• IPC 7621 : 2018

    Current The latest, up-to-date edition.

    GUIDELINE FOR DESIGN, MATERIAL SELECTION AND GENERAL APPLICATION OF ENCAPSULATION OF ELECTRONIC CIRCUIT ASSEMBLY BY LOW PRESSURE MOLDING WITH THERMOPLASTICS

    Publisher:  Institute of Printed Circuits

    Published: 

    Available Formats:  Hardcopy - English
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      Institute of Printed Circuits
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