IEC 60747-1:2006+AMD1:2010 CSV
Current
Current
The latest, up-to-date edition.
Semiconductor devices - Part 1: General
Amended by
Available format(s)
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
Language(s)
English, English - French
Published date
08-23-2010
Publisher
IEC 60747-1:2006+A1:2010 gives the general requirements applicable to the discrete semiconductor devices and integrated circuits covered by the other parts of IEC 60747 and IEC 60748 (see Annex A). This consolidated version consists of the second edition (2006) and its amendment 1 (2010). Therefore, no need to order amendment in addition to this publication.
| Committee |
TC 47
|
| DevelopmentNote |
Supersedes IEC 60147-2A, IEC 60147-0A, IEC 60147-0D, IEC 60147-2H IEC 60147-1A, IEC 60147-2E, IEC 60147-2J and IEC 60147-1G. (07/2004) Also numbered as BIS IS 14901-1. (04/2011) Stability Date: 2020. (10/2012)
|
| DocumentType |
Standard
|
| Pages |
96
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| NEN IEC 60747-1 : 2006 AMD 1 2010 | Identical |
| PN IEC 60747-1 : 2009 | Identical |
| BS IEC 60747-1 : 2006 | Identical |
| NFC 96 001 : 1984 | Identical |
| SAC GB/T 17573 : 1998 | Identical |
| DIN IEC 60747-1:1987-03 | Identical |
| NEN 10747-1 : 1984 | Identical |
| BS EN 62747:2014 | Terminology for voltage-sourced converters (VSC) for high-voltage direct current (HVDC) systems |
| AAMI IEC TIR 60878 : 2003 | GRAPHICAL SYMBOLS FOR ELECTRICAL EQUIPMENT IN MEDICAL PRACTICE |
| BS EN 61747-5:1998 | Liquid crystal and solid-state display devices Environmental, endurance and mechanical test methods |
| 13/30264591 DC : 0 | BS EN 60747-14-6 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-6: SEMICONDUCTOR SENSORS - HUMIDITY SENSOR |
| PD IEC/TR 60878:2015 | Graphical symbols for electrical equipment in medical practice |
| BS EN 62341-1-1:2009 | Organic light emitting diode (OLED) displays Generic specifications |
| 13/30270189 DC : 0 | BS EN 60747-6 - SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 6: THYRISTORS |
| 07/30161967 DC : 0 | BS EN 60747-8 - SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 8: FIELD-EFFECT TRANSISTORS |
| 11/30234042 DC : 0 | BS EN 62595-1-1 ED.1 - LCD BACKLIGHT UNIT - PART 1-1: GENERIC SPECIFICATION |
| I.S. EN 62047-4:2010 | SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 4: GENERIC SPECIFICATION FOR MEMS |
| 08/30180398 DC : 0 | BS EN 60747-16-5 - SEMICONDUCTOR DEVICES - PART 16-5: MICROWAVE INTEGRATED CIRCUITS - OSCILLATORS |
| CEI EN 62341-1-1 : 2011 | ORGANIC LIGHT EMITTING DIODE (OLED) DISPLAYS - PART 1-1: GENERIC SPECIFICATIONS |
| DIN IEC 60747-2:2001-02 | SEMICONDUCTOR DEVICES - DISCRETE DEVICES AND INTEGRATED CIRCUITS - PART 2: RECTIFIER DIODES |
| BS EN 190100:1993 | Harmonized system of quality assessment for electronic components: sectional specification: digital monolithic integrated circuits |
| BS QC 720102:1997 | Blank detail specification for laser diode modules with pigtail for fibre optic systems and subsystems |
| BS IEC 62679-1-1:2014 | Electronic paper displays Terminology |
| BS QC750116(2000) : 2000 | SEMICONDUCTOR DEVICES - DISCRETE DEVICES - MICROWAVE DIODES AND TRANSISTORS - INTEGRATED-CIRCUIT MICROWAVE AMPLIFIERS - BLANK DETAIL SPECIFICATION |
| BS EN 60749:1999 | Semiconductor devices. Mechanical and climatic test methods |
| BS IEC 60747-14.2 : 2000 | SEMICONDUCTOR DEVICES - PART 14-2: SEMICONDUCTOR SENSORS - HALL ELEMENTS |
| BS EN 60747-16-10:2004 | Semiconductor devices Technology Approval Schedule (TAS) for monolithic microwave integrated circuits |
| BS EN 62047-4:2010 | Semiconductor devices. Micro-electromechanical devices Generic specification for MEMS |
| BS EN 60747-16-5:2013 | Semiconductor devices Microwave integrated circuits. Oscillators |
| I.S. EN 60749-34:2010 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 34: POWER CYCLING |
| 14/30311054 DC : 0 | BS EN 60747-4: AMD 1 - SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 4: MICROWAVE DIODES AND TRANSISTORS |
| BS IEC 60747-14.1 : 2010 | SEMICONDUCTOR DEVICES - PART 14-1: SEMICONDUCTOR SENSORS - GENERIC SPECIFICATION FOR SENSORS |
| 07/30172404 DC : DRAFT DEC 2007 | BS EN 62047-9 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 9: WAFER TO WAFER BONDING STRENGTH MEASUREMENT FOR MEMS |
| BS IEC 60748-2:1997 | Semiconductor devices. Integrated circuits Digital integrated circuits |
| BS EN 60749-34:2010 | Semiconductor devices. Mechanical and climatic test methods Power cycling |
| NF EN 62341-1-1 : 2010 | ORGANIC LIGHT EMITTING DIODE (OLED) DISPLAYS - PART 1-1: GENERIC SPECIFICATIONS |
