IEC 61340-5-1 : 2.0

Current

Current The latest, up-to-date edition.

ELECTROSTATICS - PART 5-1: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - GENERAL REQUIREMENTS

Publisher: International Electrotechnical Committee

Published: 05-27-2016

Available Formats: PDF - English - French, Hardcopy - English - French
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Table of Contents - (Show below) - (Hide below)

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 Personnel safety
5 ESD control program
Annex A (normative) - Test methods
Bibliography

Abstract - (Show below) - (Hide below)

Pertains to activities that: manufacture, process, assemble, install, package, label, service, test, inspect, transport or otherwise handle electrical or electronic parts, assemblies and equipment with withstand voltages greater than or equal to 100 V HBM, 200 V CDM and 35 V for isolated conductors.

General Product Information - (Show below) - (Hide below)

Published
Document Type	Standard
Status	Current
Publisher	International Electrotechnical Committee
Pages
ISBN
Committee	TC 101
Supersedes	IEC TS 61340-5-1 : 1998 COR 2 2002

International Equivalents – Equivalent Standard(s) & Relationship - (Show below) - (Hide below)

Equivalent Standard(s)	Relationship
DS EN 61340-5-1 : 2016	Identical
NF EN 61340-5-1 : 2016	Identical
NEN EN IEC 61340-5-1 : 2016	Identical
PN EN 61340-5-1 : 2017 AC 2017	Identical
SN EN 61340-5-1 : 2016	Identical
VDE 0300-5-1 : 2017	Identical
DIN EN 61340-5-1 : 2017	Identical
EN 61340-5-1 : 2016	Identical
GOST IEC 61340-5-1 : 2019	Identical
UNE-EN 61340-5-1:2016	Identical
BS EN 61340-5-1 : 2016	Identical
EN 61340-5-1 : 2016 COR 2017	Identical
GOST IEC 61340-5-1 : 2019	Identical
BS IEC 61340-5.1 : 1998 AMD 13198	Identical
BS EN 61340-5-1 : 2016	Identical
CEI EN 61340-5-1 : 2017	Identical
VDE 0300-5-1 : 2017	Identical
UNE-EN 61340-5-1:2016	Identical
NEN NPR IEC 61340-5-1 : 1999	Identical
DIN EN 61340-5-1 : 2017	Identical
PN EN 61340-5-1 : 2017 AC 2017	Identical
NEN EN IEC 61340-5-1 : 2016	Identical
SN EN 61340-5-1 : 2016	Identical
DS EN 61340-5-1 : 2016	Identical
NF EN 61340-5-1 : 2016	Identical

Standards Referenced By This Book - (Show below) - (Hide below)

