BS EN 62435-1 : 2017
|
ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 1: GENERAL (IEC 62435-1:2017) |
I.S. EN 62435-2:2017
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ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 2: DETERIORATION MECHANISMS |
DIN EN ISO 14644-9 E : 2012
|
CLEANROOMS AND ASSOCIATED CONTROLLED ENVIRONMENTS - PART 9: CLASSIFICATION OF SURFACE CLEANLINESS BY PARTICLE CONCENTRATION (ISO 14644-9:2012) |
I.S. EN 60749-16:2003
|
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PARTICLE IMPACT NOISE DETECTION (PIND) |
BS PD IEC/TS 62239-2 : 2017
|
PROCESS MANAGEMENT FOR AVIONICS - MANAGEMENT PLAN - PART 2: PREPARATION AND MAINTENANCE OF AN ELECTRONIC COTS ASSEMBLY MANAGEMENT PLAN |
BS EN 16812 : 2016
|
TEXTILES AND TEXTILE PRODUCTS - ELECTRICALLY CONDUCTIVE TEXTILES - DETERMINATION OF THE LINEAR ELECTRICAL RESISTANCE OF CONDUCTIVE TRACKS |
ESD TR17.0-01 : 2015
|
BEST PRACTICES USED IN INDUSTRY |
DIN EN ISO 14644-9 : 2012
|
CLEANROOMS AND ASSOCIATED CONTROLLED ENVIRONMENTS - PART 9: CLASSIFICATION OF SURFACE CLEANLINESS BY PARTICLE CONCENTRATION (ISO 14644-9:2012) |
CLC/TR 61340-5-2 : 2008
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ELECTROSTATICS - PART 5-2: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - USER GUIDE |
BS EN 62435-2 : 2017
|
ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 2: DETERIORATION MECHANISMS |
VDI 2083 Blatt 5.1:2007-09
|
CLEANROOM TECHNOLOGY - CLEANROOM OPERATION |
02/203838 DC : DRAFT MAR 2002
|
|
I.S. EN 61340-4-6:2015
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ELECTROSTATICS - PART 4-6: STANDARD TEST METHODS FOR SPECIFIC APPLICATIONS - WRIST STRAPS |
I.S. EN 62435-1:2017
|
ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 1: GENERAL |
VDI 2083-4-1 : 2006
|
CLEANROOM TECHNOLOGY - PLANNING, CONSTRUCTION AND START-UP OF CLEANROOMS |
BS EN ISO 14644-9 : 2012
|
CLEANROOMS AND ASSOCIATED CONTROLLED ENVIRONMENTS - PART 9: CLASSIFICATION OF SURFACE CLEANLINESS BY PARTICLE CONCENTRATION (ISO 14644-9:2012) |
DD IEC TS 62239 : 2003
|
PROCESS MANAGEMENT FOR AVIONICS - PREPARATION OF AN ELECTRONIC COMPONENTS MANAGEMENT PLAN |
BS PD IEC TR 61340-5-2 : 2018
|
ELECTROSTATICS - PART 5-2: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - USER GUIDE |
CEI EN 60747-16-5 : 2014
|
SEMICONDUCTOR DEVICES - PART 16-5: MICROWAVE INTEGRATED CIRCUITS - OSCILLATORS |
BS IEC 60747-16.2 : 2001
|
SEMICONDUCTOR DEVICES - PART 16-2: MICROWAVE INTEGRATED CIRCUITS - FREQUENCY PRESCALERS |
IEC Q OD 3802 : 1ED 2015
|
IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ SYSTEM) - QUALITY SYSTEM REQUIREMENTS FOR MANUFACTURERS SEEKING IECQ LED COMPONENT PRODUCT CERTIFICATES OF CONFORMITY FOR COMPONENT PRODUCT(S) ASSOCIATED WITH LED LIGHTING |
