Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits - Second supplement

Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Superseded date

09-12-2022

Language(s)

English - French, Russian

Published date

01-01-1978

Publisher

International Electrotechnical Committee

Completes IEC 60191-3 by defining in a more satisfactory manner the mounted length and width of DIL and QUIL packages and giving recommendations for the bending of terminals of QUIL packages used for the mounting of integrated circuits.It also lists the dimensions permitting the definition of the families of packages of Form 3 and Form 4.

Committee	TC 47/SC 47D
DocumentType	Standard
Pages	10
PublisherName	International Electrotechnical Committee
Status	Superseded

Standards	Relationship
NEN 10191-3 : 91 AMD 2 97	Identical

IEC 61747-1:1998+AMD1:2003 CSV	Liquid crystal and solid-state display devices - Part 1: Generic specification
IEC 60191-6-6:2001	Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)