| BS 6493-2.1:1985 | Semiconductor devices. Integrated circuits General |
| CEI EN 60747-16-3 : 2009 | SEMICONDUCTOR DEVICES - PART 16-3: MICROWAVE INTEGRATED CIRCUITS - FREQUENCY CONVERTERS |
| BS IEC 60747-8-4:2004 | Discrete semiconductor devices Metal-oxide semiconductor field-effect transistors (MOSFETs) for power switching applications |
| BS IEC 60747-5-4:2006 | Semiconductor devices. Discrete devices Optoelectronic devices. Semiconductor lasers |
| BS EN 165000-1:1996 | Film and hybrid integrated circuits Generic specification. Capability approval procedure |
| CEI EN 60146-2 : 2001 | SEMICONDUCTOR CONVERTERS - PART 2: SELF-COMMUTATED SEMICONDUCTOR CONVERTERS INCLUDING DIRECT D.C. CONVERTERS |
| CEI EN 60747-15 : 2012 | SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 15: ISOLATED POWER SEMICONDUCTOR DEVICES |
| BS EN 60747-16-3 : 2002 | SEMICONDUCTOR DEVICES - PART 16-3: MICROWAVE INTEGRATED CIRCUITS - FREQUENCY CONVERTERS |
| I.S. EN 62751-1:2014 | POWER LOSSES IN VOLTAGE SOURCED CONVERTER (VSC) VALVES FOR HIGH-VOLTAGE DIRECT CURRENT (HVDC) SYSTEMS - PART 1: GENERAL REQUIREMENTS |
| I.S. EN 60286-4:2013 | PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 4: STICK MAGAZINES FOR ELECTRONIC COMPONENTS ENCAPSULATED IN PACKAGES OF DIFFERENT FORMS (IEC 60286-4:2013 (EQV)) |
| IEC 60747-8:2010 | Semiconductor devices - Discrete devices - Part 8: Field-effect transistors |
| IEC 60417-1:2002 | Graphical symbols for use on equipment - Part 1: Overview and application |
| IEC 61747-5:1998 | Liquid crystal and solid-state display devices - Part 5: Environmental, endurance and mechanical test methods |
| IEC 60749-34:2010 | Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling |
| EN 60747-5-2:2001/A1:2002 | DISCRETE SEMICONDUCTOR DEVICES AND INTEGRATED CIRCUITS - PART 5-2: OPTOELECTRONIC DEVICES - ESSENTIAL RATINGS AND CHARACTERISTICS |
| EN 60747-15:2012 | Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices |
| EN 61747-5:1998 | Liquid crystal and solid-state display devices - Part 5: Environmental, endurance and mechanical test methods |
| EN 60747-5-3:2001/A1:2002 | DISCRETE SEMICONDUCTOR DEVICES AND INTEGRATED CIRCUITS - PART 5-3: OPTOELECTRONIC DEVICES - MEASURING METHODS |
| EN 62747:2014/AC:2015 | TERMINOLOGY FOR VOLTAGE-SOURCED CONVERTERS (VSC) FOR HIGH-VOLTAGE DIRECT CURRENT (HVDC) SYSTEMS (IEC 62747:2014) |
| EN 60286-4:2013 | Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms |
| EN 60749-34:2010 | Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling |
| OVE/ONORM EN 60027-2 : 2007 | LETTER SYMBOLS TO BE USED IN ELECTRICAL TECHNOLOGY - PART 2: TELECOMMUNICATIONS AND ELECTRONICS |
| BS EN 61751:1998 | Laser modules used for telecommunication. Reliability assessment |
| BS EN 61709:2017 | Electric components. Reliability. Reference conditions for failure rates and stress models for conversion |
| BS EN 60417-1:1999 | Graphical symbols for use on equipment Overview and application |
| BS IEC 60747-3:2013 | Semiconductor devices Discrete devices: Signal, switching and regulator diodes |
| BS EN 60146-2:2000 | Semiconductor convertors. General requirements and line commutated convertors Self-commutated semiconductor converters including direct d.c. converters |
| 15/30330421 DC : 0 | BS EN 60747-16-4 ED 1.0/A2 - SEMICONDUCTOR DEVICES - PART 16-4: MICROWAVE INTEGRATED CIRCUITS - SWITCHES |
| 15/30330417 DC : 0 | BS EN 60747-16-3 ED 1.0/A2 - SEMICONDUCTOR DEVICES - PART 16-3: MICROWAVE INTEGRATED CIRCUITS - FREQUENCY CONVERTERS |
| IEC 60747-14-4:2011 | Semiconductor devices - Discrete devices - Part 14-4: Semiconductor accelerometers |
| 07/30164950 DC : 0 | IEC 60747-7 - SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 7: BIPOLAR TRANSISTORS (BTRS) |
| DIN EN 190000:1996-05 | GENERIC SPECIFICATION - MONOLITHIC INTEGRATED CIRCUITS |
| I.S. EN 62747:2014-2015-10 | TERMINOLOGY FOR VOLTAGE-SOURCED CONVERTERS (VSC) FOR HIGH-VOLTAGE DIRECT CURRENT (HVDC) SYSTEMS |
| BS IEC 60747-14-5:2010 | Semiconductor devices Semiconductor sensors. PN-junction semiconductor temperature sensor |
| BS IEC 60747-6:2016 | Semiconductor devices Discrete devices. Thyristors |
| CEI EN 61643-341 : 2002 | COMPONENTS FOR LOW-VOLTAGE SURGE PROTECTIVE DEVICES - PART 341: SPECIFICATION FOR THYRISTOR SURGE SUPPRESSOR (TSS) |
| 06/30153491 DC : DRAFT JULY 2006 | EN 60748-2-20 - SEMICONDUCTOR DEVICES - INTEGRATED CIRCUITS - PART 2-20: DIGITAL INTEGRATED CIRCUITS - FAMILY SPECIFICATION - LOW VOLTAGE INTEGRATED CIRCUITS |
| BS IEC 60748-5:1997 | Semiconductor devices. Integrated circuits Semicustom integrated circuits |
