EN 60749-43:2017

Superseded

Semiconductor devices - Mechanical and climatic test methods - Part 43: Guidelines for IC reliability qualification plans

Superseded date

02-05-2022

Published date

09-01-2017

Publisher

European Committee for Standards - Electrical

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 Product categories and applications
5 Failure
6 Reliability test
7 Stress test methods
8 Supplementary tests
9 Summary table of assumptions
10 Summary
Bibliography
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications

IEC 60749-43:2017 gives guidelines for reliability qualification plans of semiconductor integrated circuit products (ICs). This document is not intended for military- and space-related applications.

Committee	CLC/SR 47
DocumentType	Standard
PublisherName	European Committee for Standards - Electrical
Status	Superseded
SupersededBy	EN IEC 63287-1:2021

Standards	Relationship
BS EN 60749-43:2017	Identical
NF EN 60749-43 : 2017	Identical
I.S. EN 60749-43:2017	Identical
IEC 60749-43:2017	Identical
NEN EN IEC 60749-43 : 2017	Identical
UNE-EN 60749-43:2017	Identical
SN EN 60749-43 : 2017	Identical
PN EN 60749-43 : 2018	Identical
CEI EN 60749-43 : 1ED 2018	Identical

IEC 60749-20:2008	Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
IEC 60749-28:2017	Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level
EN 60749-23:2004/A1:2011	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 23: HIGH TEMPERATURE OPERATING LIFE
EN 60749-15:2010/AC:2011	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 15: RESISTANCE TO SOLDERING TEMPERATURE FOR THROUGH-HOLE MOUNTED DEVICES
IEC 60749-21:2011	Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
IEC 60749-25:2003	Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling
IEC 60749-5:2017	Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test
IEC 60749-29:2011	Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test
EN 60749-42:2014	Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage
IEC 60749-11:2002	Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method
EN 60749-29:2011	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 29: LATCH-UP TEST
EN 60749-5:2017	Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test
IEC Q 01 : 5.0	IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ SYSTEM) - BASIC RULES
EN 60749-21:2011	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 21: SOLDERABILITY
IEC 60749-15:2010	Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
IEC 60749-26:2013	Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
IEC 60749-6:2017	Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature
EN 60749-6:2017	Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature
IEC 60749-42:2014	Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage
EN 60749-26:2014	Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
EN 60749-20:2009	Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
IEC 60068-2-1:2007	Environmental testing - Part 2-1: Tests - Test A: Cold
EN 60749-25:2003	Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling
IEC 60749-23:2004+AMD1:2011 CSV	Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
IEC 60068-2-30:2005	Environmental testing - Part 2-30: Tests - Test Db: Damp heat, cyclic (12 h + 12 h cycle)
EN 60749-28:2017	Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level