15/30315510 DC : 0
|
BS ISO 4586-5 - HIGH-PRESSURE DECORATIVE LAMINATES (HPL, HPDL) - SHEETS BASED ON THERMOSETTING RESINS (USUALLY CALLED LAMINATES) - PART 5: CLASSIFICATION AND SPECIFICATIONS FOR FLOORING GRADE LAMINATES LESS THAN 2 MM THICK INTENDED FOR BONDING TO SUPPORTING SUBSTRATES |
IEC 62435-4 : 1ED 2018
|
ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 4: STORAGE |
UTEC 96 029 : 2011
|
ELECTRONIC COMPONENTS - LONG DURATION STORAGE OF ELECTRONIC COMPONENTS - GUIDE FOR IMPLEMENTATION |
PREN 14125 : DRAFT 2011
|
THERMOPLASTIC AND FLEXIBLE METAL PIPEWORK FOR UNDERGROUND INSTALLATION AT PETROL FILLING STATIONS |
ESDA/JEDEC JS-002 : 2014
|
ELECTROSTATIC DISCHARGE SENSITIVITY TESTING - CHARGED DEVICE MODEL (CDM) - COMPONENT LEVEL |
BS EN 60749-3 : 2017
|
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 3: EXTERNAL VISUAL EXAMINATION (IEC 60749-3:2017) |
11/30231856 DC : 0
|
BS EN 14125 - THERMOPLASTIC AND FLEXIBLE METAL PIPEWORK FOR UNDERGROUND INSTALLATION AT PETROL FILLING STATIONS |
IEC TR 61340-5-2 REDLINE : 2ED 2018
|
ELECTROSTATICS - PART 5-2: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - USER GUIDE |
UNE EN ISO 14644-9 : 2014
|
CLEANROOMS AND ASSOCIATED CONTROLLED ENVIRONMENTS - PART 9: CLASSIFICATION OF SURFACE CLEANLINESS BY PARTICLE CONCENTRATION (ISO 14644-9:2012) |
08/30180398 DC : 0
|
BS EN 60747-16-5 - SEMICONDUCTOR DEVICES - PART 16-5: MICROWAVE INTEGRATED CIRCUITS - OSCILLATORS |
17/30355242 DC : 0
|
BS ISO 4586-5 - HIGH-PRESSURE DECORATIVE LAMINATES (HPL, HPDL) - SHEETS BASED ON THERMOSETTING RESINS (USUALLY CALLED LAMINATES) - PART 5: CLASSIFICATION AND SPECIFICATIONS FOR FLOORING GRADE LAMINATES LESS THAN 2 MM THICK INTENDED FOR BONDING TO SUPPORTING SUBSTRATES |
I.S. EN 61340-4-9:2016
|
ELECTROSTATICS - PART 4-9: STANDARD TEST METHODS FOR SPECIFIC APPLICATIONS - GARMENTS |
VDI 2083 Blatt 18 : 2012
|
Cleanroom technology - Biocontamination control
|
UNE EN 16812 : 2016
|
TEXTILES AND TEXTILE PRODUCTS - ELECTRICALLY CONDUCTIVE TEXTILES - DETERMINATION OF THE LINEAR ELECTRICAL RESISTANCE OF CONDUCTIVE TRACKS |
BS EN 60679-1 : 2017
|
PIEZOELECTRIC, DIELECTRIC AND ELECTROSTATIC OSCILLATORS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
16/30344800 DC : 0
|
BS EN 60749-3 - SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 3: EXTERNAL VISUAL EXAMINATION |
BS EN 61340-4-9 : 2016
|
ELECTROSTATICS - PART 4-9: STANDARD TEST METHODS FOR SPECIFIC APPLICATIONS - GARMENTS |
BS EN 61340-2-1 : 2015
|
ELECTROSTATICS - PART 2-1: MEASUREMENT METHODS - ABILITY OF MATERIALS AND PRODUCTS TO DISSIPATE STATIC ELECTRIC CHARGE |
13/30286163 DC : 0
|