| 07/30170374 DC : DRAFT AUG 2007 | BS EN 61751-2 - LASER MODULES USED FOR TELECOMMUNICATIONS - RELIABILITY ASSESSMENT - PART 2: TECHNICAL REPORT ON LASER MODULE DEGRADATION |
| 15/30310531 DC : 0 | BS EN 61709 ED 3.0 - ELECTRIC COMPONENTS - RELIABILITY - REFERENCE CONDITIONS FOR FAILURE RATES AND STRESS MODELS FOR CONVERSION |
| CEI EN 60747-16-10 : 2005 | SEMICONDUCTOR DEVICES - PART 16-10: TECHNOLOGY APPROVAL SCHEDULE (TAS) FOR MONOLITHIC MICROWAVE INTEGRATED CIRCUITS |
| BS IEC 60747-9:2007 | Semiconductor devices. Discrete devices Insulated-gate bipolar transistors (IGBTs) |
| 02/207672 DC : DRAFT JULY 2002 | IEC 60749-34 ED.1 - POWER CYCLING |
| I.S. HD 60027-2:2003 | LETTER SYMBOLS TO BE USED IN ELECTRICAL TECHNOLOGY - PART 2: TELECOMMUNICATIONS AND ELECTRONICS |
| NF EN 61988-5 : 2010 | PLASMA DISPLAY PANELS - PART 5: GENERIC SPECIFICATION |
| I.S. EN 62572-3:2016 | FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - RELIABILITY STANDARDS - PART 3: LASER MODULES USED FOR TELECOMMUNICATION |
| I.S. EN 60027-2:2007 | LETTER SYMBOLS TO BE USED IN ELECTRICAL TECHNOLOGY - PART 2: TELECOMMUNICATIONS AND ELECTRONICS |
| I.S. EN 60747-16-10:2004 | SEMICONDUCTOR DEVICES - PART 16-10: TECHNOLOGY APPROVAL SCHEDULE (TAS) FOR MONOLITHIC MICROWAVE INTEGRATED CIRCUITS |
| BS EN 60747-16-1 : 2002 | SEMICONDUCTOR DEVICES - PART 16-1: MICROWAVE INTEGRATED CIRCUITS - AMPLIFIERS |
| IEC 62751-1:2014+AMD1:2018 CSV | Power losses in voltage sourced converter (VSC) valves for high-voltage direct current (HVDC) systems - Part 1: General requirements |
| IEC 60747-9:2007 | Semiconductor devices - Discrete devices - Part 9: Insulated-gate bipolar transistors (IGBTs) |
| CEI EN 61988-5 : 2011 | PLASMA DISPLAY PANELS - PART 5: GENERIC SPECIFICATION |
| CEI EN 61747-1 : 2004 | LIQUID CRYSTAL AND SOLID-STATE DISPLAY DEVICES - PART 1: GENERIC SPECIFICATION |
| BS IEC 60747-7:2010 | Semiconductor devices. Discrete devices Bipolar transistors |
| IEC 61747-1-1:2014 | Liquid crystal display devices - Part 1-1: Generic - Generic specification |
| I.S. EN 60146-1-1:2010 | SEMICONDUCTOR CONVERTERS - GENERAL REQUIREMENTS AND LINE COMMUTATED CONVERTERS - PART 1-1: SPECIFICATION OF BASIC REQUIREMENTS |
| EN 61709:2017 | Electric components - Reliability - Reference conditions for failure rates and stress models for conversion |
| IEC 60747-7-5:2005 | Semiconductor devices - Discrete devices - Part 7-5: Bipolar transistors for power switching applications |
| IEC 60747-7:2010 | Semiconductor devices - Discrete devices - Part 7: Bipolar transistors |
| I.S. EN 60747-16-1:2002 | SEMICONDUCTOR DEVICES - PART 16-1: MICROWAVE INTEGRATED CIRCUITS - AMPLIFIERS |
| IEC 60747-14-3:2009 | Semiconductor devices - Part 14-3: Semiconductor sensors - Pressure sensors |
| IEC 60748-1:2002 | Semiconductor devices - Integrated circuits - Part 1: General |
| IEC 60747-4-2:2000 | Semiconductor devices - Discrete devices - Part 4-2: Microwave diodes and transistors - Integrated-circuit microwave amplifiers - Blank detail specification |
| IEC 60748-23-2:2002 | Semiconductor devices - Integrated circuits - Part 23-2: Hybrid integrated circuits and film structures - Manufacturing line certification - Internal visual inspection and special tests |
| IEC 60286-4:2013 | Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms |
| IEC 60749:1996+AMD1:2000+AMD2:2001 CSV | Semiconductor devices - Mechanical and climatic test methods |
| IEC 62047-5:2011 | Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches |
| IEC 60747-5-3:1997+AMD1:2002 CSV | Discrete semiconductor devices and integrated circuits - Part 5-3: Optoelectronic devices - Measuring methods |
| DIN EN 60146-2 : 2001 | SEMICONDUCTOR CONVERTORS - PART 2: SELF-COMMUTATED SEMICONDUCTOR CONVERTORS INCLUDING DIRECT D.C. CONVERTORS |
| VDE 0558-2 : 2001 | SEMICONDUCTOR CONVERTORS - PART 2: SELF-COMMUTATED SEMICONDUCTOR CONVERTORS INCLUDING DIRECT D.C. CONVERTORS |
| BS 6493-1.5:1992 | Semiconductor devices. Discrete devices Recommendations for optoelectronic devices - Section 5: Recommendations for optoelectronic devices |
| BS CECC 90300:1988 | Harmonized system of quality assessment for electronic components. Sectional specification: interface monolithic integrated circuits |
| I.S. EN 61751:1999 | LASER MODULES USED FOR TELECOMMUNICATION - RELIABILITY ASSESSMENT |
| 09/30209939 DC : 0 | BS EN 60749-34 - SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 34: POWER CYCLING |
