IPC 2226 : 0

Superseded

View Superseded by

SECTIONAL DESIGN STANDARD FOR HIGH DENSITY INTERCONNECT (HDI) PRINTED BOARDS

Available format(s)

Hardcopy

Superseded date

08-11-2023

Language(s)

English

Publisher

Institute of Printed Circuits

1 SCOPE
2 APPLICABLE DOCUMENTS
3 GENERAL REQUIREMENTS
4 MATERIALS
5 MECHANICAL/PHYSICAL PROPERTIES
6 ELECTRICAL PROPERTIES
7 THERMAL MANAGEMENT
8 COMPONENT AND ASSEMBLY ISSUES
9 HOLES/INTERCONNECTIONS
10 GENERAL CIRCUIT FEATURE
REQUIREMENTS
11 DOCUMENTATION
12 QUALITY ASSURANCE

Sets up requirements and considerations for the design of organic and inorganic high density interconnect (HDI) printed boards and structures for component mounting and interconnections.

Committee	D-30
DevelopmentNote	To be used in conjunction with IPC 2221. (09/2005) Also available in Hardcopy format. (01/2018)
DocumentType	Standard
Pages	60
PublisherName	Institute of Printed Circuits
Status	Superseded
SupersededBy	IPC-2226A:2017

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