Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

Amended by

IEC 60191-6-18:2010/COR1:2010

Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Published date

01-07-2010

Publisher

International Electrotechnical Committee

FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Terminal position numbering
5 Nominal package dimension
6 Symbols and drawings
7 Dimensions
8 Recommended BGA variations
Bibliography

IEC 60191-6-18:2010 provides standard outline drawings, dimensions, and recommended variations for all square ball grid array packages (BGA), whose terminal pitch is 1 mm or larger. This standard cancels and replaces IEC/PAS 60191-6-18 published in 2008. This first edition constitutes a technical revision.The contents of the corrigenda of May 2010 and July 2010 have been included in this copy.

Committee	TC 47/SC 47D
DevelopmentNote	Supersedes IEC PAS 60191-6-18. (01/2010) Stability Date: 2020. (09/2017)
DocumentType	Standard
Pages	42
PublisherName	International Electrotechnical Committee
Status	Current
Supersedes	IEC PAS 60191-6-18:2008

Standards	Relationship
NF EN 60191-6-18 : 2010	Identical
NEN EN IEC 60191-6-18 : 2010	Identical
I.S. EN 60191-6-18:2010	Identical
PN EN 60191-6-18 : 2010	Identical
UNE-EN 60191-6-18:2010	Identical
BS EN 60191-6-18:2010	Identical
CEI EN 60191-6-18 : 2011	Identical
EN 60191-6-18:2010	Identical
DIN EN 60191-6-18:2010-08	Identical

IEC 60191-6:2009	Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
IEC 60191-6-5:2001	Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)
IEC 60191-6-2:2001	Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor devices packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
IEC 60191-6-4:2003	Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)

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IEC 60191-6-18:2010

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

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