IPC 7530 CHINESE : 2001
Current
Current
The latest, up-to-date edition.
GUIDELINES FOR TEMPERATURE PROFILING FOR MASS SOLDERING PROCESSES (REFLOW AND WAVE)
Published date
05-10-2017
Publisher
| DevelopmentNote |
Also available in Hardcopy format. (01/2018)
|
| DocumentType |
Standard
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Current
|
| Supersedes |
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