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IPC 6015 : 0

Current
Current

The latest, up-to-date edition.

QUALIFICATION AND PERFORMANCE SPECIFICATION FOR ORGANIC MULTICHIP MODULE MOUNTING AND INTERCONNECTING STRUCTURES
Available format(s)

Hardcopy

Language(s)

English

Published date

02-01-1998

Publisher

Institute of Printed Circuits

1.0 SCOPE
     1.1 Scope
     1.2 Purpose
     1.3 Performance Classification
     1.4 Documentation Hierarchy
2.0 APPLICABLE DOCUMENTS
     2.1 Mandatory Documents
     2.2 Supplemental Documents
3.0 REQUIREMENTS
     3.1 General
     3.2 Materials Used in this Specification
     3.3 Visual Examination
     3.4 Dimensional Requirements
     3.5 Conductor Definition
     3.6 Structural Integrity Prior to Stress
     3.7 Structural Integrity After Thermal Stress
     3.8 Solder Resist (Solder Mask) Requirements
     3.9 Electrical Properties
     3.10 Environmental
     3.11 Special Requirements
     3.12 Repair
4.0 QUALITY ASSURANCE
     4.1 General
     4.2 Quality Conformance Inspection
Figures
Tables

Visual requirements for organic substrates used to interconnect chip components, specifically single-chip modules and multi-chip modules (MCM-L). This standard covers quality and reliability requirements for plating, conductors, structural integrity, electrical properties, insulation resistance, and more. Includes test methods.

DevelopmentNote
Supersedes IPC RF 245. (12/2001) To be used with IPC 6011. (06/2002) Included in IPC 6010 SERIES. (09/2003)
DocumentType
Standard
Pages
25
PublisherName
Institute of Printed Circuits
Status
Current

IEC PAS 62250:2001 Qualification and performance specification for rigid printed boards (IPC 6012A with Amendment 1)
IPC 2225 : 0 SECTIONAL DESIGN STANDARD FOR ORGANIC MULTICHIP MODULES (MCM-L) AND MCM-L ASSEMBLIES
IPC 6010 SERIES : LATEST IPC-6010 QUALIFICATION AND PERFORMANCE SERIES
PD IEC/TS 62647-1:2012 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Preparation for a lead-free control plan
GEIA STD 0005-1 : 2012 PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER
IEC TS 62647-1:2012 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan
IEC PAS 62647-1:2011 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Lead-free management
PD IEC/PAS 62647-1:2011 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Lead-free management
IEC PAS 62293:2001 Qualification and performance specification for high density interconnect (HDI) layers or boards (IPC 6016)

IPC 2220 : LATEST IPC 2220 FAMILY OF DESIGN DOCUMENTS
IPC SM 840 : E QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS
IPC S 100 : LATEST STANDARDS AND SPECIFICATIONS MANUAL
IPC MC 790 : 0 GUIDELINES FOR MULTICHIP MODULE TECHNOLOGY UTILIZATION
IPC PE 740 : 0 TROUBLESHOOTING FOR PRINTED BOARD MANUFACTURE AND ASSEMBLY
IPC DD 135 : 0 QUALIFICATION TESTING FOR DEPOSITED ORGANIC INTERLAYER DIELECTRIC MATERIALS FOR MULTICHIP MODULES

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