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IEC PAS 62647-3 : 1.0
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PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 3: PERFORMANCE TESTING FOR SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES |
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BS PD IEC TS 62647-3 : 2014
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PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 3: PERFORMANCE TESTING FOR SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES |
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GEIA HB 0005-1 : 2006
|
PROGRAM MANAGEMENT/SYSTEMS ENGINEERING GUIDELINES FOR MANAGING THE TRANSITION TO LEAD-FREE ELECTRONICS |
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DD IEC PAS 62647-3 : DRAFT SEP 2011
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PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 3: PERFORMANCE TESTING FOR SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES |
|
DI MGMT 81772 : 0
|
LEAD-FREE CONTROL PLAN (LFCP) |
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IEC TS 62647-3 : 1ED 2014
|
PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 3: PERFORMANCE TESTING FOR SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES |
|
SAE ARP 5890 : 2011
|
GUIDELINES FOR PREPARING RELIABILITY ASSESSMENT PLANS FOR ELECTRONIC ENGINE CONTROLS |
|
ARINC 671 : 2006
|
GUIDANCE FOR THE TRANSITION TO LEAD-FREE SOLDERING, MAINTENANCE, AND REPAIR |
|
SAE AS 12500 : 2018
|
CORROSION PREVENTION AND DETERIORATION CONTROL IN ELECTRONIC COMPONENTS AND ASSEMBLIES |
|
IEC PAS 62647-21 : 1.0
|
PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 21: PROGRAM MANAGEMENT - SYSTEMS ENGINEERING GUIDELINES FOR MANAGING THE TRANSITION TO LEAD-FREE ELECTRONICS |
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IEC TS 62239-1 : 2.0
|
PROCESS MANAGEMENT FOR AVIONICS - MANAGEMENT PLAN - PART 1: PREPARATION AND MAINTENANCE OF AN ELECTRONIC COMPONENTS MANAGEMENT PLAN |
|
GEIA HB 0005-3 : 2008
|
REWORK/REPAIR HANDBOOK TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES IN AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS |
|
GEIA HB 0005-2 : 2007
|
TECHNICAL GUIDELINES FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES |
|
BS PD IEC TS 62647-1 : 2012
|
PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 1: PREPARATION FOR A LEAD-FREE CONTROL PLAN |
|
BS PD IEC TS 62239-1 : 2015
|
PROCESS MANAGEMENT FOR AVIONICS - MANAGEMENT PLAN - PART 1: PREPARATION AND MAINTENANCE OF AN ELECTRONIC COMPONENTS MANAGEMENT PLAN |
|
IEC TS 62647-23 : 1ED 2013
|
PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 23: REWORK AND REPAIR GUIDANCE TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES |
|
BS PD IEC TS 62647-23 : 2013
|
PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 23: REWORK AND REPAIR GUIDANCE TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES |
|
IEC PAS 62647-23 : 1.0
|
PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 23: REWORK AND REPAIR GUIDANCE TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES |
|
BS PD IEC TS 62647-22 : 2013
|
PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 22: TECHNICAL GUIDELINES |
|
IEC TS 62647-22 : 1ED 2013
|
PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 22: TECHNICAL GUIDELINES |
|
IEC PAS 62647-22 : 1.0
|
PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 22: TECHNICAL GUIDELINES |
|
DD IEC PAS 62647-23 : DRAFT AUG 2011
|
PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 23: REWORK AND REPAIR GUIDANCE TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES |
|
NASA KSC STD E 0001 : 2008
|
DESIGN OF ELECTRICAL CONTROL AND MONITORING SYSTEMS, EQUIPMENT (GSE), AND PANELS, STANDARD FOR |
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GEIA STD 0006 : 2008
|
REQUIREMENTS FOR USING ROBOTIC HOT SOLDER DIP TO REPLACE THE FINISH ON ELECTRONIC PIECE PARTS |
|
NASA STD 6016 : 2016
|
STANDARD MATERIALS AND PROCESSES REQUIREMENTS FOR SPACECRAFT |
|
GEIA STD 0005-1 : 2012
|
PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER |
|
EIA STD 4899 : 2017-05
|
REQUIREMENTS FOR AN ELECTRONIC COMPONENTS MANAGEMENT PLAN |
|
GEIA STD 0005-3 : 2013
|
PERFORMANCE TESTING FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC INTERCONNECTS CONTAINING PB-FREE SOLDER AND FINISHES |
|
NASA JSC 66491 : 2013
|
STANDARD FOR JSC LEAD-FREE CONTROL PLANS (LFCP) |