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CENELEC
EN 62739-1 : 2013

EN 62739-1 : 2013

Current

Current

The latest, up-to-date edition.

TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 1: EROSION TEST METHOD FOR METAL MATERIALS WITHOUT SURFACE PROCESSING (IEC 62739-1:2013)

Published date

08-30-2013

Publisher

European Committee for Standards - Electrical

FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Test
5 Method of erosion depth measurement (focal depth
  method with optical microscope)
6 Items to be recorded in test report
Annex A (normative) - Specifications of test equipment
        & measurement equipment
Annex B (informative) - Method of estimation of
        maximum erosion depth by extreme value
        statistical analysis
Bibliography
Annex ZA (normative) - Normative references to
         international publications with their
         corresponding European publications

Defines an evaluating test method for the erosion of the metallic materials without surface processing intended to be used for lead-free wave soldering equipment as a solder bath and other components which are in contact with the molten solder.

Committee
SR 91
DocumentType
Test Method
PublisherName
European Committee for Standards - Electrical
Status
Current

BS EN 62739-3:2017 Test method for erosion of wave soldering equipment using molten lead-free solder alloy Selection guidance of erosion test methods
CEI EN 62739-3 : 1ED 2017 TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 3: SELECTION GUIDANCE OF EROSION TEST METHODS
I.S. EN 62739-3:2017 TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 3: SELECTION GUIDANCE OF EROSION TEST METHODS
EN 62739-3:2017 Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test methods

IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
ISO 16143-3:2014 Stainless steels for general purposes Part 3: Wire
EN 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
ISO 16143-2:2014 Stainless steels for general purposes Part 2: Corrosion-resistant semi-finished products, bars, rods and sections
ISO 16143-1:2014 Stainless steels for general purposes Part 1: Corrosion-resistant flat products
IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
EN 61190-1-3:2007/A1:2010 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS
IEC 61190-1-3:2007+AMD1:2010 CSV Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

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