Semiconductor devices - Integrated circuits - Part 22-1: Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures

Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Language(s)

English - French

Published date

04-10-1997

Publisher

International Electrotechnical Committee

1 Characteristics and conditions of use
2 Recommended methods of mounting
3 Marking
4 Ordering information
5 Certified records of released lots
6 Additional information
7 Additional or increased severities or requirements
           to those specified in the generic and/or sectional
           specification
8 Inspection requirements (see tables 2 and 3 or 4
           and 5)
9 Supplement - Tables of method B
Tables
1 Where a range of circuits
2 Method A - Groups A and B - Lot-by-lot
3a Method A - Group C - Periodic tests
3b Method A - Group D - Periodic tests
4a Method B - Group A - Lot-by-lot
4b Method B - Group B - Lot-by-lot
5a Method B - Group C - Periodic tests
5b Method B - Group D - Periodic tests

Committee	TC 47/SC 47A
DevelopmentNote	Also numbered as BS QC760201(1997). (09/2003) Supersedes IEC 60186B. (07/2004) Stability Date: 2020. (09/2017)
DocumentType	Standard
Pages	29
PublisherName	International Electrotechnical Committee
Status	Current
Supersedes	IEC 60748-22-1:1991 IEC 60148B:1979

Standards	Relationship
NEN IEC 60748-22-1 : 1998	Identical

BS QC 760200:1997	Harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures
BS QC 760200:1992	Harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Sectional specification for film integrated circuits and hybrid film integrated circuits: capability approval
IEC 61747-1:1998+AMD1:2003 CSV	Liquid crystal and solid-state display devices - Part 1: Generic specification