1 Scope
2 Normative references
3 Definitions
4 Conformity levels
5 Specific recommendations - Test and Quality
   5.1 General
   5.2 Wafer map or binning information
   5.3 Photo and thermal sensitive devices
   5.4 Traceability
   5.5 Wafer probing information
6 Specific recommendations - User or assembler related
   issues, techniques, best practice and material selection
   6.1 General
   6.2 Die attach material
   6.3 Bonding method
   6.4 Bond pad surface
   6.5 Bond wire information
   6.6 Power bonds
   6.7 Die substrate connection
   6.8 Peak temperature and duration
   6.9 Unusual material
   6.10 Die coat material, thickness and process
   6.11 Die attach limitations
   6.12 Backside surface roughness
7 Specific recommendations - Handing, including wafer
   saw and pick & place issues, and storage
   7.1 General
   7.2 Saw kerf shape and saw line width
   7.3 Redundancy or programmable fuse areas
   7.4 Fiducials
   7.5 Die identity marking
   7.6 Wafer identity
   7.7 Unusual handling limitations
   7.8 Specific handling precautions when opening
        primary packing containing die
   7.9 Ionic contamination protection
   7.10 Use of de-ionised water
   7.11 Sensitive surface areas
   7.12 Orientation
   7.13 Storage
8 Specific recommendations - Thermal, including
   modelling
   8.1 General
   8.2 Die attach material
9 Specific recommendations - Electrical, including
   simulation
   9.1 General
   9.2 Interconnect methods and dimensions
   9.3 Die substrate connection and method
10 Specific recommendations - Application environment
   10.1 General
   10.2 Photo-sensitivity
   10.3 Optical, photo emitters
   10.4 Radiation tolerance
   10.5 Upscreening concerns
   10.6 Extended temperatures
   10.7 MEMS requirements (chemical, magnetic, mechanical,
        biological etc) and the need to protect other die
11 Summary of information requirements