| 01/206102 DC : DRAFT JUL 2001 | IEC 60747-8-12 ED.1 - SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 8-12: 8-12: METAL-OXIDE-SEMICONDUCTOR FIELD-EFFECT TRANSISTORS POWER SWITCHING APPLICATIONS |
| BS EN 62595-1-1:2013 | LCD backlight unit Generic specification |
| 07/30162213 DC : 0 | BS EN 60747-15 - SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 15: ISOLATED POWER SEMICONDUCTOR DEVICES |
| 12/30251416 DC : 0 | BS EN 62747 - TERMINOLOGY FOR VOLTAGE-SOURCED CONVERTERS (VSC) FOR HVDC SYSTEMS |
| 08/30181401 DC : DRAFT APR 2008 | BS IEC 60747-14-1 - SEMICONDUCTOR DEVICES - PART 14-1: SEMICONDUCTOR SENSORS - GENERIC SPECIFICATION FOR SENSORS |
| BS IEC 60747-14-4:2011 | Semiconductor devices. Discrete devices Semiconductor accelerometers |
| I.S. EN 60747-15:2012 | SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 15: ISOLATED POWER SEMICONDUCTOR DEVICES (IEC 60747-15:2010 (EQV)) |
| 06/30151323 DC : DRAFT JUN 2006 | BS IEC 61988-5 - PLASMA DISPLAY PANELS - PART 5: GENERIC SPECIFICATION |
| 15/30323391 DC : 0 | BS EN 62572-3 - FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - RELIABILITY STANDARDS PART 3: LASER MODULES USED FOR TELECOMMUNICATION |
| BS IEC 60747-16.2 : 2001 | SEMICONDUCTOR DEVICES - PART 16-2: MICROWAVE INTEGRATED CIRCUITS - FREQUENCY PRESCALERS |
| 13/30277892 DC : 0 | BS EN 62572-3 ED 2.0 - FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - RELIABILITY STANDARDS - PART 3: LASER MODULES USED FOR TELECOMMUNICATION |
| BS IEC 60747-4 : 2007 | SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 4: MICROWAVE DIODES AND TRANSISTORS |
| I.S. EN 62148-15:2014 | FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PACKAGE AND INTERFACE STANDARDS - PART 15: DISCRETE VERTICAL CAVITY SURFACE EMITTING LASER PACKAGES |
| 11/30252972 DC : 0 | BS EN 61747-10-1 - LIQUID CRYSTAL DISPLAY DEVICES - PART 10-1: ENVIRONMENTAL, ENDURANCE AND MECHANICAL TEST METHODS - MECHANICAL |
| CEI EN 60749-34 : 2012 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 34: POWER CYCLING |
| BS EN 62751-1:2014 | Power losses in voltage sourced converter (VSC) valves for high-voltage direct current (HVDC) systems General requirements |
| 07/30172155 DC : DRAFT OCT 2007 | BS EN 62047-5 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 5: RF MEMS SWITCHES |
| 02/205627 DC : DRAFT APR 2002 | IEC 60747-14-4. ED.1.0 - DISCRETE SEMICONDUCTOR DEVICES - PART 14-4: SEMICONDUCTOR ACCELEROMETERS |
| BS 6062-4(1991) : 1991 AMD 9687 | PACKAGING OF ELECTRONIC COMPONENTS FOR AUTOMATIC HANDLING - SPECIFICATION FOR STICK MAGAZINES FOR DUAL-IN-LINE PACKAGES |
| IEC 60747-3:2013 | Semiconductor devices - Part 3: Discrete devices: Signal, switching and regulator diodes |
| BS IEC 60748-23-1:2002 | Semiconductor devices. Integrated circuits. Hybrid integrated circuits and film structures. Manufacturing line certification Generic specification |
| BS IEC 62341-1-1 : 2009 | ORGANIC LIGHT EMITTING DIODE (OLED) DISPLAYS - PART 1-1: GENERIC SPECIFICATIONS |
| BS EN 120000:1996 | Harmonized system of quality assessment for electronic components. General specification: semiconductor optoelectronic and liquid crystal devices |
| BS QC 763000(1990) : AMD 6754 | HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS. FILM AND HYBRID FILM INTEGRATED CIRCUITS. GENERIC SPECIFICATION |
| BS IEC 60748-11:2000 | Semiconductor devices. Integrated circuits Sectional specification for semiconductor integrated circuits excluding hybrid circuits |
| 05/30137514 DC : DRAFT AUG 2005 | IEC 60747-14-4 - DISCRETE SEMICONDUCTOR DEVICES - PART 14-4: SEMICONDUCTOR ACCELEROMETERS |
| BS EN 60747-15:2012 | Semiconductor devices. Discrete devices Isolated power semiconductor devices |
| I.S. EN 62751-2:2014 | POWER LOSSES IN VOLTAGE SOURCED CONVERTER (VSC) VALVES FOR HIGH-VOLTAGE DIRECT CURRENT (HVDC) SYSTEMS - PART 2: MODULAR MULTILEVEL CONVERTERS |
| 17/30343732 DC : 0 | BS EN 60747-9 - SEMICONDUCTOR DEVICES - PART 9: DISCRETE DEVICES - INSULATED-GATE BIPOLAR TRANSISTORS (IGBTS) |
| IEC 60747-14-2:2000 | Semiconductor devices - Part 14-2: Semiconductor sensors - Hall elements |
| BS IEC 61747-1 : 1998 AMD 10788 | LIQUID CRYSTAL AND SOLID-STATE DISPLAY DEVICES - GENERIC SPECIFICATION |
| BS QC790100(1991) : 1991 AMD 10586 | HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - SEMICONDUCTOR DEVICES - SECTIONAL SPECIFICATION FOR SEMICONDUCTOR INTEGRATED CIRCUITS EXCLUDING HYBRID CIRCUITS |
| IEC 61709:2017 RLV | Electric components - Reliability - Reference conditions for failure rates and stress models for conversion |