BS EN 62435-1 : 2017	ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 1: GENERAL (IEC 62435-1:2017)
I.S. EN 62435-2:2017	ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 2: DETERIORATION MECHANISMS
DIN EN ISO 14644-9 E : 2012	CLEANROOMS AND ASSOCIATED CONTROLLED ENVIRONMENTS - PART 9: CLASSIFICATION OF SURFACE CLEANLINESS BY PARTICLE CONCENTRATION (ISO 14644-9:2012)
I.S. EN 60749-16:2003	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PARTICLE IMPACT NOISE DETECTION (PIND)
BS PD IEC/TS 62239-2 : 2017	PROCESS MANAGEMENT FOR AVIONICS - MANAGEMENT PLAN - PART 2: PREPARATION AND MAINTENANCE OF AN ELECTRONIC COTS ASSEMBLY MANAGEMENT PLAN
BS EN 16812 : 2016	TEXTILES AND TEXTILE PRODUCTS - ELECTRICALLY CONDUCTIVE TEXTILES - DETERMINATION OF THE LINEAR ELECTRICAL RESISTANCE OF CONDUCTIVE TRACKS
ESD TR17.0-01 : 2015	BEST PRACTICES USED IN INDUSTRY
DIN EN ISO 14644-9 : 2012	CLEANROOMS AND ASSOCIATED CONTROLLED ENVIRONMENTS - PART 9: CLASSIFICATION OF SURFACE CLEANLINESS BY PARTICLE CONCENTRATION (ISO 14644-9:2012)
CLC/TR 61340-5-2 : 2008	ELECTROSTATICS - PART 5-2: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - USER GUIDE
BS EN 62435-2 : 2017	ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 2: DETERIORATION MECHANISMS
VDI 2083 Blatt 5.1:2007-09	CLEANROOM TECHNOLOGY - CLEANROOM OPERATION
02/203838 DC : DRAFT MAR 2002
I.S. EN 61340-4-6:2015	ELECTROSTATICS - PART 4-6: STANDARD TEST METHODS FOR SPECIFIC APPLICATIONS - WRIST STRAPS
I.S. EN 62435-1:2017	ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 1: GENERAL
VDI 2083-4-1 : 2006	CLEANROOM TECHNOLOGY - PLANNING, CONSTRUCTION AND START-UP OF CLEANROOMS
BS EN ISO 14644-9 : 2012	CLEANROOMS AND ASSOCIATED CONTROLLED ENVIRONMENTS - PART 9: CLASSIFICATION OF SURFACE CLEANLINESS BY PARTICLE CONCENTRATION (ISO 14644-9:2012)
DD IEC TS 62239 : 2003	PROCESS MANAGEMENT FOR AVIONICS - PREPARATION OF AN ELECTRONIC COMPONENTS MANAGEMENT PLAN
BS PD IEC TR 61340-5-2 : 2018	ELECTROSTATICS - PART 5-2: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - USER GUIDE
CEI EN 60747-16-5 : 2014	SEMICONDUCTOR DEVICES - PART 16-5: MICROWAVE INTEGRATED CIRCUITS - OSCILLATORS
BS IEC 60747-16.2 : 2001	SEMICONDUCTOR DEVICES - PART 16-2: MICROWAVE INTEGRATED CIRCUITS - FREQUENCY PRESCALERS
IEC Q OD 3802 : 1ED 2015	IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ SYSTEM) - QUALITY SYSTEM REQUIREMENTS FOR MANUFACTURERS SEEKING IECQ LED COMPONENT PRODUCT CERTIFICATES OF CONFORMITY FOR COMPONENT PRODUCT(S) ASSOCIATED WITH LED LIGHTING
15/30315510 DC : 0	BS ISO 4586-5 - HIGH-PRESSURE DECORATIVE LAMINATES (HPL, HPDL) - SHEETS BASED ON THERMOSETTING RESINS (USUALLY CALLED LAMINATES) - PART 5: CLASSIFICATION AND SPECIFICATIONS FOR FLOORING GRADE LAMINATES LESS THAN 2 MM THICK INTENDED FOR BONDING TO SUPPORTING SUBSTRATES
IEC 62435-4 : 1ED 2018	ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 4: STORAGE
UTEC 96 029 : 2011	ELECTRONIC COMPONENTS - LONG DURATION STORAGE OF ELECTRONIC COMPONENTS - GUIDE FOR IMPLEMENTATION
