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NSAI
I.S. EN IEC 60749-15:2020

I.S. EN IEC 60749-15:2020

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Current

The latest, up-to-date edition.

Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices (IEC 60749-15:2020)

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

10-12-2020

Publisher

National Standards Authority of Ireland

Preview

For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.

Only cited Standards give presumption of conformance to New Approach Directives/Regulations.

FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Test apparatus
5 Materials
6 Procedure
7 Summary
Bibliography

This part of IEC 60749 describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering.

Committee
TC 47
DocumentType
Test Method
ISBN
978-2-8322-8604-3
Pages
32
ProductNote
The date of any NSAI previous adoption may not match the date of its original CEN/CENELEC document.
PublisherName
National Standards Authority of Ireland
Status
Current
Supersedes

Standards Relationship
IEC 60749-15:2020 Identical
EN IEC 60749-15:2020 Identical

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Hardcopy - English
PDF - English
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