Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits - First supplement

Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Superseded date

09-12-2022

Language(s)

English - French, Russian

Published date

01-01-1976

Publisher

International Electrotechnical Committee

Deals with design procedure for dimensions of integrated circuit packages, and rules for mounting integrated circuit packages into carriers.

Committee	TC 47/SC 47D
DocumentType	Standard
Pages	11
PublisherName	International Electrotechnical Committee
Status	Superseded

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