GR 2969 CORE : ISSUE 1

1. Introduction
    1.1 Purpose and Scope
    1.2 Requirements Terminology
    1.3 Requirement Labeling Conventions
2. Ensuring System Reliability
3. Device Quality Levels
    3.1 Normal System Requirements
    3.2 Exceptions
    3.3 Quality Level Determination
4. Requirements for All Products
    4.1 General Requirements
    4.2 Electrical and Mechanical Integrity
    4.3 Administration of Requirements
5. Materials and Finishes Requirements
    5.1 General
    5.2 Materials
    5.3 Finishes
6. Component Requirements
    6.1 Component and Component Manufacturer Qualification
    6.2 Purchase Specifications
    6.3 Lot-to-Lot Quality and Reliabilty Control
    6.4 Feedback and Corrective Action Programs
    6.5 Component Storage and Handling
    6.6 Documentation, Test Data, and Other Component Information
7. Separable Connector Requirements
    7.1 General
    7.2 Two-Part and PB Edge Connectors
    7.3 Component Sockets
    7.4 Insulation Displacement Connectors
    7.5 Zero Insertion Force Connectors
    7.6 Coaxial Connectors
    7.7 Optical Connectors
8. Wire and Cable Requirements
    8.1 Metallic Wire and Cable
    8.2 Optical Fiber and Optical Fiber Cables
9. Bare Printed Board Requirements
    9.1 General
    9.2 Multilayer Printed Boards - General Requirements
    9.3 Printed Boards for Surface Mounting
    9.4 Printed Boards for Backpanels
    9.5 Encapsulated Discrete Wire Interconnection Boards
10. Printed Board Assembly Requirements
    10.1 Materials
    10.2 PBAs - Through-hole Mounted Components
    10.3 PBAs - Surface Mounted Components
    10.4 Backpanel Assemblies
11. Sub-System and System Assembly Requirements
    11.1 General
    11.2 Manufacturing
    11.3 Equipment Modifications
    11.4 Performance
12. Electrostatic Discharge Requirements
    12.1 General
    12.2 Susceptibility
    12.3 ESD Resistance
    12.4 Circuit Pack ESD Test Methods and Requirements
    12.5 ESD Warning Label Requirements
13. Product Identification and Marketing Requirements
    13.1 General
    13.2 Printed Board Assemblies
    13.3 Sub-System and System
14. Packing and Shipping Requirements
    14.1 General
    14.2 Shipping of Board Assemblies
    14.3 Shipping of Sub-Systems and Systems
15 Repair and Modification of Customer Return Units
    15.1 General
    15.2 Marking
    15.3 Repairs
16. Qualification Test Procedures
    16.1 Corrosiveness of Soldering Fluxes
    16.2 Polymeric Coatings and Adhesive Materials Qualification
    16.3 Connector and Socket Lubricant Qualification
    16.4 Qualification of Lap Soldered Modification Wires to PBAs
    16.5 Qualification of Additive Circuitry For Bare PB Modifications
17. Tests and Test Methods
    17.1 General
    17.2 Metal Finishes
    17.3 Bare Printed Boards (PBs)
    17.4 Surface Insulation Resistance Testing
    17.5 Solvent Extract Conductivity Testing
Glossary
References
List of Figures
17-1. Standard Insulation Resistance Test Pattern
17-2. Striped Solder Mask Coated Standard Test Pattern
17-3. Solder Mask Coated Standard Test Pattern
17-4. ESD Susceptibility Symbol
17-5. ESD Protective Symbol
17-6. Etched Copper matrix of pads on the Bottom Layer. The 6 sets of
       lines are labelled A through F
17-7. Modification of A, B C and D Circuitry. Added Conductor
       Providing Daisy Chain Continuity Between the Pads
17-8. Modification of E and F lines. Added Conductor for Insulation I
       Integrity Measurement