| IEC 60747-8-4:2004 | Discrete semiconductor devices - Part 8-4: Metal-oxide-semiconductor field-effect transistors (MOSFETs) for power switching applications |
| PD IEC/TR 60146-1-2:2011 | Semiconductor converters. General requirements and line commutated converters Application guide |
| EN 62751-1:2014 | Power losses in voltage sourced converter (VSC) valves for high-voltage direct current (HVDC) systems - Part 1: General requirements |
| EN 60747-16-4:2004/A2:2017 | SEMICONDUCTOR DEVICES - PART 16-4: MICROWAVE INTEGRATED CIRCUITS - SWITCHES (IEC 60747-16-4:2004/A2:2017) |
| I.S. EN 60417-1:2002 | GRAPHICAL SYMBOLS FOR USE ON EQUIPMENT - PART 1: OVERVIEW AND APPLICATION |
| IEC TR 60878:2015 | Graphical symbols for electrical equipment in medical practice |
| PD IEC/TR 60601-4-3:2015 | Medical electrical equipment Guidance and interpretation. Considerations of unaddressed safety aspects in the third edition of IEC 60601-1 and proposals for new requirements |
| BS EN 62751-2:2014 | Power losses in voltage sourced converter (VSC) valves for high-voltage direct current (HVDC) systems Modular multilevel converters |
| IEC 62679-1-1:2014 | Electronic paper displays - Part 1-1: Terminology |
| IEC 60748-11:1990 | Semiconductor devices - Integrated circuits - Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits |
| IEC 60747-5-4:2006 | Semiconductor devices - Discrete devices - Part 5-4: Optoelectronic devices - Semiconductor lasers |
| IEC 61709 : 3.0 | ELECTRIC COMPONENTS - RELIABILITY - REFERENCE CONDITIONS FOR FAILURE RATES AND STRESS MODELS FOR CONVERSION |
| IEC 60747-10:1991 | Semiconductor devices - Part 10: Generic specification for discrete devices and integrated circuits |
| I.S. EN 61747-5:1999 | LIQUID CRYSTAL AND SOLID-STATE DISPLAY DEVICES - PART 5: ENVIRONMENTAL, ENDURANCE AND MECHANICAL TEST METHODS |
| IEC 60748-4:1997 | Semiconductor devices - Integrated circuits - Part 4: Interface integrated circuits |
| IEC 61988-5:2009 | Plasma display panels - Part 5: Generic specification |
| EN 61643-341:2001 | Components for low-voltage surge protective devices - Part 341: Specification for thyristor surge suppressors (TSS) |
| EN 60747-16-5:2013 | Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators |
| BS IEC 60747-14.3 : 2009 | SEMICONDUCTOR DEVICES - PART 14-3: SEMICONDUCTOR SENSORS - PRESSURE SENSORS |
| 07/30169405 DC : 0 | BS EN 60747-16-3 AMD1 - SEMICONDUCTOR DEVICES - PART 16-3: MICROWAVE INTEGRATED CIRCUITS - FREQUENCY CONVERTERS |
| 12/30268616 DC | BS EN 61747-1-1. Liquid crystal display devices. Generic. Generic specification |
| 12/30244653 DC : 0 | BS EN 62679-1 - ELECTRONIC PAPER DISPLAY - PART 1:TERMINOLOGY AND GENERIC SPECIFICATION |
| 01/205674 DC : DRAFT JUL 2001 | IEC 60747-16-10 ED.1 - TECHNOLOGY APPROVAL SCHEDULE FOR MONOLITHIC MICROWAVE INTEGRATED CIRCUITS |
| BS EN 60747-5-2:2001 | Discrete semiconductor devices and integrated circuits. Optoelectronic devices Essential ratings and characteristics |
| 13/30287348 DC : 0 | BS EN 60747-2 - SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 2: RECTIFIER DIODES |
| 11/30252977 DC : 0 | BS EN 61747-10-2 - LIQUID CRYSTAL DISPLAY DEVICES - PART 10-2: ENVIRONMENTAL, ENDURANCE AND MECHANICAL TEST METHODS - ENVIRONMENTAL AND ENDURANCE |
| BS IEC 60747-8:2000 | Discrete semiconductor devices and integrated circuits Field-effect transistors - Additional ratings and characteristics and amds in the measuring methods for power switching field effect transistors. |
| 13/30277884 DC : 0 | BS EN 62148-15 ED 2.0 - FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PACKAGE AND INTERFACE STANDARDS - PART 15: DISCRETE VERTICAL CAVITY SURFACE EMITTING LASER PACKAGES |
| 17/30355780 DC : DRAFT SEP 2017 | BS EN 60747-18-2 - SEMICONDUCTOR DEVICES - PART 18-2: SEMICONDUCTOR BIO SENSORS - EVALUATION PROCESS OF LENS-FREE CMOS PHOTONIC ARRAY SENSOR PACKAGE MODULE |
| BS EN 62572-3:2016 | Fibre optic active components and devices. Reliability standards Laser modules used for telecommunication |
| BS EN 60747-5-3:2001 | Discrete semiconductor devices and integrated circuits. Optoelectronic devices Measuring methods |
| 12/30253588 DC : 0 | BS EN 62751-2 - DETERMINATION OF POWER LOSSES IN VOLTAGE SOURCED CONVERTER (VSC) VALVES FOR HVDC SYSTEMS - PART 2: MODULAR MULTILEVEL CONVERTERS |
| 13/30264600 DC : 0 | BS EN 60747-14-8 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-8: SEMICONDUCTOR SENSORS - CAPACITIVE DEGRADATION SENSOR OF LIQUID |
| BS EN 62047-5:2011 | Semiconductor devices. Micro-electromechanical devices RF MEMS switches |
| CEI EN 60747-16-1 : 2009 | SEMICONDUCTOR DEVICES - PART 16-1: MICROWAVE INTEGRATED CIRCUITS - AMPLIFIERS |
