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I.S. EN 62047-14:2012

Current

Current

The latest, up-to-date edition.

SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 14: FORMING LIMIT MEASURING METHOD OF METALLIC FILM MATERIALS (IEC 62047-14:2012 (EQV))

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2012

Preview

For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.

Only cited Standards give presumption of conformance to New Approach Directives/Regulations.

FOREWORD
1 Scope
2 Normative references
3 Terms, definitions and symbols
4 Testing method
5 Test procedure and analysis
6 Test report
Annex A (informative) - Principles of the forming limit
        diagram
Annex B (informative) - Grid marking method
Annex C (informative) - Gripping method
Annex D (informative) - Strain measuring method
Annex ZA (normative) - Normative references to international
         publications with their corresponding European
         publications

Explains definitions and procedures for measuring the forming limit of metallic film materials with a thickness range from 0,5 [mu]m to 300 [mu]m.

DevelopmentNote
For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
DocumentType
Standard
Pages
23
PublisherName
National Standards Authority of Ireland
Status
Current

Standards Relationship
EN 62047-14:2012 Identical

EN 62047-1:2016 Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions
IEC 62047-1:2016 Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions

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