• There are no items in your cart

I.S. EN ISO 9455-14:2017

Current
Current

The latest, up-to-date edition.

SOFT SOLDERING FLUXES - TEST METHODS - PART 14: ASSESSMENT OF TACKINESS OF FLUX RESIDUES (ISO 9455-14:2017)
Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2017

Preview

For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.

Only cited Standards give presumption of conformance to New Approach Directives/Regulations.

National Foreword
European foreword
Foreword
1 Scope
2 Normative references
3 Terms and definitions
4 Principle
5 Reagents and materials
6 Apparatus
7 Test pieces
8 Procedure
9 Examination of the test piece
10 Expression of results
11 Test report

Defines a qualitative method for the assessment of the tackiness of the residues of a soft soldering flux after a soldering process. Pertains to all fluxes, solder pastes and flux cored solder wires.

DevelopmentNote
Supersedes I.S. EN 29455-14. (10/2017)
DocumentType
Standard
Pages
20
PublisherName
National Standards Authority of Ireland
Status
Current
Supersedes

Standards Relationship
EN ISO 9455-14:2017 Identical
ISO 9455-14:2017 Identical

ISO 197-1:1983 Copper and copper alloys Terms and definitions Part 1: Materials
ISO 9455-2:1993 Soft soldering fluxes Test methods Part 2: Determination of non-volatile matter, ebulliometric method
ISO 9455-1:1990 Soft soldering fluxes — Test methods — Part 1: Determination of non-volatile matter, gravimetric method
ISO 9453:2014 Soft solder alloys Chemical compositions and forms

View more information
US$20.83
Excluding Tax where applicable

Access your standards online with a subscription

Features

  • Simple online access to standards, technical information and regulations.

  • Critical updates of standards and customisable alerts and notifications.

  • Multi-user online standards collection: secure, flexible and cost effective.