Name: IPC 2584 : 2007
Brand: IPC

IPC 2584 : 2007

Superseded

View Superseded by

SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF PRINTED BOARD FABRICATION DATA DESCRIPTION

Available format(s)

Hardcopy

Superseded date

09-13-2023

Language(s)

English

Published date

02-19-2021

Publisher

Institute of Printed Circuits

1 SCOPE
  1.1 Intent
  1.2 Interpretation
2 APPLICABLE DOCUMENTS
3 REQUIREMENTS
  3.1 Terms and Definitions
  3.2 Categories and Content
4 GENERAL RULES
  4.1 File Content Descriptions
  4.2 Logistic Descriptions
  4.3 File History Descriptions
       4.3.1 HistoryRecord Use Case - Initial Design Release
       4.3.2 Supply Chain Modifications
       4.3.3 OEM Reviews Modifications
  4.4 BOM (Board Fabrication Materials)
  4.5 AVL (Board Material Suppliers)
  4.6 Documentation Layers
       4.6.1 Documentation Layer Restrictions
       4.6.2 Reference to IPC-2614
       4.6.3 Step Usage
       4.6.4 Set
  4.7 Design for eXcellence (Dfx) Analysis
       4.7.1 DfxMeasurement
  4.8 Miscellaneous Image Layers
       4.8.1 Step usage
  4.9 Packages and Land Patterns
       4.9.1 Step Usage for Component Packages and Land
              Patterns
       4.9.2 Land Pattern Details
  4.10 Solder Mask and Legend Layers
       4.10.1 Solder Mask Details
       4.10.2 Legend details
       4.10.3 Step Usage for Solder Mask and Legend Layers
  4.11 Drilling and Routing (Tooling) Layers
       4.11.1 Drilling Details
       4.11.2 Routing Details
       4.11.3 Step Usage for Drilling and Routing
  4.12 Net List
       4.12.1 Step Usage for Net List
  4.13 Outer Conductive Layers
       4.13.1 Outer Conductive Layer Details
       4.13.2 Step Usage for Outer Conductive Layers
  4.14 Inner Conductive Layers
       4.14.1 Inner Conductive Layer Details
       4.14.2 Step Usage for Inner Conductive Layers
  4.15 Board Construction
       4.15.1 Board Construction Details
       4.15.2 Step Usage for Board Construction
5 MODELING
  5.1 Information Models
6 REPORT GENERATORS
  6.1 Hole Usage Report
  6.2 Pad Usage Report
  6.3 Conductor Usage Report
7 REFERENCE INFORMATION
  7.1 IPC
  7.2 American National Standards Institute
  7.3 Department of Defense
  7.4 Electronic Industries Association
  7.5 International Electrotechnical Commission (IEC)
  7.6 International Organization for Standards (ISO)
APPENDIX A - PRINTED BOARD FABRICATION SCHEMA

Specifies the XML schema that represents the intelligent data file format used to describe printed board fabrication data description. This format may be used for transmitting information between a printed board designer and a manufacturing or assembly facility.

DevelopmentNote	IPC 2581 is a mandatory part of this standard. (08/2007)
DocumentType	Standard
Pages	0
PublisherName	Institute of Printed Circuits
Status	Superseded
SupersededBy	IPC 2584 : 2021

BS EN 61182-2-2:2012	Printed board assembly products. Manufacturing description data and transfer methodology Sectional requirements for implementation of printed board fabrication data description
I.S. EN 61182-2-2:2012	PRINTED BOARD ASSEMBLY PRODUCTS - MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY - PART 2-2: SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF PRINTED BOARD FABRICATION DATA DESCRIPTION (IEC 61182-2-2:2012 (EQV))
EN 61182-2-2:2012	Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description
IEC 61182-2-2:2012	Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description

ANSI Y14.5 : 1973	DIMENSIONING AND TOLERANCING FOR ENGINEERING DRAWINGS
IPC T 50 : M	TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
IEC 61182-2:2006	Printed board assembly products - Manufacturing description data and transfer methodology - Part 2: Generic requirements
IPC 2582 : 2007	SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF ADMINISTRATIVE METHODS FOR MANUFACTURING DATA DESCRIPTION
IPC 2614 : 0	SECTIONAL REQUIREMENTS FOR BOARD FABRICATION DOCUMENTATION
IPC 2583 : 2007	SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF DESIGN CHARACTERISTICS FOR MANUFACTURING DATA DESCRIPTION
ANSI Z210.1 : LATEST	METRIC PRACTICE GUIDE
ANSI INCITS TR 1 : 1982	DICTIONARY FOR INFORMATION PROCESSING - AMERICAN NATIONAL
IPC 7351 : B	GENERIC REQUIREMENTS FOR SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD
IPC 2588 : 2007	SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF PART LIST PRODUCT DATA DESCRIPTION
IPC 2581 : B	GENERIC REQUIREMENTS FOR PRINTED BOARD ASSEMBLY PRODUCTS MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY