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I.S. EN 60749-9:2017

Current

Current

The latest, up-to-date edition.

SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 9: PERMANENCE OF MARKING

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2017

Preview

For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.

Only cited Standards give presumption of conformance to New Approach Directives/Regulations.

National Foreword
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Equipment
5 Safety precautions
6 Procedure
7 Failure criteria
8 Summary
Bibliography

Defines the marks on solid state semiconductor devices will remain legible when subjected to the application and removal of labels or the use of solvents and cleaning solutions commonly used during the removal of solder flux residue from the printed circuit board manufacturing process.

DevelopmentNote
Supersedes I.S. EN 60749. NSAI reissued 2002 PDF dated 19.02.2015 with IEC Corrigenda incorporated. (06/2017)
DocumentType
Standard
Pages
22
PublisherName
National Standards Authority of Ireland
Status
Current
Supersedes

Standards Relationship
EN 60749-9:2017 Identical
NBN EN 60749-9 : 2003 Identical
BS EN 60749-9:2002 Identical
DIN EN 60749-9:2016-09 (Draft) Identical
UNE-EN 60749-9:2003 Identical
NF EN 60749-9 : 2002 Identical
BS EN 60749-9:2017 Identical

IEC 61340-2-3:2016 Electrostatics - Part 2-3: Methods of test for determining the resistance and resistivity of solid materials used to avoid electrostatic charge accumulation
FED-STD-101 Revision C:1980 TEST PROCEDURES FOR PACKAGING MATERIALS

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