Connectors for frequencies below 3 MHz for use with printed boards - Part 12: Detail specification for dimensions, general requirements and tests for a range of sockets designed for use with integrated circuits

Published date

02-26-1998

Publisher

European Committee for Standards - Electrical

1 Scope
2 Normative references
3 IEC type designation
4 Common features
5 Dimensions
6 Characteristics
7 Test schedule
8 Dual-in-line sockets with solder termination for
    through-board insertion (standard type)
9 Dual-in-line sockets with solderless wire wrapping
    terminations for through-board insertion (standard type)
10 Dual-in-line sockets with solder terminations for
    through-board insertion (low-profile type)
11 Dual-in-line sockets with solderless wire wrapping
    terminations for through-board insertion (low-profile type)
12 Individual contact retention force gauge
13 Socket gauges
Annex ZA (normative) Normative references to international
publications with their corresponding European publications

Covers dimensions, general requirements and tests for a range of sockets designed for use with integrated circuits in dual-in-line format.

Committee	SR 48B
DocumentType	Standard
PublisherName	European Committee for Standards - Electrical
Status	Current

Standards	Relationship
NF EN 60603-12 : 1998	Identical
IEC 60603-12:1992	Identical
NBN EN 60603-12 : 1998	Identical
NEN EN IEC 60603-12 : 1998	Identical
PN EN 60603-12 : 2002	Identical
SN EN 60603-12 : 1998	Identical
UNE-EN 60603-12:1998	Identical
BS EN 60603-12:1998	Identical
CEI EN 60603-12 : 2001	Identical
DIN EN 60603-12:1998-07	Identical

IEC 60512-6:1984	Electromechanical components for electronic equipment; basic testing procedures and measuring methods. Part 6: Climatic tests and soldering tests
IEC 60512-7:1993	Electromechanical components for electronic equipment; basic testing procedures and measuring methods - Part 7: Mechanical operating tests and sealing tests
IEC 60097:1991	Grid systems for printed circuits
IEC 60191-2:2012 DB	Mechanical standardization of semiconductor devices - Part 2: Dimensions
ISO 468:1982	Surface roughness — Parameters, their values and general rules for specifying requirements
IEC 60512-4:1976	Electromechanical components for electronic equipment; basic testing procedures and measuring methods. Part 4: Dynamic stress tests
IEC 60512-5:1992	Electromechanical components for electronic equipment; basic testing procedures and measuring methods - Part 5: Impact tests (free components), static load tests (fixed components), endurance tests and overload tests
IEC 60512-3:1976	Electromechanical components for electronic equipment; basic testing procedures and measuring methods. Part 3: Current-carrying capacity tests