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I.S. EN IEC 61190-1-3:2018

I.S. EN IEC 61190-1-3:2018

Current

Current

The latest, up-to-date edition.

ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

04-10-2018

Publisher

National Standards Authority of Ireland

Preview

For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.

Only cited Standards give presumption of conformance to New Approach Directives/Regulations.

National Foreword
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 Classification
5 Requirements
6 Quality assurance provisions
7 Preparation for delivery - Preservation, packing and packaging
Annex A (informative) - Selection of various alloys
        and fluxes for use in electronic soldering - General
        information concerning IEC 61190-1-3
Annex B (normative) - Lead-free solder alloys
Annex C (informative) - Marking method of solder
        designation for mounted board, used in
        electronic equipment
Bibliography
Annex ZA (normative) - Normative references to
         international publications with their
         corresponding European publications

Describes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for 'special' electronic grade solders.

DevelopmentNote
Supersedes I.S. EN 61190-1-3. For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (04/2018)
DocumentType
Standard
Pages
0
PublisherName
National Standards Authority of Ireland
Status
Current

Standards Relationship
EN IEC 61190-1-3:2018 Identical
IEC 61190-1-3:2007+AMD1:2010 CSV Identical

IEC 61189-5-3:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies
IEC 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
EN 61190-1-1:2002 Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
IEC 61189-5-2:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies
ISO 9454-2:1998 Soft soldering fluxes Classification and requirements Part 2: Performance requirements
ISO 9454-1:2016 Soft soldering fluxes Classification and requirements Part 1: Classification, labelling and packaging
EN 61189-5-4:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies
EN 61189-5-3:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies
IEC 61189-5-4:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies
IEC 61190-1-1:2002 Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
ISO 9453:2014 Soft solder alloys Chemical compositions and forms
EN 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
ISO 1073-1:1976 Alphanumeric character sets for optical recognition Part 1: Character set OCR-A Shapes and dimensions of the printed image
EN 61189-5-2:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies

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Hardcopy - English
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