PREN 14125 : DRAFT 2011	THERMOPLASTIC AND FLEXIBLE METAL PIPEWORK FOR UNDERGROUND INSTALLATION AT PETROL FILLING STATIONS
ESDA/JEDEC JS-002 : 2014	ELECTROSTATIC DISCHARGE SENSITIVITY TESTING - CHARGED DEVICE MODEL (CDM) - COMPONENT LEVEL
BS EN 60749-3 : 2017	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 3: EXTERNAL VISUAL EXAMINATION (IEC 60749-3:2017)
11/30231856 DC : 0	BS EN 14125 - THERMOPLASTIC AND FLEXIBLE METAL PIPEWORK FOR UNDERGROUND INSTALLATION AT PETROL FILLING STATIONS
IEC TR 61340-5-2 REDLINE : 2ED 2018	ELECTROSTATICS - PART 5-2: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - USER GUIDE
UNE EN ISO 14644-9 : 2014	CLEANROOMS AND ASSOCIATED CONTROLLED ENVIRONMENTS - PART 9: CLASSIFICATION OF SURFACE CLEANLINESS BY PARTICLE CONCENTRATION (ISO 14644-9:2012)
08/30180398 DC : 0	BS EN 60747-16-5 - SEMICONDUCTOR DEVICES - PART 16-5: MICROWAVE INTEGRATED CIRCUITS - OSCILLATORS
17/30355242 DC : 0	BS ISO 4586-5 - HIGH-PRESSURE DECORATIVE LAMINATES (HPL, HPDL) - SHEETS BASED ON THERMOSETTING RESINS (USUALLY CALLED LAMINATES) - PART 5: CLASSIFICATION AND SPECIFICATIONS FOR FLOORING GRADE LAMINATES LESS THAN 2 MM THICK INTENDED FOR BONDING TO SUPPORTING SUBSTRATES
I.S. EN 61340-4-9:2016	ELECTROSTATICS - PART 4-9: STANDARD TEST METHODS FOR SPECIFIC APPLICATIONS - GARMENTS
VDI 2083 Blatt 18 : 2012	Cleanroom technology - Biocontamination control
UNE EN 16812 : 2016	TEXTILES AND TEXTILE PRODUCTS - ELECTRICALLY CONDUCTIVE TEXTILES - DETERMINATION OF THE LINEAR ELECTRICAL RESISTANCE OF CONDUCTIVE TRACKS
BS EN 60679-1 : 2017	PIEZOELECTRIC, DIELECTRIC AND ELECTROSTATIC OSCILLATORS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION
16/30344800 DC : 0	BS EN 60749-3 - SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 3: EXTERNAL VISUAL EXAMINATION
BS EN 61340-4-9 : 2016	ELECTROSTATICS - PART 4-9: STANDARD TEST METHODS FOR SPECIFIC APPLICATIONS - GARMENTS
BS EN 61340-2-1 : 2015	ELECTROSTATICS - PART 2-1: MEASUREMENT METHODS - ABILITY OF MATERIALS AND PRODUCTS TO DISSIPATE STATIC ELECTRIC CHARGE
13/30286163 DC : 0	BS EN 62435-2 - ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 2 - DETERIORATION MECHANISMS
I.S. EN 61340-2-1:2015	ELECTROSTATICS - PART 2-1: MEASUREMENT METHODS - ABILITY OF MATERIALS AND PRODUCTS TO DISSIPATE STATIC ELECTRIC CHARGE
VDI 2083-9-1 : 2006	CLEAN ROOM TECHNOLOGY - COMPATIBILITY WITH REQUIRED CLEANLINESS AND SURFACE CLEANLINESS
BS EN 61192-1 : 2003	WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 1: GENERAL
14/30288969 DC : 0	BS EN 61340-5-3 ED 2.0 - ELECTROSTATICS - PART 5-3: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - PROPERTIES AND REQUIREMENTS CLASSIFICATION FOR PACKAGING INTENDED FOR ELECTROSTATIC DISCHARGE SENSITIVE DEVICES
BS EN 60286-3 : 2013	PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3: PACKAGING OF SURFACE MOUNT COMPONENTS ON CONTINUOUS TAPES
14/30311058 DC : 0	BS EN 60747-16-1:AMD 2 - SEMICONDUCTOR DEVICES - PART 16-1: MICROWAVE INTEGRATED CIRCUITS - AMPLIFIERS
