DIN EN 61192-2:2003-11
Withdrawn
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Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies (IEC 61192-2:2003); German version EN 61192-2:2003
Hardcopy , PDF
06-26-2022
German
11-01-2003
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 General requirements
4.1 Classification
4.2 Conflict
4.3 Interpretation of requirements
4.4 Antistatic precautions
5 Component preparation processes
6 Solder paste deposition process qualification
6.1 Solder paste characteristics
6.2 Assessment of the process
6.3 Solder paste deposition - Screen and stencil printing
methods - Process control limits
7 Non-conductive adhesive deposition process
7.1 Pot life
7.2 Inter-stage storage and handling
7.3 Adhesive tackiness
7.4 Assessment of the adhesive attachment process
7.5 Adhesive deposition - Syringe dispensing method - Small
components - Process control limits
8 Temporary masking processes
9 Component placement processes
9.1 Assessment of the process
9.2 Discrete components with gull-wing leads
9.3 IC components with flat-ribbon, L- or gull-wing leads on
two sides
9.4 IC components with flat-ribbon, L- or gull-wing leads on
four sides, for example, quad flat packs
9.5 Components with round or flattened (coined) leads
9.6 IC component packages with J-leads on two and four sides,
for example, SOJ, PLCC
9.7 Leadless rectangular components with metallized
terminations
9.8 Components with cylindrical endcap terminations
9.9 Bottom-only terminations on leadless components
9.10 Leadless chip carriers with castellated terminations
9.11 Components with butt leads
9.12 Components with inward L-shaped ribbon leads
9.13 Flat-lug leads on power dissipating components
10 Post-placement rework
10.1 Rework of components placed on solder paste
10.2 Rework of components placed on non-conductive adhesive
11 Adhesive curing
12 Soldering processes
13 Cleaning processes
14 Hand placement and hand soldering, including hand
rework/repair
15 Electrical test
Annex A (normative)
A.1 Introduction
A.2 Example solder fillets and alignment: flat-ribbon, L- and
gull-wing leads
A.3 Example solder fillets and alignment: round or flattened
(coined) leads
A.4 Example solder fillets and alignment: J-leads
A.5 Example solder fillets and alignment: rectangular or
square end leadless components
A.6 Example solder fillets and alignment: cylindrical end cap
terminations, for example, MELFs
A.7 Example solder fillets and alignment: bottom-only
terminations on leadless components
A.8 Example solder fillets and alignment: leadless chip
carriers with castellated terminations
A.9 Example solder fillets and alignment: butt joints
A.10 Example solder fillets and alignment: inward L-shaped
flat ribbon leads
A.11 Example solder fillets and alignment: flat-lug leads on
power dissipating components
Figures
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