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IEEE 1505.1-2008

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

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superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

IEEE Standard for the Common Test Interface Pin Map Configuration for High-Density, Single-Tier Electronics Test Requirements Utilizing IEEE Std 1505

Available format(s)

PDF

Superseded date

08-26-2019

Language(s)

English

Published date

08-01-2013

1 Overview
2 Normative references
3 Definitions, acronyms, and abbreviations
4 Common test interface requirements
Annex A (normative) - Common test interface signal
        definitions for pin map
Annex B (informative) - Bibliography
Annex C (informative) - IEEE List of Participants

Pertains to military and aerospace automatic test equipment (ATE) testing applications.

Committee
SCC20 - Test and Diagnosis for Electronic Sys
DevelopmentNote
Also numbered as IEC 63003. (12/2015)
DocumentType
Standard
Pages
170
PublisherName
Institute of Electrical & Electronics Engineers
Status
Superseded
SupersededBy
Supersedes

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BS IEC 61671:2012 IEEE standard for automatic test markup language (ATML) for exchanging automatic test equipment and test information via XML
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IEEE 260.3-1993 American National Standard Mathematical Signs and Symbols for Use in Physical Sciences and Technology
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IEEE 260.1 : 2004 LETTER SYMBOLS FOR UNITS OF MEASUREMENT (SI UNITS, CUSTOMARY INCH-POUND UNITS, AND CERTAIN OTHER UNITS)
IEEE 945-1984 IEEE Recommended Practice for Preferred Metric Units for Use in Electrical and Electronics Science and Technology
IEEE/ASTM SI_10-2010 American National Standard for Metric Practice
MIL-DTL-55302-180 Revision C:2008 Connectors, Printed Circuit Subassembly and Accessories: 4 Row, Receptacle Assemblies, Right Angle, 100 through 684 Contact Positions, for Printed Wiring Boards (.100 Spacing)
MIL C 83733 : C CONNECTOR, ELECTRICAL, MINIATURE, RECTANGULAR TYPE, RACK TO PANEL, ENVIRONMENT RESISTING, 200 DEGREES C TOTAL CONTINUOUS OPERATING TEMPERATURE, GENERAL SPECIFICATION FOR
IEEE 315 : 1975 GRAPHIC SYMBOLS FOR ELECTRICAL AND ELECTRONICS DIAGRAMS (INCLUDING REFERENCE DESIGNATION LETTERS)
MIL-HDBK-217 Revision F:1991 RELIABILITY PREDICTION OF ELECTRONIC EQUIPMENT
MIL-DTL-55302-179 Revision C:2007 Connectors, Printed Circuit Subassembly and Accessories: 4 Row, Pin Assemblies, 100 through 684 Contact Positions, for Printed Wiring Boards(.100 Spacing)
IEEE 1149.1-2013 REDLINE IEEE Standard for Test Access Port and Boundary-Scan Architecture

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