| BS QC 760200:1992 | Harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Sectional specification for film integrated circuits and hybrid film integrated circuits: capability approval |
| BS EN 61988-5:2009 | Plasma display panels Generic specification |
| 06/30156472 DC : DRAFT SEP 2006 | BS EN 60146-1-1 - SEMICONDUCTOR CONVERTERS - GENERAL REQUIREMENTS AND LINE COMMUTATED CONVERTERS - PART 1-1: SPECIFICATION OF BASIC REQUIREMENTS |
| BS IEC 60748-1:2002 | Semiconductor devices. Integrated circuits General |
| BS IEC 60747-7-5:2005 | Semiconductor devices. Discrete devices Bipolar transistors for power switching applications |
| 14/30311058 DC : 0 | BS EN 60747-16-1:AMD 2 - SEMICONDUCTOR DEVICES - PART 16-1: MICROWAVE INTEGRATED CIRCUITS - AMPLIFIERS |
| 04/30118741 DC : DRAFT AUG 2004 | IEC 60747-4 ED 2 - SEMICONDUCTOR DEVICES DISCRETE DEVICES - PART 4: MICROWAVE DIODES AND TRANSISTORS |
| BS EN 61643-341:2001 | Low voltage surge protective devices Specification for thyristor surge suppressors (TSS) |
| 04/30113287 DC : DRAFT MAY 2004 | IEC 60747-9 ED.2 - SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 9: INSULATED GATE BIPOLAR TRANSISTORS (IGBTS) |
| 04/30114936 DC : DRAFT JUN 2004 | EN 50439 - RAILWAY APPLICATIONS - RELIABILITY TESTS FOR HIGH POWER SEMICONDUCTORS DEVICES - PART 1: STANDARD BASE-PLATE MODULES |
| BS EN 62148-15:2014 | Fibre optic active components and devices. Package and interface standards Discrete vertical cavity surface emitting laser packages |
| NF EN 60027-2 : 2007 | LETTER SYMBOLS TO BE USED IN ELECTRICAL TECHNOLOGY - PART 2: TELECOMMUNICATIONS AND ELECTRONICS |
| BS EN 60286-4:2013 | Packaging of components for automatic handling Stick magazines for electronic components encapsulated in packages of different forms |
| BS EN 61747-1:2000 | Liquid crystal and solid-state display devices Generic specification |
| CEI EN 60286-4 : 2014 | PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 4: STICK MAGAZINES FOR ELECTRONIC COMPONENTS ENCAPSULATED IN PACKAGES OF DIFFERENT FORMS |
| IEC 60747-14-5:2010 | Semiconductor devices - Part 14-5: Semiconductor sensors - PN-junction semiconductor temperature sensor |
| I.S. EN 60146-2:2003 | SEMICONDUCTOR CONVERTERS - PART 2: SELF-COMMUTATED SEMICONDUCTOR CONVERTERS INCLUDING DIRECT D.C. CONVERTERS |
| I.S. EN 62047-5:2011 | SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 5: RF MEMS SWITCHES |
| I.S. EN 61709:2017 | ELECTRIC COMPONENTS - RELIABILITY - REFERENCE CONDITIONS FOR FAILURE RATES AND STRESS MODELS FOR CONVERSION |
| I.S. EN 165000-1:1998 | FILM AND HYBRID INTEGRATED CIRCUITS - PART 1: GENERIC SPECIFICATION CAPABILITY APPROVAL PROCEDURE |
| I.S. EN 60747-16-5:2013 | SEMICONDUCTOR DEVICES - PART 16-5: MICROWAVE INTEGRATED CIRCUITS - OSCILLATORS (IEC 60747-16-5:2013 (EQV)) |
| HD 60027-2 : 200S1 | LETTER SYMBOLS TO BE USED IN ELECTRICAL TECHNOLOGY - PART 2: TELECOMMUNICATIONS AND ELECTRONICS |
| IEC 60747-2:2016 | Semiconductor devices - Part 2: Discrete devices - Rectifier diodes |
| CEI EN 60146-1-1 : 2013 | SEMICONDUCTOR CONVERTERS - GENERAL REQUIREMENTS AND LINE COMMUTATED CONVERTERS - PART 1-1: SPECIFICATION OF BASIC REQUIREMENTS |
| I.S. EN 62341-1-1:2009 | ORGANIC LIGHT EMITTING DIODE (OLED) DISPLAYS - PART 1-1: GENERIC SPECIFICATIONS |
| IEC TR 60146-1-2:2011 | Semiconductor converters - General requirements and line commutated converters - Part 1-2: Application guide |
| IEC 61747-10-2:2014 | Liquid crystal display devices - Part 10-2: Environmental, endurance and mechanical test methods - Environmental and endurance |
| IEC 60747-16-2:2001+AMD1:2007 CSV | Semiconductor devices - Part 16-2: Microwave integrated circuits - Frequency prescalers |
| IEC 60747-4:2007+AMD1:2017 CSV | Semiconductor devices - Discrete devices - Part 4: Microwave diodes and transistors |
| IEC 60747-6:2016 | Semiconductor devices - Part 6: Discrete devices - Thyristors |
| EN 62751-2:2014 | Power losses in voltage sourced converter (VSC) valves for high-voltage direct current (HVDC) systems - Part 2: Modular multilevel converters |
| EN 60747-5-1:2001/A2:2002 | DISCRETE SEMICONDUCTOR DEVICES AND INTEGRATED CIRCUITS - PART 5-1: OPTOELECTRONIC DEVICES - GENERAL |
| IEC 61751:1998 | Laser modules used for telecommunication - Reliability assessment |
| IEC 62595-1-1:2013 | LCD backlight unit - Part 1-1: Generic specification |
| IEC 60747-16-3:2002+AMD1:2009+AMD2:2017 CSV | Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters |
| IEC 62572-3:2016 | Fibre optic active components and devices - Reliability standards - Part 3: Laser modules used for telecommunication |
| IEC 61747-1:1998+AMD1:2003 CSV | Liquid crystal and solid-state display devices - Part 1: Generic specification |
| IEC 60747-16-4:2004+AMD1:2009+AMD2:2017 CSV | Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches |
| IEC 62341-1-1:2009 | Organic light emitting diode (OLED) displays - Part 1-1: Generic specifications |
| UNE-EN 60749-34:2011 | Semiconductor devices - Mechanical and climatic test methods -- Part 34: Power cycling |
| IEC 60146-2:1999 | Semiconductor converters - Part 2: Self-commutated semiconductor converters including direct d.c. converters |
| IEC 60146-1-1:2009 | Semiconductor converters - General requirements and line commutated converters - Part 1-1: Specification of basic requirements |
| IEC 60747-16-1:2001+AMD1:2007+AMD2:2017 CSV | Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers |
| IEC 62751-2:2014 | Power losses in voltage sourced converter (VSC) valves for high-voltage direct current (HVDC) systems - Part 2: Modular multilevel converters |
| IEC 62148-15:2014 | Fibre optic active components and devices - Package and interface standards - Part 15: Discrete vertical cavity surface emitting laser packages |
| IEC 62047-4:2008 | Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS |
| IEC 60747-5-2:1997+AMD1:2002 CSV | Discrete semiconductor devices and integrated circuits - Part 5-2: Optoelectronic devices - Essential ratings and characteristics |
| EN 61751:1998 | Laser modules used for telecommunication - Reliability assessment |
| EN 62047-4:2010 | Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS |
| EN 62595-1-1:2013 | LCD backlight unit - Part 1-1: Generic specification |
| CEI EN 62595-1-1 : 2014 | LCD BACKLIGHT UNIT - PART 1-1: GENERIC SPECIFICATION |
| 07/30164953 DC : 0 | IEC 60747-14-5 - SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 14-5: SEMICONDUCTOR SENSORS - PN-JUNCTION SEMICONDUCTOR TEMPERATURE SENSOR |
| DIN IEC 60747-5:1988-12 | SEMICONDUCTOR DEVICES - DISCRETE DEVICES AND INTEGRATED CIRCUITS - PART 5: OPTOELECTRONIC DEVICES |
| 05/30135225 DC : DRAFT JUN 2005 | IEC 60749-9 ED 2 - SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 9: INSULATED-GATE BIPOLAR TRANSISTORS (IGBTS) |
| 08/30181404 DC : DRAFT APR 2008 | BS IEC 60747-14-3 - SEMICONDUCTOR DEVICES - PART 14-3: SEMICONDUCTOR SENSORS - PRESSURE SENSORS |
| CEI EN 60747-16-5 : 2014 | SEMICONDUCTOR DEVICES - PART 16-5: MICROWAVE INTEGRATED CIRCUITS - OSCILLATORS |
| CEI EN 62047-4 : 2011 | SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 4: GENERIC SPECIFICATION FOR MEMS |
| 13/30264596 DC : 0 | BS EN 60747-14-7 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-7: SEMICONDUCTOR SENSORS - FLOW METER |
| PD IEC/TR 62572-2:2008 | Fibre optic active components and devices. Reliability standards Laser module degradation |
| EN 62148-15:2014 | Fibre optic active components and devices - Package and interface standards - Part 15: Discrete vertical cavity surface emitting laser packages |
| 12/30252799 DC : 0 | BS EN 62751-1-1 - DETERMINATION OF POWER LOSSES IN VOLTAGE SOURCED CONVERTERS (VSC) FOR HV DC SYSTEMS - PART 1: GENERAL REQUIREMENTS |
| 09/30183239 DC : 0 | BS EN 62572-3 - FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - RELIABILITY STANDARDS - PART 3: LASER MODULES USED FOR TELECOMMUNICATION |
| BS QC 760100:1991 | Harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Sectional specification for film and hybrid integrated circuits: qualification approval |
| BS EN 60747-5-1:2001 | Discrete semiconductor devices and integrated circuits. Optoelectronic devices General |
| BS QC 750000(1986) : 1986 | HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - DISCRETE SEMICONDUCTOR DEVICES - SECTIONAL SPECIFICATION |
| EN 60747-16-3:2002/A2:2017 | SEMICONDUCTOR DEVICES - PART 16-3: MICROWAVE INTEGRATED CIRCUITS - FREQUENCY CONVERTERS (IEC 60747-16-3:2002/A2:2017) |
| 07/30169412 DC : 0 | BS EN 60747-16-4 AMD1 - SEMICONDUCTOR DEVICES - PART 16-4: MICROWAVE INTEGRATED CIRCUITS - SWITCHES |
| BS IEC 60747-4.2 : 2000 | SEMICONDUCTOR DEVICES - DISCRETE DEVICES - MICROWAVE DIODES AND TRANSISTORS - INTEGRATED-CIRCUIT MICROWAVE AMPLIFIERS - BLANK DETAIL SPECIFICATION |
| NFC 03 002 : 2002 | LETTER SYMBOLS TO BE USED IN ELECTRICAL TECHNOLOGY - PART 2: TELECOMMUNICATIONS AND ELECTRONICS |
| BS EN 60747-16-4 : 2004 | SEMICONDUCTOR DEVICES - PART 16-4: MICROWAVE INTEGRATED CIRCUITS - SWITCHES |
| 07/30148822 DC : 0 | BS IEC 62047-4 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 4: GENERIC SPECIFICATIONS FOR MEMS |
