IEC 60748-22:1997
Current
The latest, up-to-date edition.
Semiconductor devices - Integrated circuits - Part 22: Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
English - French
04-10-1997
FOREWORD
1 Scope and object
2 General preferred characteristics, ratings and
severities for environmental tests
2.1 Normative references
2.2 Preferred ratings and characteristics
2.3 Information to be given in a detail specification
3 Capability approval procedures
3.1 Selection of capability qualifying circuits
(CQCs)
3.2 Structural similarity
3.3 Capability approval
3.4 Resubmission of rejected lots (lot-by-lot
inspection)
3.5 Manufacturing stages in a factory of an approved
manufacturer
4 Test and measurement procedures
5 Tables for method B
Annexes
A Structural similarity rules for capability approval
B Minimum contents of a manufacturer's capability manual
for thick film circuits
C Minimum contents of a manufacturer's capability manual
for thin film circuits
Tables
1 Test schedule for capability approval for method A
2 Assessment levels and acceptance criteria for capability
manual for thick film circuits
3 Assessment levels and acceptance criteria for quality
conformance inspection for method A
4 Screening
5 Test schedule for capability approval for method B
6 Assessment levels and acceptance criteria for
capability approval for method B
7 Assessment levels and acceptance criteria for quality
conformance inspection for method B
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