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IPC 4121 : 0

Current

Current

The latest, up-to-date edition.

GUIDELINES FOR SELECTING CORE CONSTRUCTIONS FOR MULTILAYER PRINTED WIRING BOARD APPLICATIONS

Published date

01-01-2000

1 SCOPE
  1.1 Purpose
  1.2 Recommendations
  1.3 Clarifications
2 APPLICABLE DOCUMENTS
  2.1 IPC
3 TERMS AND DEFINITIONS
  3.1 Registration Number (REG#)
  3.2 Thickness
  3.3 Construction
  3.4 Resin Content (% RC)
  3.5 Dielectric Constant (DK)
  3.6 Dielectric Constant Tolerances (DK TOL)
  3.7 Dimensional Stability
  3.8 Coefficient of Thermal Expansion (Z-CTE)
  3.9 Thickness Tolerance (THICK TOL)
  3.10 Chemical Resistance (CHEM)
  3.11 Measling (MEASLE)
  3.12 Availability (AVAIL)
  3.13 Cost
  3.14 Flatness (FLAT)
  3.15 Smoothness (SMOOTH)
  3.16 Drillability (DRILL)
4 RECOMMENDATIONS
  4.1 Thickness Categories
  4.2 Construction Comparison

Provides industry-approved guidelines for selecting core constructions for multilayer printed wiring boards (PWBs). The specification sheets in the document categorize the different core constructions by laminate type and nominal thickness. The constructions are rated for characteristics such as dielectric constant (DK), dimensional stability (DS), flatness, smoothness and drillability.

DevelopmentNote
Supersedes IPC CC 110. (07/2001) Included in IPC C 107 & IPC C 1000. (07/2008)
DocumentType
Standard
PublisherName
Institute of Printed Circuits
Status
Current
Supersedes

IPC 4101 CHINESE : C2009 SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS
IPC 4101 GERMAN : C SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS
BS EN 16602-70-12:2016 Space product assurance. Design rules for printed circuit boards
EN 16602-70-12:2016 Space product assurance - Design rules for printed circuit boards
IPC TA 721 : 1988 TECHNOLOGY ASSESSMENT HANDBOOK ON MULTILAYER BOARDS

IPC 2220 : LATEST IPC 2220 FAMILY OF DESIGN DOCUMENTS
IPC M 107 : LATEST STANDARDS FOR PRINTED BOARD MATERIALS MANUAL
IPC M 106 : LATEST TECHNOLOGY REFERENCE FOR DESIGN MANUAL

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