08/30190157 DC : DRAFT SEP 2008	BS EN ISO 14644-9 - CLEANROOMS AND ASSOCIATED CONTROLLED ENVIRONMENTS - PART 9: CLASSIFICATION OF SURFACE PARTICLE CLEANLINESS
BS IEC 60748-23-1 : 2002	SEMICONDUCTOR DEVICES - INTEGRATED CIRCUITS - HYBRID INTEGRATED CIRCUITS AND FILM STRUCTURES - MANUFACTURING LINE CERTIFICATION - GENERIC SPECIFICATION
09/30214337 DC : 0	BS EN 60286-3 - PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3: PACKAGING OF SURFACE MOUNT COMPONENTS ON CONTINUOUS TAPES
13/30286159 DC : 0	BS EN 62435-1 - ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 1: GENERAL
BS EN 62258-1 : 2010	SEMICONDUCTOR DIE PRODUCTS - PART 1: PROCUREMENT AND USE
BS EN 61340-4-6 : 2015	ELECTROSTATICS - PART 4-6: STANDARD TEST METHODS FOR SPECIFIC APPLICATIONS - WRIST STRAPS
NBR IEC 61192-1 : 2008	WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 1: GENERAL
BS EN 60747-16-5 : 2013	SEMICONDUCTOR DEVICES - PART 16-5: MICROWAVE INTEGRATED CIRCUITS - OSCILLATORS
13/30286167 DC : 0	BS EN 62435-5 - ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 5 - DIE & WAFER DEVICES
BS EN 61340-5-3 : 2015	ELECTROSTATICS - PART 5-3: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - PROPERTIES AND REQUIREMENTS CLASSIFICATIONS FOR PACKAGING INTENDED FOR ELECTROSTATIC DISCHARGE SENSITIVE DEVICES
CEI EN 60747-16-3 : 2009	SEMICONDUCTOR DEVICES - PART 16-3: MICROWAVE INTEGRATED CIRCUITS - FREQUENCY CONVERTERS
BS PD CLC/TR 61340-5-2 : 2008	ELECTROSTATICS - PART 5-2: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - USER GUIDE
13/30267320 DC : 0	BS EN 61340-4-6 ED 2.0 - ELECTROSTATICS - PART 4-6: STANDARD TEST METHODS FOR SPECIFIC APPLICATIONS - WRIST STRAPS
BS EN 60747-16-4 : 2004	SEMICONDUCTOR DEVICES - PART 16-4: MICROWAVE INTEGRATED CIRCUITS - SWITCHES
ISO 18080-3 : 2015	TEXTILES - TEST METHODS FOR EVALUATING THE ELECTROSTATIC PROPENSITY OF FABRICS - PART 3: TEST METHOD USING MANUAL FRICTION
BS EN 61760-4 : 2015	SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES
SR CLC/TR 61340-5-2:2008	ELECTROSTATICS - PART 5-2: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - USER GUIDE
I.S. EN 60747-16-3:2002	SEMICONDUCTOR DEVICES - PART 16-3: MICROWAVE INTEGRATED CIRCUITS - FREQUENCY CONVERTERS
IEC TR 61340-5-2 : 1.0	ELECTROSTATICS - PART 5-2: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - USER GUIDE
ISO TS 19880-1 : 2016	GASEOUS HYDROGEN - FUELLING STATIONS - PART 1: GENERAL REQUIREMENTS
I.S. EN 60749-3:2017	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 3: EXTERNAL VISUAL EXAMINATION
IEC TS 62239-2 : 1ED 2017	PROCESS MANAGEMENT FOR AVIONICS - MANAGEMENT PLAN - PART 2: PREPARATION AND MAINTENANCE OF AN ELECTRONIC COTS ASSEMBLY MANAGEMENT PLAN
IEC TR 61340-1 : 1.0	ELECTROSTATICS - PART 1: ELECTROSTATIC PHENOMENA - PRINCIPLES AND MEASUREMENTS
IEC 61760-4 : 1ED 2015	SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES
CEI EN 61760-1 : 2007	SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
I.S. EN 61340-5-3:2015	ELECTROSTATICS - PART 5-3: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - PROPERTIES AND REQUIREMENTS CLASSIFICATION FOR PACKAGING INTENDED FOR ELECTROSTATIC DISCHARGE SENSITIVE DEVICES
