DIN EN 61249-8-8:1998-01
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The latest, up-to-date edition.
MATERIALS FOR INTERCONNECTION STRUCTURES - PART 8: SECTIONAL SPECIFICATION SET FOR NON-CONDUCTIVE FILMS AND COATINGS; SECTION 8: TEMPORARY POLYMER COATINGS
Hardcopy , PDF
German
01-01-1998
Gives requirements for qualification of temporary solder resist coatings, known as masks as they are easily removable. Peelable solder masks are for screen printing to areas of a completed printed board or panel before shipment, so as to protect areas of the board or panel during processes by the board assembler. Mainly used for protection of keypad contacts during fluxing and mass soldering.
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