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IEC PAS 62050:2004

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

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superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

Board level drop test method of components for handheld electronic products

Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Superseded date

01-30-2008

Language(s)

English

Published date

11-10-2004

FOREWORD
Introduction
1 Scope
2 Apparatus
3 Terms and definitions
4 Applicable documents
5 Test Components and Board
6 Test Procedure
7 Failure criteria and failure analysis
8 Reporting
Annex A (informative) Recommended Testing Hardware

The Board Level Drop Test Method is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize the test board and test methodology to provide a reproducible assessment of the drop test performance of surface mounted components while duplicating the failure modes normally observed during product level test.The purpose of this document is to prescribe a standardized test method and reporting procedure.

DevelopmentNote
Also numbered as EIA JESD 22-B111. (11/2004)
DocumentType
Miscellaneous Product
Pages
18
PublisherName
International Electrotechnical Committee
Status
Superseded
SupersededBy

Standards Relationship
NEN NPR IEC/PAS 62050 : 2004 Identical
DD IEC PAS 62050 : DRAFT 2004 Identical

IPC A 600 : H ACCEPTABILITY OF PRINTED BOARDS
IPC J STD 033C-1:2014 HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES
IPC 9701 : A PERFORMANCE TEST METHODS AND QUALIFICATION REQUIREMENTS FOR SURFACE MOUNT SOLDER ATTACHMENTS
IPC SM 782 : A1993 AMD 2 1999 SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD

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