I.S. EN 62258-1:2010	SEMICONDUCTOR DIE PRODUCTS - PART 1: PROCUREMENT AND USE
I.S. EN ISO 14644-9:2012	CLEANROOMS AND ASSOCIATED CONTROLLED ENVIRONMENTS - PART 9: CLASSIFICATION OF SURFACE CLEANLINESS BY PARTICLE CONCENTRATION (ISO 14644-9:2012)
EN 60747-16-3 : 2002 AMD 2 2017	SEMICONDUCTOR DEVICES - PART 16-3: MICROWAVE INTEGRATED CIRCUITS - FREQUENCY CONVERTERS (IEC 60747-16-3:2002/A2:2017)
EN 60679-1 : 2017	PIEZOELECTRIC, DIELECTRIC AND ELECTROSTATIC OSCILLATORS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION (IEC 60679-1:2017)
EN 60747-16-4 : 2004 AMD 2 2017	SEMICONDUCTOR DEVICES - PART 16-4: MICROWAVE INTEGRATED CIRCUITS - SWITCHES (IEC 60747-16-4:2004/A2:2017)
I.S. EN 62435-5:2017	ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 5: DIE AND WAFER DEVICES
I.S. EN 16812:2016	TEXTILES AND TEXTILE PRODUCTS - ELECTRICALLY CONDUCTIVE TEXTILES - DETERMINATION OF THE LINEAR ELECTRICAL RESISTANCE OF CONDUCTIVE TRACKS
CEI EN 60679-1 : 2009	PIEZOELECTRIC, DIELECTRIC AND ELECTROSTATIC OSCILLATORS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION
BS EN 60747-16-1 : 2002	SEMICONDUCTOR DEVICES - PART 16-1: MICROWAVE INTEGRATED CIRCUITS - AMPLIFIERS
BS EN 60747-16-3 : 2002	SEMICONDUCTOR DEVICES - PART 16-3: MICROWAVE INTEGRATED CIRCUITS - FREQUENCY CONVERTERS
I.S. EN 61192-1:2003	WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - GENERAL
I.S. EN 60679-1:2017	PIEZOELECTRIC, DIELECTRIC AND ELECTROSTATIC OSCILLATORS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION
CEI CLC/TR 62258-3 : 2007	SEMICONDUCTOR DIE PRODUCTS - PART 3: RECOMMENDATIONS FOR GOOD PRACTICE IN HANDLING, PACKING AND STORAGE
I.S. EN 60286-3:2013	PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3: PACKAGING OF SURFACE MOUNT COMPONENTS ON CONTINUOUS TAPES (IEC 60286-3:2013 (EQV))
CEI EN 61760-4 : 2016	SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES
ARINC 606A : 2004	GUIDANCE FOR ELECTROSTATIC SENSITIVE DEVICE UTILIZATION AND PROTECTION
I.S. EN 61760-4:2015	SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES
VDI 2119 : 2013	AMBIENT AIR MEASUREMENTS - SAMPLING OF ATMOSPHERIC PARTICLES > 2,5 [MU]M ON AN ACCEPTOR SURFACE USING THE SIGMA-2 PASSIVE SAMPLER - CHARACTERISATION BY OPTICAL MICROSCOPY AND CALCULATION OF NUMBER SETTLING RATE AND MASS CONCENTRATION
IEC TS 62686-1 : 2.0	PROCESS MANAGEMENT FOR AVIONICS - ELECTRONIC COMPONENTS FOR AEROSPACE, DEFENCE AND HIGH PERFORMANCE (ADHP) APPLICATIONS - PART 1: GENERAL REQUIREMENTS FOR HIGH RELIABILITY INTEGRATED CIRCUITS AND DISCRETE SEMICONDUCTORS
UNI EN ISO 14644-9 : 2012	CLEANROOMS AND ASSOCIATED CONTROLLED ENVIRONMENTS - PART 9: CLASSIFICATION OF SURFACE CLEANLINESS BY PARTICLE CONCENTRATION
I.S. EN 60747-16-5:2013	SEMICONDUCTOR DEVICES - PART 16-5: MICROWAVE INTEGRATED CIRCUITS - OSCILLATORS (IEC 60747-16-5:2013 (EQV))
ISO TS 20100 : 2008	GASEOUS HYDROGEN - FUELLING STATIONS
CEI EN 60749-3 : 2004	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 3: EXTERNAL VISUAL EXAMINATION
