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IEC 60664-3:2003+AMD1:2010 CSV

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

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superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

Insulation coordination for equipment within low-voltage systems - Part 3: Use of coating, potting or moulding for protection against pollution

Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Superseded date

09-12-2022

Language(s)

English, English - French

Published date

08-23-2010

IEC 60664-3:2003+A1:2010 applies to assemblies protected against pollution by the use of coating, potting or moulding, thus allowing a reduction of clearance and creepage distances as described in Part 1 or Part 5. This standard describes the requirements and test procedures for two methods of protection:
- type 1 protection improves the microenvironment of the parts under the protection;
- type 2 protection is considered to be similar to solid insulation.
This standard also applies to all kinds of protected printed boards, including the surface of inner layers of multi-layer boards, substrates and similarly protected assemblies. In the case of multi-layer printed boards, the distances through an inner layer are covered by the requirements for solid insulation in Part 1. This standard refers only to permanent protection. It does not cover assemblies that are subjected to mechanical adjustment or repair. The principles of this standard are applicable to functional, basic, supplementary and reinforced insulation.This consolidated version consists of the second edition (2003) and its amendment 1 (2010). Therefore, no need to order amendment inaddition to this publication. The contents of the corrigendum of November 2010 have been included in this copy.

Committee
TC 109
DocumentType
Standard
Pages
54
PublisherName
International Electrotechnical Committee
Status
Superseded
SupersededBy
Supersedes

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