EN 62258-6 : 2006
Current
The latest, up-to-date edition.
SEMICONDUCTOR DIE PRODUCTS - PART 6: REQUIREMENTS FOR INFORMATION CONCERNING THERMAL SIMULATION
09-15-2006
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 General
5 Requirements for information for thermal simulation
5.1 Requirements for bare die with or without added
connection structures
5.2 Requirements for minimally-packaged die
5.3 Information on thermal simulation model
Annex ZA (normative) Normative references to
international publications with their
corresponding European publications
Bibliography
Access your standards online with a subscription
Features
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.