German Institute for Standardisation (Deutsches Institut für Normung)
Status	Current

Standards	Relationship
BS EN 61190-1-1:2002	Identical
EN 61190-1-1:2002	Identical
NF EN 61190-1-1 : 2002	Identical
IEC 61190-1-1:2002	Identical
I.S. EN 61190-1-1:2002	Identical