IEC 60747-15 : 2.0

Current

Current The latest, up-to-date edition.

SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 15: ISOLATED POWER SEMICONDUCTOR DEVICES

Publisher: International Electrotechnical Committee

Published: 12-16-2010

Available Formats: PDF - English, Hardcopy - English
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Table of Contents - (Show below) - (Hide below)

FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Letter symbols
5 Essential ratings (limiting values) and characteristics
6 Measurement methods
7 Acceptance and reliability
Annex A (informative) - Test method of peak case
non-rupture current
Annex B (informative) - Measuring method of the thickness
of thermal compound paste
Bibliography

Abstract - (Show below) - (Hide below)

Describes the requirements for isolated power semiconductor devices excluding devices with incorporated control circuits.

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Published
Document Type	Standard
Status	Current
Publisher	International Electrotechnical Committee
Pages
ISBN
Committee	TC 47

International Equivalents – Equivalent Standard(s) & Relationship - (Show below) - (Hide below)

Equivalent Standard(s)	Relationship
DS EN 60747-15 : 2012	Identical
NF EN 60747-15 : 2013	Identical
NBN EN 60747-15 : 2012	Identical
NEN EN IEC 60747-15 : 2012	Identical
UNE-EN 60747-15:2012	Identical
BS EN 60747-15 : 2012	Identical
CEI EN 60747-15 : 2012	Identical
EN 60747-15 : 2012	Identical
DIN EN 60747-15 : 2012	Identical
NEN EN IEC 60747-15 : 2012	Identical
UNE-EN 60747-15:2012	Identical
BS EN 60747-15 : 2012	Identical
DIN EN 60747-15 : 2012	Identical
CEI EN 60747-15 : 2012	Identical
DS EN 60747-15 : 2012	Identical

Standards Referenced By This Book - (Show below) - (Hide below)

BS EN 61287-1 : 2014	RAILWAY APPLICATIONS - POWER CONVERTORS INSTALLED ON BOARD ROLLING STOCK - PART 1: CHARACTERISTICS AND TEST METHODS
04/30114936 DC : DRAFT JUN 2004	EN 50439 - RAILWAY APPLICATIONS - RELIABILITY TESTS FOR HIGH POWER SEMICONDUCTORS DEVICES - PART 1: STANDARD BASE-PLATE MODULES
I.S. EN 61287-1:2014	RAILWAY APPLICATIONS - POWER CONVERTERS INSTALLED ON BOARD ROLLING STOCK - PART 1: CHARACTERISTICS AND TEST METHODS
UNE EN 61287-1 : 2015	RAILWAY APPLICATIONS - POWER CONVERTERS INSTALLED ON BOARD ROLLING STOCK - PART 1: CHARACTERISTICS AND TEST METHODS
IEC 61287-1 : 3.0	RAILWAY APPLICATIONS - POWER CONVERTORS INSTALLED ON BOARD ROLLING STOCK - PART 1: CHARACTERISTICS AND TEST METHODS

Standards Referencing This Book - (Show below) - (Hide below)

IEC 60112 : 4.1	METHOD FOR THE DETERMINATION OF THE PROOF AND THE COMPARATIVE TRACKING INDICES OF SOLID INSULATING MATERIALS
IEC 60270 : 3.1	HIGH VOLTAGE TEST TECHNIQUES - PARTIAL DISCHARGE MEASUREMENTS
IEC 60747-7 : 3.0	SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 7: BIPOLAR TRANSISTORS
IEC 61287-1 : 3.0	RAILWAY APPLICATIONS - POWER CONVERTORS INSTALLED ON BOARD ROLLING STOCK - PART 1: CHARACTERISTICS AND TEST METHODS
IEC 60749-21 : 2.0	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 21: SOLDERABILITY
IEC 60749-25 : 1.0	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 25: TEMPERATURE CYCLING
IEC 60749-5 : 2.0	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 5: STEADY-STATE TEMPERATURE HUMIDITY BIAS LIFE TEST
IEC 60747-9 : 2.0	SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 9: INSULATED-GATE BIPOLAR TRANSISTORS (IGBTS)
IEC 60747-8 : 3.0	SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 8: FIELD-EFFECT TRANSISTORS
IEC 60749-15 : 2.0	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 15: RESISTANCE TO SOLDERING TEMPERATURE FOR THROUGH-HOLE MOUNTED DEVICES
IEC 60747-1 : 2.1	SEMICONDUCTOR DEVICES - PART 1: GENERAL
IEC 60749-34 : 2.0	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 34: POWER CYCLING
IEC 60749-6 : 2.0	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 6: STORAGE AT HIGH TEMPERATURE
IEC 60721-3-3 : 2.2	CLASSIFICATION OF ENVIRONMENTAL CONDITIONS - PART 3-3: CLASSIFICATION OF GROUPS OF ENVIRONMENTAL PARAMETERS AND THEIR SEVERITIES - STATIONARY USE AT WEATHERPROTECTED LOCATIONS
IEC 60749-10 : 1.0	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 10: MECHANICAL SHOCK
IEC 60747-6 : 3.0	SEMICONDUCTOR DEVICES - PART 6: DISCRETE DEVICES - THYRISTORS
IEC 60664-1 : 2.0	INSULATION COORDINATION FOR EQUIPMENT WITHIN LOW-VOLTAGE SYSTEMS - PART 1: PRINCIPLES, REQUIREMENTS AND TESTS
IEC 60747-2 : 3.0	SEMICONDUCTOR DEVICES - PART 2: DISCRETE DEVICES - RECTIFIER DIODES
IEC 60749-12 : 1.0	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 12: VIBRATION, VARIABLE FREQUENCY

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IEC 60747-15 : 2.0

Table of Contents - (Show below) - (Hide below)

Abstract - (Show below) - (Hide below)

General Product Information - (Show below) - (Hide below)

International Equivalents – Equivalent Standard(s) & Relationship - (Show below) - (Hide below)

Standards Referenced By This Book - (Show below) - (Hide below)

Standards Referencing This Book - (Show below) - (Hide below)

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