BS EN 62435-2 - ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 2 - DETERIORATION MECHANISMS |
I.S. EN 61340-2-1:2015
|
ELECTROSTATICS - PART 2-1: MEASUREMENT METHODS - ABILITY OF MATERIALS AND PRODUCTS TO DISSIPATE STATIC ELECTRIC CHARGE |
VDI 2083-9-1 : 2006
|
CLEAN ROOM TECHNOLOGY - COMPATIBILITY WITH REQUIRED CLEANLINESS AND SURFACE CLEANLINESS |
BS EN 61192-1 : 2003
|
WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 1: GENERAL |
14/30288969 DC : 0
|
BS EN 61340-5-3 ED 2.0 - ELECTROSTATICS - PART 5-3: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - PROPERTIES AND REQUIREMENTS CLASSIFICATION FOR PACKAGING INTENDED FOR ELECTROSTATIC DISCHARGE SENSITIVE DEVICES |
BS EN 60286-3 : 2013
|
PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3: PACKAGING OF SURFACE MOUNT COMPONENTS ON CONTINUOUS TAPES |
14/30311058 DC : 0
|
BS EN 60747-16-1:AMD 2 - SEMICONDUCTOR DEVICES - PART 16-1: MICROWAVE INTEGRATED CIRCUITS - AMPLIFIERS |
08/30190157 DC : DRAFT SEP 2008
|
BS EN ISO 14644-9 - CLEANROOMS AND ASSOCIATED CONTROLLED ENVIRONMENTS - PART 9: CLASSIFICATION OF SURFACE PARTICLE CLEANLINESS |
BS IEC 60748-23-1 : 2002
|
SEMICONDUCTOR DEVICES - INTEGRATED CIRCUITS - HYBRID INTEGRATED CIRCUITS AND FILM STRUCTURES - MANUFACTURING LINE CERTIFICATION - GENERIC SPECIFICATION |
09/30214337 DC : 0
|
BS EN 60286-3 - PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3: PACKAGING OF SURFACE MOUNT COMPONENTS ON CONTINUOUS TAPES |
13/30286159 DC : 0
|
BS EN 62435-1 - ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 1: GENERAL |
BS EN 62258-1 : 2010
|
SEMICONDUCTOR DIE PRODUCTS - PART 1: PROCUREMENT AND USE |
BS EN 61340-4-6 : 2015
|
ELECTROSTATICS - PART 4-6: STANDARD TEST METHODS FOR SPECIFIC APPLICATIONS - WRIST STRAPS |
NBR IEC 61192-1 : 2008
|
WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 1: GENERAL |
BS EN 60747-16-5 : 2013
|
SEMICONDUCTOR DEVICES - PART 16-5: MICROWAVE INTEGRATED CIRCUITS - OSCILLATORS |
13/30286167 DC : 0
|
BS EN 62435-5 - ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 5 - DIE & WAFER DEVICES |
BS EN 61340-5-3 : 2015
|
ELECTROSTATICS - PART 5-3: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - PROPERTIES AND REQUIREMENTS CLASSIFICATIONS FOR PACKAGING INTENDED FOR ELECTROSTATIC DISCHARGE SENSITIVE DEVICES |
CEI EN 60747-16-3 : 2009
|
SEMICONDUCTOR DEVICES - PART 16-3: MICROWAVE INTEGRATED CIRCUITS - FREQUENCY CONVERTERS |
BS PD CLC/TR 61340-5-2 : 2008
|
ELECTROSTATICS - PART 5-2: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - USER GUIDE |
13/30267320 DC : 0
|
BS EN 61340-4-6 ED 2.0 - ELECTROSTATICS - PART 4-6: STANDARD TEST METHODS FOR SPECIFIC APPLICATIONS - WRIST STRAPS |
BS EN 60747-16-4 : 2004
|
SEMICONDUCTOR DEVICES - PART 16-4: MICROWAVE INTEGRATED CIRCUITS - SWITCHES |
