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IPC 7711 : 1998

Superseded
Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

View Superseded by
superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

REWORK OF ELECTRONIC ASSEMBLIES
Superseded date

10-01-2003

Published date

01-12-2013

Publisher

Institute of Printed Circuits

1 General
2 Handling/Cleaning
  2.1 Handling Electronic Assemblies
  2.2 Cleaning
  2.3 Conditioning
  2.4 Coating
3 Removal
  3.1 Through-Hole Removal
  3.2 PGA and Connector Removal
  3.3 Chip Component Removal
  3.4 Leadless Component removal
  3.5 SOT Removal
  3.6 Gull Wing Removal (two sided)
  3.7 Gull Wing Removal (four sided)
  3.8 J-Lead Removal
  3.9 BGA/CSP Removal
  3.10 PLCC Socket Removal
4 Pad/Land Preparation
5 Installation
  5.1 Through-Hole Installation
  5.2 PGA and Connector Installation
  5.3 Chip Installation
  5.4 Leadless Component Installation
  5.5 Gull Wing Installation
  5.6 J-Lead Installation
  5.7 BGA-CSP Installation
6 Removing Shorts
7 Bonding/Coating
8 Wires
  8.1 Splicing

Gives procedures for reworking electronic assemblies, either once the assemblies have been in the field or as part of the manufacturing process. The procedural requirements for materials, tools and methods used in replacing and removing conformal coatings, through-hole components and surface mounts are prescribed.

DevelopmentNote
Supersedes IPC R 700. (08/1998) This document is included in IPC 7711/21 (7711 AND 7721 PACKAGE) (06/2002) Included in the E-500 Collection. (09/2003)
DocumentType
Standard
PublisherName
Institute of Printed Circuits
Status
Superseded
SupersededBy
Supersedes

IPC D 326 : A INFORMATION REQUIREMENTS FOR MANUFACTURING PRINTED CIRCUIT BOARDS AND OTHER ELECTRONIC ASSEMBLIES
IPC J STD 033 RUSSIAN : B HANDLING, PACKING, SHIPPING AND USE OF MOISTURE/REFLOW SENSITIVE SURFACE MOUNT DEVICES
IPC J STD 033 CHINESE : B-1 HANDLING, PACKING, SHIPPING AND USE OF MOISTURE/REFLOW SENSITIVE SURFACE MOUNT DEVICES
IPC J STD 033 GERMAN : C HANDLING, PACKING, SHIPPING, AND USE OF MOISTURE/REFLOW AND/OR PROCESS SENSITIVE COMPONENTS
IPC J STD 033 ITALIAN : B HANDLING, PACKING, SHIPPING AND USE OF MOISTURE/REFLOW SENSITIVE SURFACE MOUNT DEVICES
ARINC 669 : 2004 GUIDANCE FOR LEAD-BASED SOLDERING, REPAIR AND REWORK
GEIA HB 0005-3 : 2008 REWORK/REPAIR HANDBOOK TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES IN AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS
ARINC 671 : 2006 GUIDANCE FOR THE TRANSITION TO LEAD-FREE SOLDERING, MAINTENANCE, AND REPAIR
IEC 61192-5:2007 Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies
IEC PAS 62249:2001 Qualification and performance specification for flexible printed boards
BS EN 61192-5:2007 Workmanship requirements for soldered electric assemblies Rework, modification and repair of soldered electronic assemblies
I.S. EN 61192-5:2007 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 5: REWORK, MODIFICATION AND REPAIR OF SOLDERED ELECTRONIC ASSEMBLIES
EN 61192-5 : 2007 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 5: REWORK, MODIFICATION AND REPAIR OF SOLDERED ELECTRONIC ASSEMBLIES

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