PRINTED BOARD ASSEMBLIES - PART 6: EVALUATION CRITERIA FOR VOIDS IN SOLDERED JOINTS OF BGA AND LGA AND MEASUREMENT METHOD

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Hardcopy , PDF

Language(s)

English

Published date

01-01-2010

Publisher

National Standards Authority of Ireland

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FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 Voids in solder joints
5 Measurement
6 Void occupancy
7 Evaluation
Annex A (informative) - Experimental results and simulation of
        voids and decrease of life due to thermal stress
Annex B (informative) - X-ray transmission equipment
Annex C (informative) - Voids in BGA solder ball
Annex D (informative) - Measurement using X-ray transmission
        imaging
Bibliography
Annex ZA (normative) - Normative references to international
         publications with their corresponding European
         publications

Describes the evaluation criteria for voids on the scale of the thermal cycle life, and the measurement method of voids using X-ray observation.

DevelopmentNote	For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
DocumentType	Standard
Pages	44
PublisherName	National Standards Authority of Ireland
Status	Current

Standards	Relationship
EN 61191-6:2010	Identical
IEC 61191-6:2010	Identical

IEC 60068-1:2013	Environmental testing - Part 1: General and guidance
EN 60068-1:2014	Environmental testing - Part 1: General and guidance
IEC 61191-1:2013	Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
IEC 60194:2015	Printed board design, manufacture and assembly - Terms and definitions
IPC 7095 : C	DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BGAS
EN 60194:2006	Printed board design, manufacture and assembly - Terms and definitions
IEC 61190-1-3:2007+AMD1:2010 CSV	Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

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I.S. EN 61191-6:2010

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Table of Contents

Abstract

General Product Information

International Equivalents

Standards Referencing This Book

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