| BS EN 60146-1-1:2010 | Semiconductor converters. General requirements and line commutated converters Specification of basic requirements |
| BS IEC 60748-23-2:2002 | Semiconductor devices. Integrated circuits. Hybrid integrated circuits and film structures. Manufacturing line certification Internal visual inspection and special tests |
| I.S. EN 60747-16-3:2002 | SEMICONDUCTOR DEVICES - PART 16-3: MICROWAVE INTEGRATED CIRCUITS - FREQUENCY CONVERTERS |
| I.S. EN 62595-1-1:2013 | LCD BACKLIGHT UNIT - PART 1-1: GENERIC SPECIFICATION (IEC 62595-1-1:2013 (EQV)) |
| IEC 60747-14-1:2010 | Semiconductor devices - Part 14-1: Semiconductor sensors - Generic specification for sensors |
| IEC TR 62572-2:2008 | Fibre optic active components and devices - Reliability standards - Part 2: Laser module degradation |
| BIS IS 15934-5 : 2011 | LIQUID CRYSTAL AND SOLID-STATE DISPLAY DEVICES - PART 5: ENVIRONMENTAL, ENDURANCE AND MECHANICAL TEST METHODS |
| NFC 96 002 : 2001 | SEMICONDUCTOR DEVICES - DISCRETE DEVICES AND INTEGRATED CIRCUITS - PART 2: RECTIFIER DIODES |
| IEC 60748-2:1997 | Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits |
| IEC 60748-23-1:2002 | Semiconductor devices - Integrated circuits - Part 23-1: Hybrid integrated circuits and film structures - Manufacturing line certification - Generic specification |
| I.S. EN 61988-5:2009 | PLASMA DISPLAY PANELS - PART 5: GENERIC SPECIFICATION |
| I.S. EN 60747-16-4:2004 | SEMICONDUCTOR DEVICES - PART 16-4: MICROWAVE INTEGRATED CIRCUITS - SWITCHES |
| EN 60747-16-1:2002/A2:2017 | SEMICONDUCTOR DEVICES - PART 16-1: MICROWAVE INTEGRATED CIRCUITS - AMPLIFIERS (IEC 60747-16-1:2001/A2:2017) |
| IEC 61643-341:2001 | Components for low-voltage surge protective devices - Part 341: Specification for thyristor surge suppressors (TSS) |
| BS EN 45510-2-2:1999 | Guide for the procurement of power station equipment. Electrical equipment Uninterruptible power supplies - Uninterruptible power supplies for power plants |
| IEC 60747-15:2010 | Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices |
| EN 62572-3:2016 | Fibre optic active components and devices - Reliability standards - Part 3: Laser modules used for telecommunication |
| EN 60747-16-10:2004 | Semiconductor devices - Part 16-10: Technology Approval Schedule (TAS) for monolithic microwave integrated circuits |
| EN 61988-5 : 2009 | PLASMA DISPLAY PANELS - PART 5: GENERIC SPECIFICATION |
| EN 62341-1-1:2009 | Organic light emitting diode (OLED) displays - Part 1-1: Generic specifications |
| EN 62047-5:2011 | Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches |
| EN 61747-1:1999/A1:2003 | LIQUID CRYSTAL AND SOLID-STATE DISPLAY DEVICES - PART 1: GENERIC SPECIFICATION |
| EN 60146-1-1:2010 | Semiconductor converters - General requirements and line commutated converters - Part 1-1: Specification of basic requirements |
| EN 60417-1:2002 | GRAPHICAL SYMBOLS FOR USE ON EQUIPMENT - PART 1: OVERVIEW AND APPLICATION |
| EN 165000-1:1996 | Film and hybrid integrated circuits - Part 1: Generic specification - Capability approval procedure |
| IEC 61709:2017 | Electric components - Reliability - Reference conditions for failure rates and stress models for conversion |
| EN 60146-2:2000 | Semiconductor converters - Part 2: Self-commutated semiconductor converters including direct d.c. converters |
| EN 60749 : 99 AMD 2 2001 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS |
| BS CECC90100(1987) : AMD 7845 | HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: SECTIONAL SPECIFICATION: DIGITAL MONOLITHIC INTEGRATED CIRCUITS |
| IEC 60050-131:2002 | International Electrotechnical Vocabulary (IEV) - Part 131: Circuit theory |
| IEC 60050-702:1992 | International Electrotechnical Vocabulary (IEV) - Part 702: Oscillations, signals and related devices |
| IEC 60134:1961 | Rating systems for electronic tubes and valves and analogous semiconductor devices |
| IEC 60319:1999 | Presentation and specification of reliability data for electronic components |
| IEC 60191-2:2012 DB | Mechanical standardization of semiconductor devices - Part 2: Dimensions |
| IEC 60469-1:1987 | Pulse techniques and apparatus. Part 1: Pulse terms and definitions |
| IEC 60749-26:2013 | Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM) |
| ISO 9000:2015 | Quality management systems — Fundamentals and vocabulary |
| IEC 60050-521:2002 | International Electrotechnical Vocabulary (IEV) - Part 521: Semiconductor devices and integrated circuits |
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