CEI EN 60749-16 : 2005	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 16: PARTICLE IMPACT NOISE DETECTION (PIND)
CEI CLC/TR 61340-5-2 : 2010	ELECTROSTATICS - PART 5-2: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - USER GUIDE
IEC 60748-23-1 : 1.0	SEMICONDUCTOR DEVICES - INTEGRATED CIRCUITS - PART 23-1: HYBRID INTEGRATED CIRCUITS AND FILM STRUCTURES - MANUFACTURING LINE CERTIFICATION - GENERIC SPECIFICATION
ISO 4586-5 : 2015	HIGH-PRESSURE DECORATIVE LAMINATES (HPL, HPDL) - SHEETS BASED ON THERMOSETTING RESINS (USUALLY CALLED LAMINATES) - PART 5: CLASSIFICATION AND SPECIFICATIONS FOR FLOORING GRADE LAMINATES LESS THAN 2 MM THICK INTENDED FOR BONDING TO SUPPORTING SUBSTRATES
I.S. EN 60747-16-4:2004	SEMICONDUCTOR DEVICES - PART 16-4: MICROWAVE INTEGRATED CIRCUITS - SWITCHES
IEC 60748-23-3 : 1.0	SEMICONDUCTOR DEVICES - INTEGRATED CIRCUITS - PART 23-3: HYBRID INTEGRATED CIRCUITS AND FILM STRUCTURES - MANUFACTURING LINE CERTIFICATION - MANUFACTURERS' SELF-AUDIT CHECKLIST AND REPORT
IEC 60749-3 : 2.0	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 3: EXTERNAL VISUAL EXAMINATION
IEC 60747-16-2 : 1.1	SEMICONDUCTOR DEVICES - PART 16-2: MICROWAVE INTEGRATED CIRCUITS - FREQUENCY PRESCALERS
IEC TR 62258-3 : 2.0	SEMICONDUCTOR DIE PRODUCTS - PART 3: RECOMMENDATIONS FOR GOOD PRACTICE IN HANDLING, PACKING AND STORAGE
IEC 61191-1 : 2.0	PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES
IEC TS 62239-1 : 2.0	PROCESS MANAGEMENT FOR AVIONICS - MANAGEMENT PLAN - PART 1: PREPARATION AND MAINTENANCE OF AN ELECTRONIC COMPONENTS MANAGEMENT PLAN
EN 61760-4 : 2015 AMD 1 2018	SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES (IEC 61760-4:2015/A1:2018)
IEC 60679-1 : 2017	PIEZOELECTRIC, DIELECTRIC AND ELECTROSTATIC OSCILLATORS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION
I.S. EN 61340-5-2:1999	ELECTROSTATICS - PART 5-2: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - USER GUIDE
VDI 2083-17 : 2013	CLEANROOM TECHNOLOGY - COMPATIBILITY OF MATERIALS WITH THE REQUIRED CLEANLINESS
IEC TS 62239 : 2.0	PROCESS MANAGEMENT FOR AVIONICS - PREPARATION OF AN ELECTRONIC COMPONENTS MANAGEMENT PLAN
EN 60747-16-1 : 2002 AMD 2 2017	SEMICONDUCTOR DEVICES - PART 16-1: MICROWAVE INTEGRATED CIRCUITS - AMPLIFIERS (IEC 60747-16-1:2001/A2:2017)
DIN EN 14125 : 2013	THERMOPLASTIC AND FLEXIBLE METAL PIPEWORK FOR UNDERGROUND INSTALLATION AT PETROL FILLING STATIONS
DIN EN 14125 E : 2013	THERMOPLASTIC AND FLEXIBLE METAL PIPEWORK FOR UNDERGROUND INSTALLATION AT PETROL FILLING STATIONS
IEC 62258-1 : 2.0	SEMICONDUCTOR DIE PRODUCTS - PART 1: PROCUREMENT AND USE
IEC 60747-16-5 : 1ED 2013	SEMICONDUCTOR DEVICES - PART 16-5: MICROWAVE INTEGRATED CIRCUITS - OSCILLATORS
DD ISO/TS 20100 : 2008	GASEOUS HYDROGEN - FUELLING STATIONS
17/30365636 DC : 0	BS EN 62239-1 ED.1.0 - PROCESS MANAGEMENT FOR AVIONICS - MANAGEMENT PLAN - PART 1: PREPARATION AND MAINTENANCE OF AN ELECTRONIC COMPONENTS MANAGEMENT PLAN
