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I.S. EN 62047-15:2015

Withdrawn

Withdrawn

A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 15: TEST METHOD OF BONDING STRENGTH BETWEEN PDMS AND GLASS

Available format(s)

Hardcopy , PDF

Withdrawn date

06-07-2018

Language(s)

English

Published date

07-28-2015

Preview

For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.

Only cited Standards give presumption of conformance to New Approach Directives/Regulations.

FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Testing method
Bibliography
Annex ZA (normative) - Normative references to
         international publications with their
         corresponding European publications

Explains test method for bonding strength between poly dimethyl siloxane (PDMS) and glass.

DevelopmentNote
For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
DocumentType
Standard
Pages
34
PublisherName
National Standards Authority of Ireland
Status
Withdrawn

Standards Relationship
EN 62047-15:2015 Identical

IEC 62047-9:2011 Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS
EN 62047-9:2011 Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS

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