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CENELEC
EN 62137-1-3:2009

EN 62137-1-3:2009

Current

Current

The latest, up-to-date edition.

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test

Published date

02-20-2009

Publisher

European Committee for Standards - Electrical

FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 General remarks
5 Test equipment and materials
  5.1 Reflow soldering oven
  5.2 Drop impact test equipment
  5.3 Test substrate
  5.4 Solder alloy
  5.5 Solder paste
  5.6 Specimen components
  5.7 Strain gauge
6 Mounting method
7 Test method and procedure, and judgment conditions
  7.1 Test procedure
  7.2 Judgment conditions
8 Items to be included in the test report
9 Items to be given in the product specification
Annex A (normative) - Drop impact test equipment
Annex B (normative) - Test method and procedure
Annex C (informative) - An example of test equipment
        and procedure
Annex D (informative) - An example of strain gauge
        attachment procedure
Bibliography
Annex ZA (normative) - Normative references to international
         publications with their corresponding European
         publications

The test method described in IEC 62137-1-3:2008 applies to solder joints between terminals of surface mounting devices (SMDs) and land patterns on printed wiring boards (PWBs). This test is intended to evaluate the strength of the solder joints of larger sized multi-terminal components and other components in devices (e.g. handheld mobile devices) in the event that the device is dropped. The properties of the solder joints (e.g. solder alloy, substrate, mounted device or design, etc.) are evaluated to assist in improving the strength of the solder joints.

Committee
CLC/SR 91
DocumentType
Standard
PublisherName
European Committee for Standards - Electrical
Status
Current

BS EN 62137-3:2012 Electronics assembly technology Selection guidance of environmental and endurance test methods for solder joints
EN 62878-1-1:2015 Device embedded substrate - Part 1-1: Generic specification - Test methods
BS EN 62137-4:2014 Electronics assembly technology Endurance test methods for solder joint of area array type package surface mount devices
CEI EN 62137-3 : 2012 ELECTRONICS ASSEMBLY TECHNOLOGY - PART 3: SELECTION GUIDANCE OF ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SOLDER JOINTS
BS EN 62878-1-1:2015 Device embedded substrate Generic specification. Test methods
I.S. EN 62137-3:2012 ELECTRONICS ASSEMBLY TECHNOLOGY - PART 3: SELECTION GUIDANCE OF ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SOLDER JOINTS (IEC 62137-3:2011 (EQV))
EN 62137-3:2012 Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints
EN 62137-4:2014/AC:2015 ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES (IEC 62137-4:2014)

IEC 60068-1:2013 Environmental testing - Part 1: General and guidance
IEC 60068-2-27:2008 Environmental testing - Part 2-27: Tests - Test Ea and guidance: Shock
IEC 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
IEC 61249-2-7:2002 Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad
EN 60068-1:2014 Environmental testing - Part 1: General and guidance
EN 61760-1:2006 SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
IEC 61760-1:2006 Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
IEC 60068-2-31:2008 Environmental testing - Part 2-31: Tests - Test Ec: Rough handling shocks, primarily for equipment-type specimens
EN 61249-2-7:2002/corrigendum:2005 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-7: REINFORCED BASE MATERIALS CLAD AND UNCLAD - EPOXIDE WOVEN E-GLASS LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
EN 60068-2-27:2009 Environmental testing - Part 2-27: Tests - Test Ea and guidance: Shock
IEC 61192-1:2003 Workmanship requirements for soldered electronic assemblies - Part 1: General
IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
EN 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
EN 61192-1:2003 Workmanship requirements for soldered electronic assemblies - Part 1: General
EN 60194:2006 Printed board design, manufacture and assembly - Terms and definitions
EN 60068-2-31:2008 ENVIRONMENTAL TESTING - PART 2-31: TESTS - TEST EC: ROUGH HANDLING SHOCKS, PRIMARILY FOR EQUIPMENT-TYPE SPECIMENS

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