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GEIA
GEIA GEB 0002 : 2003

GEIA GEB 0002 : 2003

Current

Current

The latest, up-to-date edition.

REDUCING THE RISK OF TIN WHISKER-INDUCED FAILURES IN ELECTRONIC EQUIPMENT

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2003

Publisher

Government Electronics & Information Technology Association

1 Scope
2 Tin Whisker Formation
3 Methods to Reduce the Risk of Tin Whisker-Induced Failures
4 Conclusions
Bibliography

Gives a brief description of tin whisker formation and describes various methods recommended by government and industry to reduce the risk of tin whisker-induced failures in electronic hardware.

Committee
G-12
DocumentType
Standard
Pages
22
PublisherName
Government Electronics & Information Technology Association
Status
Current

ASTM B 545 : 2013 : REDLINE Standard Specification for Electrodeposited Coatings of Tin

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Hardcopy - English
PDF - English
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