SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 40: BOARD LEVEL DROP TEST METHOD USING A STRAIN GAUGE

Published date

09-02-2011

Publisher

European Committee for Standards - Electrical

FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Test equipment
5 Test procedure
6 Test method
7 Summary
Annex A (normative) - Drop impact test method
        using test rod
Annex B (informative) - An example of strain gauge
        attachment procedure
Annex ZA (normative) - Normative references to
         international publications with their
         corresponding European publications

Provides a procedure to evaluate and compare drop performance of a surface mount semiconductor device for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure.

Committee	SR 47
DocumentType	Test Method
PublisherName	European Committee for Standards - Electrical
Status	Current

Standards	Relationship
IEC 60749-40:2011	Identical
NF EN 60749-40 : 2012	Identical
NBN EN 60749-40 : 2011	Identical
NEN EN IEC 60749-40 : 2011	Identical
I.S. EN 60749-40:2011	Identical
PN EN 60749-40 : 2012	Identical
UNE-EN 60749-40:2011	Identical
BS EN 60749-40:2011	Identical
CEI EN 60749-40 : 2012	Identical
DIN EN 60749-40:2012-02	Identical

IEC 60749-37:2008	Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
EN 60749-37:2008	Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer