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IEC 61189-11:2013

Current
Current

The latest, up-to-date edition.

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys
Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Language(s)

English - French

Published date

05-07-2013

FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Summary of measuring methods
5 Test equipment
6 Calibration of the temperature
7 Procedure for the measuring method
Annex A (normative) - Test report on melting
        temperatures of solder alloys
Annex B (informative) - Examples of test
        result (Method A)
Annex C (informative) - Example of test
        result (Method B)
Bibliography

IEC 61189-11:2013 describes the measurement method of melting ranges of solder alloys that are mainly used for wiring of electrical equipment, for electrical and communication equipment, and for other apparatus, as well as for connecting components.

Committee
TC 91
DevelopmentNote
Stability date: 2020. (11/2017)
DocumentType
Standard
Pages
30
PublisherName
International Electrotechnical Committee
Status
Current

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