BS PD IEC TS 62239-1 : 2015	PROCESS MANAGEMENT FOR AVIONICS - MANAGEMENT PLAN - PART 1: PREPARATION AND MAINTENANCE OF AN ELECTRONIC COMPONENTS MANAGEMENT PLAN
DD IEC PAS 62686-1 : DRAFT JULY 2011	PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE QUALIFIED ELECTRONIC COMPONENTS (AQEC) - PART 1: GENERAL REQUIREMENTS FOR HIGH RELIABILITY INTEGRATED CIRCUITS AND DISCRETE SEMICONDUCTORS
IEC 60747-16-3 : 1.2	SEMICONDUCTOR DEVICES - PART 16-3: MICROWAVE INTEGRATED CIRCUITS - FREQUENCY CONVERTERS
IEC 61340-2-1 : 2.0	ELECTROSTATICS - PART 2-1: MEASUREMENT METHODS - ABILITY OF MATERIALS AND PRODUCTS TO DISSIPATE STATIC ELECTRIC CHARGE
IEC PAS 62686-1 : 1.0	PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE QUALIFIED ELECTRONIC COMPONENTS (AQEC) - PART 1: GENERAL REQUIREMENTS FOR HIGH RELIABILITY INTEGRATED CIRCUITS AND DISCRETE SEMICONDUCTORS
BS EN 61191-1 : 2013	PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES
15/30327712 DC : 0	BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES
ISO 14644-9 : 2012	CLEANROOMS AND ASSOCIATED CONTROLLED ENVIRONMENTS - PART 9: CLASSIFICATION OF SURFACE CLEANLINESS BY PARTICLE CONCENTRATION
IEC 62435-5 : 1ED 2017	ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 5: DIE AND WAFER DEVICES
11/30211394 DC : DRAFT MAR 2011	BS ISO 20100 - GASEOUS HYDROGEN - FUELLING STATIONS
11/30255124 DC : 0	BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES
IEC 61340-4-9 : 2.0	ELECTROSTATICS - PART 4-9: STANDARD TEST METHODS FOR SPECIFIC APPLICATIONS - GARMENTS
IEC 62435-1 : 1ED 2017	ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 1: GENERAL
IEC 60747-16-4:2004+AMD1:2009+AMD2:2017	SEMICONDUCTOR DEVICES - PART 16-4: MICROWAVE INTEGRATED CIRCUITS - SWITCHES
UNE EN 14125 : 2013	THERMOPLASTIC AND FLEXIBLE METAL PIPEWORK FOR UNDERGROUND INSTALLATION AT PETROL FILLING STATIONS
IEC 62435-2 : 1ED 2017	ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 2: DETERIORATION MECHANISMS
IEC 61340-4-6 : 2.0	ELECTROSTATICS - PART 4-6: STANDARD TEST METHODS FOR SPECIFIC APPLICATIONS - WRIST STRAPS
BS EN 14125 : 2013	THERMOPLASTIC AND FLEXIBLE METAL PIPEWORK FOR UNDERGROUND INSTALLATION AT PETROL FILLING STATIONS
IEC 60286-3 : 5.0	PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3: PACKAGING OF SURFACE MOUNT COMPONENTS ON CONTINUOUS TAPES
BS EN 62435-5 : 2017	ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 5: DIE AND WAFER DEVICES
BS PD IEC TS 62686-1 : 2015	PROCESS MANAGEMENT FOR AVIONICS - ELECTRONIC COMPONENTS FOR AEROSPACE, DEFENCE AND HIGH PERFORMANCE (ADHP) APPLICATIONS - PART 1: GENERAL REQUIREMENTS FOR HIGH RELIABILITY INTEGRATED CIRCUITS AND DISCRETE SEMICONDUCTORS
18/30359998 DC : 0	BS ISO 19880-1 - GASEOUS HYDROGEN - FUELLING STATIONS - PART 1: GENERAL REQUIREMENTS
IEC 61340-5-3 : 2.0:2015	ELECTROSTATICS - PART 5-3: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - PROPERTIES AND REQUIREMENTS CLASSIFICATION FOR PACKAGING INTENDED FOR ELECTROSTATIC DISCHARGE SENSITIVE DEVICES
EN 60747-16-5 : 2013	SEMICONDUCTOR DEVICES - PART 16-5: MICROWAVE INTEGRATED CIRCUITS - OSCILLATORS (IEC 60747-16-5:2013)

