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IEC 60191-6-19:2010

IEC 60191-6-19:2010

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Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage

Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Language(s)

English - French

Published date

02-25-2010

Publisher

International Electrotechnical Committee

FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Sample
5 Measurement
6 Maximum permissible package warpage at elevated
  temperature
7 Recommended datasheet for the package warpage

IEC 60191-6-19:2010 specifies measurement methods of the package warpage at elevated temperature and the maximum permissible warpages for Ball Grid Array(BGA), Fine-pitch Ball Grid Array (FBGA), and Fine-pitch Land Grid Array (FLGA). This standard cancels and replaces IEC/PAS 60191-6-19 published in 2008. This first edition constitutes a technical revision.

DevelopmentNote
Supersedes IEC PAS 60191-6-19. (02/2010) Stability Date: 2018. (09/2017)
DocumentType
Standard
Pages
25
PublisherName
International Electrotechnical Committee
Status
Current
Supersedes

IEC 60749-20:2008 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
IEC 60191-6-5:2001 Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)
IEC 60191-6-2:2001 Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor devices packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages

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Hardcopy - English - French
PDF - English - French
PDF 3 Users - English - French
PDF 5 Users - English - French
PDF 9 Users - English - French
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