ISO 18080-3 : 2015
|
TEXTILES - TEST METHODS FOR EVALUATING THE ELECTROSTATIC PROPENSITY OF FABRICS - PART 3: TEST METHOD USING MANUAL FRICTION |
BS EN 61760-4 : 2015
|
SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES |
SR CLC/TR 61340-5-2:2008
|
ELECTROSTATICS - PART 5-2: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - USER GUIDE |
I.S. EN 60747-16-3:2002
|
SEMICONDUCTOR DEVICES - PART 16-3: MICROWAVE INTEGRATED CIRCUITS - FREQUENCY CONVERTERS |
IEC TR 61340-5-2 : 1.0
|
ELECTROSTATICS - PART 5-2: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - USER GUIDE |
ISO TS 19880-1 : 2016
|
GASEOUS HYDROGEN - FUELLING STATIONS - PART 1: GENERAL REQUIREMENTS |
I.S. EN 60749-3:2017
|
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 3: EXTERNAL VISUAL EXAMINATION |
IEC TS 62239-2 : 1ED 2017
|
PROCESS MANAGEMENT FOR AVIONICS - MANAGEMENT PLAN - PART 2: PREPARATION AND MAINTENANCE OF AN ELECTRONIC COTS ASSEMBLY MANAGEMENT PLAN |
IEC TR 61340-1 : 1.0
|
ELECTROSTATICS - PART 1: ELECTROSTATIC PHENOMENA - PRINCIPLES AND MEASUREMENTS |
IEC 61760-4 : 1ED 2015
|
SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES |
CEI EN 61760-1 : 2007
|
SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS) |
I.S. EN 61340-5-3:2015
|
ELECTROSTATICS - PART 5-3: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - PROPERTIES AND REQUIREMENTS CLASSIFICATION FOR PACKAGING INTENDED FOR ELECTROSTATIC DISCHARGE SENSITIVE DEVICES |
I.S. EN 62258-1:2010
|
SEMICONDUCTOR DIE PRODUCTS - PART 1: PROCUREMENT AND USE |
I.S. EN ISO 14644-9:2012
|
CLEANROOMS AND ASSOCIATED CONTROLLED ENVIRONMENTS - PART 9: CLASSIFICATION OF SURFACE CLEANLINESS BY PARTICLE CONCENTRATION (ISO 14644-9:2012) |
EN 60747-16-3 : 2002 AMD 2 2017
|
SEMICONDUCTOR DEVICES - PART 16-3: MICROWAVE INTEGRATED CIRCUITS - FREQUENCY CONVERTERS (IEC 60747-16-3:2002/A2:2017) |
EN 60679-1 : 2017
|
PIEZOELECTRIC, DIELECTRIC AND ELECTROSTATIC OSCILLATORS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION (IEC 60679-1:2017) |
EN 60747-16-4 : 2004 AMD 2 2017
|
SEMICONDUCTOR DEVICES - PART 16-4: MICROWAVE INTEGRATED CIRCUITS - SWITCHES (IEC 60747-16-4:2004/A2:2017) |
I.S. EN 62435-5:2017
|
ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 5: DIE AND WAFER DEVICES |
I.S. EN 16812:2016
|
TEXTILES AND TEXTILE PRODUCTS - ELECTRICALLY CONDUCTIVE TEXTILES - DETERMINATION OF THE LINEAR ELECTRICAL RESISTANCE OF CONDUCTIVE TRACKS |
CEI EN 60679-1 : 2009
|
PIEZOELECTRIC, DIELECTRIC AND ELECTROSTATIC OSCILLATORS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
BS EN 60747-16-1 : 2002
|
SEMICONDUCTOR DEVICES - PART 16-1: MICROWAVE INTEGRATED CIRCUITS - AMPLIFIERS |
BS EN 60747-16-3 : 2002
|
