IPC 2222 : A
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS
Hardcopy
02-05-2021
English
1 SCOPE
2 APPLICABLE DOCUMENTS
3 GENERAL REQUIREMENTS
4 MATERIALS
5 MECHANICAL/PHYSICAL PROPERTIES
6 ELECTRICAL PROPERTIES
7 THERMAL MANAGEMENT
8 COMPONENT AND ASSEMBLY ISSUES
9 HOLE/INTERCONNECTIONS
10 GENERAL CIRCUIT FEATURE REQUIREMENTS
11 DOCUMENTATION
12 QUALITY ASSURANCE
Pertains to single-sided, double-sided or multi-layered boards. Key concepts in this document are: rigid laminate properties, design requirements for printed board assembly and design requirements for holes/interconnections.
Committee |
D-30
|
DevelopmentNote |
To be used in conjunction with IPC 2221. Supersedes IPC D 949 & IPC ML 910. Together with IPC 2221 & IPC 2223 supersedes IPC D 249 & IPC D 275. Included in IPC 2220, IPC C 106, IPC C 105 & IPC C 1000. (12/2010) Also available in German, Chinese & French Languages, See IPC 2222 GERMAN, CHINESE & FRENCH. (08/2015)
|
DocumentType |
Standard
|
Pages |
44
|
PublisherName |
Institute of Printed Circuits
|
Status |
Superseded
|
SupersededBy | |
Supersedes |
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16/30282633 DC : 0 | BS EN 50155 - RAILWAY APPLICATIONS - ELECTRONIC EQUIPMENT USED ON ROLLING STOCK |
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IPC J STD 001 TURKISH : E2010 | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
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IPC 9241 : 2016 | GUIDELINES FOR MICROSECTION PREPARATION |
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MIL STD 11991 : A | GENERAL STANDARD FOR PARTS, MATERIALS, AND PROCESSES |
NASA KSC E 165 : 2009 | ELECTRICAL GROUND SUPPORT EQUIPMENT FABRICATION, SPECIFICATION FOR |
IEC PAS 62647-1:2011 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Lead-free management |
EN 50155:2017 | Railway applications - Rolling stock - Electronic equipment |
CSA N290.14 : 2015 | QUALIFICATION OF DIGITAL HARDWARE AND SOFTWARE FOR USE IN INSTRUMENTATION AND CONTROL APPLICATIONS FOR NUCLEAR POWER PLANTS |
DSCC 10013 : 0 | PRINTED WIRING BOARD, RIGID, MULTILAYERED, TYPE 3 WITH PLATED-THROUGH HOLES |
DSCC 10014 : 0 | PRINTED WIRING BOARD, RIGID, MULTILAYERED, TYPE 4 WITH BLIND AND BURIED VIAS |
I.S. EN 16602-70-12:2016 | SPACE PRODUCT ASSURANCE - DESIGN RULES FOR PRINTED CIRCUIT BOARDS |
PD IEC/TS 62647-1:2012 | Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Preparation for a lead-free control plan |
NASA JSC 27301 : 2009 | MATERIALS AND PROCESSES SELECTION, CONTROL, AND IMPLEMENTATION PLAN FOR JSC FLIGHT HARDWARE |
GEIA STD 0005-1 : 2012 | PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER |
NASA KSC DE 512-SM : 2012 | FACILITY SYSTEMS, GROUND SUPPORT SYSTEMS, AND GROUND SUPPORT EQUIPMENT GENERAL DESIGN REQUIREMENTS |
PD IEC/PAS 62647-1:2011 | Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Lead-free management |
BS EN 16602-70-12:2016 | Space product assurance. Design rules for printed circuit boards |
NASA MSFC STD 3425 : 2006 | MULTIPROGRAM/PROJECT COMMON-USE DOCUMENT DESIGN STANDARD FOR RIGID PRINTED CIRCUIT BOARDS AND ASSEMBLIES |
I.S. EN 50155:2017-11 | RAILWAY APPLICATIONS - ROLLING STOCK - ELECTRONIC EQUIPMENT |
BS EN 50155:2017 | Railway applications. Rolling stock. Electronic equipment |
IEC TS 62647-1:2012 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan |
MIL-DTL-22442 Revision G:2009 | CABLE ASSEMBLIES, AIRCRAFT AUDIO, GENERAL SPECIFICATION FOR |
EN 16602-70-12:2016 | Space product assurance - Design rules for printed circuit boards |
ASME Y14.24 : 2012 | TYPES AND APPLICATIONS OF ENGINEERING DRAWINGS - ENGINEERING DRAWING AND RELATED DOCUMENTATION PRACTICES |
IPC T 50 : M | TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS |
IPC 2152 : 0 | STANDARD FOR DETERMINING CURRENT CARRYING CAPACITY IN PRINTED BOARD DESIGN |
IPC TM 650 : 0 | TEST METHODS MANUAL |
IPC 4101 : D | SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS |
IPC 2221B:2012 | GENERIC STANDARD ON PRINTED BOARD DESIGN |
IPC D 279 : 0 | DESIGN GUIDELINES FOR RELIABLE SURFACE MOUNT TECHNOLOGY PRINTED BOARD ASSEMBLIES |
IPC 4562 : A | METAL FOIL FOR PRINTED BOARD APPLICATIONS |
IPC 4411 : A | SPECIFICATION AND CHARACTERIZATION METHODS FOR NONWOVEN PARA-ARAMID REINFORCEMENT |
IPC 4103 : A | SPECIFICATION FOR BASE MATERIALS FOR HIGH SPEED/HIGH FREQUENCY APPLICATIONS |
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