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IPC 4104 : 1999

Current

Current

The latest, up-to-date edition.

SPECIFICATION FOR HIGH DENSITY INTERCONNECT (HDI) AND MICROVIA MATERIALS

Published date

05-01-1999

1 SCOPE
  1.1 General
  1.2 Designation System
  1.3 Application Levels
2 APPLICABLE DOCUMENTS
  2.1 IPC
  2.2 American Society for Testing and Materials
       (ASTM)
  2.3 Underwriters Laboratories (UL)
  2.4 American National Standards Institute (ANSI)
3 REQUIREMENTS
  3.1 Terms and Definitions
  3.2 Specification Sheets
  3.3 Manufacturer's Quality Profile
  3.4 Qualification (Characterization) Testing
  3.5 Verification of Material Supplier's Quality
       System
  3.6 Conflict
  3.7 Materials
  3.8 General Acceptability
  3.9 Mechanical Requirements
  3.10 Chemical Requirements
  3.11 Electrical Requirements
  3.12 Environmental Requirements
  3.13 Non-Nutrient
  3.14 Workmanship
  3.15 Material Safety Data Sheets
  3.16 Shelf Life
  3.17 Marking
4 QUALITY ASSURANCE PROVISIONS
  4.1 Quality System
  4.2 Responsibility for Inspection
  4.3 Qualification (Characterization) Testing
  4.4 Quality Conformance Inspection
  4.5 Statistical Process Control (SPC)
5 PREPARATION FOR DELIVERY
  5.1 Packaging
6 NOTES
  6.1 Ordering Data
  6.2 References
APPENDIX A

Describes various conductive and dielectric materials for use in fabricating HDI and microvias. Defines qualification and conformance requirements for materials such as photoimageable dielectric dry films and liquids, epoxy blends and coated foils.

DevelopmentNote
Supersedes IPC JPCA 4104. (06/2002) Included in IPC C 107. (06/2008) Included in IPC C 1000. (07/2008)
DocumentType
Standard
PublisherName
Institute of Printed Circuits
Status
Current
Supersedes

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