SEMICONDUCTOR DEVICES - PART 16-3: MICROWAVE INTEGRATED CIRCUITS - FREQUENCY CONVERTERS |
I.S. EN 61192-1:2003
|
WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - GENERAL |
I.S. EN 60679-1:2017
|
PIEZOELECTRIC, DIELECTRIC AND ELECTROSTATIC OSCILLATORS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
CEI CLC/TR 62258-3 : 2007
|
SEMICONDUCTOR DIE PRODUCTS - PART 3: RECOMMENDATIONS FOR GOOD PRACTICE IN HANDLING, PACKING AND STORAGE |
I.S. EN 60286-3:2013
|
PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3: PACKAGING OF SURFACE MOUNT COMPONENTS ON CONTINUOUS TAPES (IEC 60286-3:2013 (EQV)) |
CEI EN 61760-4 : 2016
|
SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES |
ARINC 606A : 2004
|
GUIDANCE FOR ELECTROSTATIC SENSITIVE DEVICE UTILIZATION AND PROTECTION |
I.S. EN 61760-4:2015
|
SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES |
VDI 2119 : 2013
|
AMBIENT AIR MEASUREMENTS - SAMPLING OF ATMOSPHERIC PARTICLES > 2,5 [MU]M ON AN ACCEPTOR SURFACE USING THE SIGMA-2 PASSIVE SAMPLER - CHARACTERISATION BY OPTICAL MICROSCOPY AND CALCULATION OF NUMBER SETTLING RATE AND MASS CONCENTRATION |
IEC TS 62686-1 : 2.0
|
PROCESS MANAGEMENT FOR AVIONICS - ELECTRONIC COMPONENTS FOR AEROSPACE, DEFENCE AND HIGH PERFORMANCE (ADHP) APPLICATIONS - PART 1: GENERAL REQUIREMENTS FOR HIGH RELIABILITY INTEGRATED CIRCUITS AND DISCRETE SEMICONDUCTORS |
UNI EN ISO 14644-9 : 2012
|
CLEANROOMS AND ASSOCIATED CONTROLLED ENVIRONMENTS - PART 9: CLASSIFICATION OF SURFACE CLEANLINESS BY PARTICLE CONCENTRATION |
I.S. EN 60747-16-5:2013
|
SEMICONDUCTOR DEVICES - PART 16-5: MICROWAVE INTEGRATED CIRCUITS - OSCILLATORS (IEC 60747-16-5:2013 (EQV)) |
ISO TS 20100 : 2008
|
GASEOUS HYDROGEN - FUELLING STATIONS |
CEI EN 60749-3 : 2004
|
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 3: EXTERNAL VISUAL EXAMINATION |
CEI EN 60749-16 : 2005
|
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 16: PARTICLE IMPACT NOISE DETECTION (PIND) |
CEI CLC/TR 61340-5-2 : 2010
|
ELECTROSTATICS - PART 5-2: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - USER GUIDE |
IEC 60748-23-1 : 1.0
|
SEMICONDUCTOR DEVICES - INTEGRATED CIRCUITS - PART 23-1: HYBRID INTEGRATED CIRCUITS AND FILM STRUCTURES - MANUFACTURING LINE CERTIFICATION - GENERIC SPECIFICATION |
ISO 4586-5 : 2015
|
HIGH-PRESSURE DECORATIVE LAMINATES (HPL, HPDL) - SHEETS BASED ON THERMOSETTING RESINS (USUALLY CALLED LAMINATES) - PART 5: CLASSIFICATION AND SPECIFICATIONS FOR FLOORING GRADE LAMINATES LESS THAN 2 MM THICK INTENDED FOR BONDING TO SUPPORTING SUBSTRATES |
I.S. EN 60747-16-4:2004
|
SEMICONDUCTOR DEVICES - PART 16-4: MICROWAVE INTEGRATED CIRCUITS - SWITCHES |
IEC 60748-23-3 : 1.0
|
