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IEC PAS 62326-14:2010

IEC PAS 62326-14:2010

Withdrawn

Withdrawn

A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

Printed boards - Part 14: Device embedded substrate - Terminology / reliability / design guide

Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Withdrawn date

12-31-2021

Language(s)

English

Published date

09-29-2010

Publisher

International Electrotechnical Committee

FOREWORD
1 Scope
2 Normative references
3 General definitions
4 Test methods
5 Test items and test equipment
6 Indication, packaging and storage
7 Design guide
Annex A (informative) - Specimen for surface resistance
        measurement of electronic circuit board
Annex B (informative) - Insulation resistance measurement
        of inner layer of electronic circuit board
Annex C (informative) - Specimen for interlayer insulation
        resistance measurement for multilayer circuit
        board
Annex D (informative) - Electronic wiring board product
        system
Annex E (informative) - Steps of electronic circuit board
        assembly and main applications
Bibliography

IEC/PAS 62326-14:2010(E) is applicable to device embedded substrates fabricated by embedding discrete active and passive electronic devices into an inner layer of a substrate with electric connections by vias, conductor plating, conductive paste, and printing. The device embedded substrate may be used as a substrate to mount SMDs to form electronic circuits, as conductor and insulator layers may be formed after embedding electronic devices. The purpose of this PAS is to obtain common understanding in design, fabrication and use of device embedded substrates in the industry. This PAS describes the substrate embedding devices including but not limited to module, integrated passive device (IPD), microelectrochemical systems (MEMS), discrete component formed in the fabrication process of the electronic wiring board, and sheet form component. This PAS does not specify the fabrication process of device embedded substrates, via diameter/via land diameter, conductor width/conductor spacing nor conductor line density.

DevelopmentNote
Stability Date: 2014. (10/2012)
DocumentType
Miscellaneous Product
Pages
62
PublisherName
International Electrotechnical Committee
Status
Withdrawn

Standards Relationship
DD IEC/PAS 62326-14:2010 Identical
NEN NPR IEC/PAS 62326-14 : 2010 Identical

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Hardcopy - English
PDF - English
PDF 3 Users - English
PDF 5 Users - English
PDF 9 Users - English
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