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IEC TS 60479-1 : 4.1	EFFECTS OF CURRENT ON HUMAN BEINGS AND LIVESTOCK - PART 1: GENERAL ASPECTS
IEC 61340-5-3 : 2.0:2015	ELECTROSTATICS - PART 5-3: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - PROPERTIES AND REQUIREMENTS CLASSIFICATION FOR PACKAGING INTENDED FOR ELECTROSTATIC DISCHARGE SENSITIVE DEVICES
IEC 61340-4-9 : 2.0	ELECTROSTATICS - PART 4-9: STANDARD TEST METHODS FOR SPECIFIC APPLICATIONS - GARMENTS
IEC 61340-4-7 : 2.0	ELECTROSTATICS - PART 4-7: STANDARD TEST METHODS FOR SPECIFIC APPLICATIONS - IONIZATION
IEC 61340-2-3 : 2.0	ELECTROSTATICS - PART 2-3: METHODS OF TEST FOR DETERMINING THE RESISTANCE AND RESISTIVITY OF SOLID MATERIALS USED TO AVOID ELECTROSTATIC CHARGE ACCUMULATION
IEC TR 61340-5-2 : 1.0	ELECTROSTATICS - PART 5-2: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - USER GUIDE
IEC 60749-27 : 2.1	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 27: ELECTROSTATIC DISCHARGE (ESD) SENSITIVITY TESTING - MACHINE MODEL (MM)
ESDA/JEDEC JS-002 : 2014	ELECTROSTATIC DISCHARGE SENSITIVITY TESTING - CHARGED DEVICE MODEL (CDM) - COMPONENT LEVEL
IEC 61340-4-3 : 1.0	ELECTROSTATICS - PART 4-3: STANDARD TEST METHODS FOR SPECIFIC APPLICATIONS - FOOTWEAR
IEC 61340-4-1 : 2.1	ELECTROSTATICS - PART 4-1: STANDARD TEST METHODS FOR SPECIFIC APPLICATIONS - ELECTRICAL RESISTANCE OF FLOOR COVERINGS AND INSTALLED FLOORS
IEC 60749-26 : 3.0	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 26: ELECTROSTATIC DISCHARGE (ESD) SENSITIVITY TESTING - HUMAN BODY MODEL (HBM)
IEC 61340-4-5 : 1.0	ELECTROSTATICS - PART 4-5: STANDARD TEST METHODS FOR SPECIFIC APPLICATIONS - METHODS FOR CHARACTERIZING THE ELECTROSTATIC PROTECTION OF FOOTWEAR AND FLOORING IN COMBINATION WITH A PERSON
IEC 61140 : 4.0:2016	PROTECTION AGAINST ELECTRIC SHOCK - COMMON ASPECTS FOR INSTALLATIONS AND EQUIPMENT
IEC 61010-1 : 3.1:2017	SAFETY REQUIREMENTS FOR ELECTRICAL EQUIPMENT FOR MEASUREMENT, CONTROL, AND LABORATORY USE - PART 1: GENERAL REQUIREMENTS
IEC TS 60479-2 : 3.0	EFFECTS OF CURRENT ON HUMAN BEINGS AND LIVESTOCK - PART 2: SPECIAL ASPECTS
IEC 61340-4-6 : 2.0	ELECTROSTATICS - PART 4-6: STANDARD TEST METHODS FOR SPECIFIC APPLICATIONS - WRIST STRAPS

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IEC 61340-5-1 : 2.0

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