SEMICONDUCTOR DEVICES - INTEGRATED CIRCUITS - PART 23-3: HYBRID INTEGRATED CIRCUITS AND FILM STRUCTURES - MANUFACTURING LINE CERTIFICATION - MANUFACTURERS' SELF-AUDIT CHECKLIST AND REPORT |
IEC 60749-3 : 2.0
|
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 3: EXTERNAL VISUAL EXAMINATION |
IEC 60747-16-2 : 1.1
|
SEMICONDUCTOR DEVICES - PART 16-2: MICROWAVE INTEGRATED CIRCUITS - FREQUENCY PRESCALERS |
IEC TR 62258-3 : 2.0
|
SEMICONDUCTOR DIE PRODUCTS - PART 3: RECOMMENDATIONS FOR GOOD PRACTICE IN HANDLING, PACKING AND STORAGE |
IEC 61191-1 : 2.0
|
PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES |
IEC TS 62239-1 : 2.0
|
PROCESS MANAGEMENT FOR AVIONICS - MANAGEMENT PLAN - PART 1: PREPARATION AND MAINTENANCE OF AN ELECTRONIC COMPONENTS MANAGEMENT PLAN |
EN 61760-4 : 2015 AMD 1 2018
|
SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES (IEC 61760-4:2015/A1:2018) |
IEC 60679-1 : 2017
|
PIEZOELECTRIC, DIELECTRIC AND ELECTROSTATIC OSCILLATORS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
I.S. EN 61340-5-2:1999
|
ELECTROSTATICS - PART 5-2: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - USER GUIDE |
VDI 2083-17 : 2013
|
CLEANROOM TECHNOLOGY - COMPATIBILITY OF MATERIALS WITH THE REQUIRED CLEANLINESS |
IEC TS 62239 : 2.0
|
PROCESS MANAGEMENT FOR AVIONICS - PREPARATION OF AN ELECTRONIC COMPONENTS MANAGEMENT PLAN |
EN 60747-16-1 : 2002 AMD 2 2017
|
SEMICONDUCTOR DEVICES - PART 16-1: MICROWAVE INTEGRATED CIRCUITS - AMPLIFIERS (IEC 60747-16-1:2001/A2:2017) |
DIN EN 14125 : 2013
|
THERMOPLASTIC AND FLEXIBLE METAL PIPEWORK FOR UNDERGROUND INSTALLATION AT PETROL FILLING STATIONS |
DIN EN 14125 E : 2013
|
THERMOPLASTIC AND FLEXIBLE METAL PIPEWORK FOR UNDERGROUND INSTALLATION AT PETROL FILLING STATIONS |
IEC 62258-1 : 2.0
|
SEMICONDUCTOR DIE PRODUCTS - PART 1: PROCUREMENT AND USE |
IEC 60747-16-5 : 1ED 2013
|
SEMICONDUCTOR DEVICES - PART 16-5: MICROWAVE INTEGRATED CIRCUITS - OSCILLATORS |
DD ISO/TS 20100 : 2008
|
GASEOUS HYDROGEN - FUELLING STATIONS |
17/30365636 DC : 0
|
BS EN 62239-1 ED.1.0 - PROCESS MANAGEMENT FOR AVIONICS - MANAGEMENT PLAN - PART 1: PREPARATION AND MAINTENANCE OF AN ELECTRONIC COMPONENTS MANAGEMENT PLAN |
BS PD IEC TS 62239-1 : 2015
|
PROCESS MANAGEMENT FOR AVIONICS - MANAGEMENT PLAN - PART 1: PREPARATION AND MAINTENANCE OF AN ELECTRONIC COMPONENTS MANAGEMENT PLAN |
DD IEC PAS 62686-1 : DRAFT JULY 2011
|
PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE QUALIFIED ELECTRONIC COMPONENTS (AQEC) - PART 1: GENERAL REQUIREMENTS FOR HIGH RELIABILITY INTEGRATED CIRCUITS AND DISCRETE SEMICONDUCTORS |
IEC 60747-16-3 : 1.2
|
SEMICONDUCTOR DEVICES - PART 16-3: MICROWAVE INTEGRATED CIRCUITS - FREQUENCY CONVERTERS |
IEC 61340-2-1 : 2.0
|
ELECTROSTATICS - PART 2-1: MEASUREMENT METHODS - ABILITY OF MATERIALS AND PRODUCTS TO DISSIPATE STATIC ELECTRIC CHARGE |
IEC PAS 62686-1 : 1.0
|
PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE QUALIFIED ELECTRONIC COMPONENTS (AQEC) - PART 1: GENERAL REQUIREMENTS FOR HIGH RELIABILITY INTEGRATED CIRCUITS AND DISCRETE SEMICONDUCTORS |
BS EN 61191-1 : 2013
|
PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES |
15/30327712 DC : 0
|
BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES |
ISO 14644-9 : 2012
|
CLEANROOMS AND ASSOCIATED CONTROLLED ENVIRONMENTS - PART 9: CLASSIFICATION OF SURFACE CLEANLINESS BY PARTICLE CONCENTRATION |
IEC 62435-5 : 1ED 2017
|
ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 5: DIE AND WAFER DEVICES |
11/30211394 DC : DRAFT MAR 2011
|
BS ISO 20100 - GASEOUS HYDROGEN - FUELLING STATIONS |
11/30255124 DC : 0
|
BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES |
IEC 61340-4-9 : 2.0
|
ELECTROSTATICS - PART 4-9: STANDARD TEST METHODS FOR SPECIFIC APPLICATIONS - GARMENTS |
IEC 62435-1 : 1ED 2017
|
ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 1: GENERAL |
IEC 60747-16-4:2004+AMD1:2009+AMD2:2017
|
SEMICONDUCTOR DEVICES - PART 16-4: MICROWAVE INTEGRATED CIRCUITS - SWITCHES |
UNE EN 14125 : 2013
|
THERMOPLASTIC AND FLEXIBLE METAL PIPEWORK FOR UNDERGROUND INSTALLATION AT PETROL FILLING STATIONS |
IEC 62435-2 : 1ED 2017
|
ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 2: DETERIORATION MECHANISMS |
IEC 61340-4-6 : 2.0
|
ELECTROSTATICS - PART 4-6: STANDARD TEST METHODS FOR SPECIFIC APPLICATIONS - WRIST STRAPS |
BS EN 14125 : 2013
|
THERMOPLASTIC AND FLEXIBLE METAL PIPEWORK FOR UNDERGROUND INSTALLATION AT PETROL FILLING STATIONS |
IEC 60286-3 : 5.0
|
PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3: PACKAGING OF SURFACE MOUNT COMPONENTS ON CONTINUOUS TAPES |
BS EN 62435-5 : 2017
|
ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 5: DIE AND WAFER DEVICES |
BS PD IEC TS 62686-1 : 2015
|
PROCESS MANAGEMENT FOR AVIONICS - ELECTRONIC COMPONENTS FOR AEROSPACE, DEFENCE AND HIGH PERFORMANCE (ADHP) APPLICATIONS - PART 1: GENERAL REQUIREMENTS FOR HIGH RELIABILITY INTEGRATED CIRCUITS AND DISCRETE SEMICONDUCTORS |
18/30359998 DC : 0
|
BS ISO 19880-1 - GASEOUS HYDROGEN - FUELLING STATIONS - PART 1: GENERAL REQUIREMENTS |
IEC 61340-5-3 : 2.0:2015
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ELECTROSTATICS - PART 5-3: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - PROPERTIES AND REQUIREMENTS CLASSIFICATION FOR PACKAGING INTENDED FOR ELECTROSTATIC DISCHARGE SENSITIVE DEVICES |
EN 60747-16-5 : 2013
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SEMICONDUCTOR DEVICES - PART 16-5: MICROWAVE INTEGRATED CIRCUITS - OSCILLATORS (IEC 60747-16-5:2013) |