IPC 9191 : 0
Current
The latest, up-to-date edition.
GENERAL GUIDELINES FOR IMPLEMENTATION OF STATISTICAL PROCESS CONTROL (SPC)
Hardcopy
English
01-19-2022
1 SCOPE
1.1 Subject of this Standard
1.2 Aspects Covered
1.3 Field of Application
1.4 Interpretation
2 NORMATIVE REFERENCE(S)
2.1 IPC
3 TERM(S) AND DEFINITION(S)
4 SPC OBJECTIVES AND ORGANIZATION
4.1 SPC Objectives
4.2 Financial Motive for SPC
4.3 Relationships
4.4 SPC Organization
5 CONDITIONS FOR STATISTICAL PROCESS CONTROL
5.1 Management Support
5.2 Understanding of SPC Tools and Methods
5.3 Quality System
6 ELEMENTS OF A STATISTICAL PROCESS CONTROL SYSTEM
6.1 Process Documentation and Control Plan
6.2 Definition of Process Targets and Limits
6.3 Measurement System Evaluation and Control
6.4 Documented Work Instructions
6.5 Employee Training and Involvement in Process Data
6.6 Process Data Recording and Collection
6.7 Traceability and Production Sequence Identification
6.8 Subcontractor Performance Evaluation
6.9 Process Input Sequencing
6.10 Process Logs
6.11 Process Reliability
6.12 Process Output Monitoring System
6.13 Process Control System
6.14 Short-Term Variability Assessment
6.15 Long-Term Variability Assessment
6.16 Communicating the results of Process Analysis
6.17 Customer Information System
6.18 Internal SPC Audits
6.19 SPC Projects and Teams
6.20 Process Improvement, Optimization and Troubleshooting
Outlines the SPC philosophy, implementation strategies, and tools and techniques. Also describes the provisions for implementing an SPC system in the electronics industry. The tools and techniques covered in this guideline are also used for relating process control and capability to final product requirements.
| DevelopmentNote |
Supersedes IPC PC 90. (11/2000)
|
| DocumentType |
Standard
|
| Pages |
52
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Current
|
| Supersedes |
| MIL-PRF-31032 Revision C:2016 | Printed Circuit Board/Printed Wiring Board, General Specification for |
| I.S. EN 61191-2:2017 | PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES |
| BS EN 61191-3:2017 | Printed board assemblies Sectional specification. Requirements for through-hole mount soldered assemblies |
| IEC 61191-4:2017 | Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies |
| IPC D 326 : A | INFORMATION REQUIREMENTS FOR MANUFACTURING PRINTED CIRCUIT BOARDS AND OTHER ELECTRONIC ASSEMBLIES |
| IPC AJ 820 : A | ASSEMBLY AND JOINING HANDBOOK |
| IPC J STD 001 SWEDISH : E | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC J STD 001 RUSSIAN : E | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC WHMA A 620 HUNGARIAN : B | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
| IPC J STD 001 TURKISH : E2010 | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC J STD 001 POLISH : E | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC A 600 SWEDISH : H | ACCEPTABILITY OF PRINTED BOARDS |
| IPC A 600 JAPANESE : H | ACCEPTABILITY OF PRINTED BOARDS |
| IPC A 600 CHINESE : G | ACCEPTABILITY OF PRINTED BOARDS |
| IPC WHMA A 620 TURKISH : B2012 AMD 1 2013 | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
| IPC WHMA A 620 HEBREW : B2012 AMD 1 2013 | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
| IPC A 600 GERMAN : H | ACCEPTABILITY OF PRINTED BOARDS |
| IPC 7092 : 0 | DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR EMBEDDED COMPONENTS |
| IPC A 600 POLISH : H | ACCEPTABILITY OF PRINTED BOARDS |
| IPC A 600 RUSSIAN : H | ACCEPTABILITY OF PRINTED BOARDS |
| IPC 7912 : A | END-ITEM DPMO FOR PRINTED CIRCUIT BOARD ASSEMBLIES |
| IPC WHMA A 620 SPANISH : B | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
| IPC WHMA A 620 CHINESE : B | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
| IPC WHMA A 620 VIETNAMESE : B2012 | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
| IPC 4411 : A | SPECIFICATION AND CHARACTERIZATION METHODS FOR NONWOVEN PARA-ARAMID REINFORCEMENT |
| IPC CH 65 : B | GUIDELINES FOR CLEANING OF PRINTED BOARDS AND ASSEMBLIES |
| IPC 4204 CHINESE : A2011 AMD 1 2013 | FLEXIBLE METAL-CLAD DIELECTRICS FOR USE IN FABRICATION OF FLEXIBLE PRINTED CIRCUITRY |
| IPC DPMO 202 : 2002 | IPC 7912/9261 END ITEM AND IN-PROCESS DPMO SET |
| IPC 4412 : B | SPECIFICATION FOR FINISHED FABRIC WOVEN FROM 'E' GLASS FOR PRINTED BOARDS |
| IPC CH 65 CHINESE : B | GUIDELINES FOR CLEANING OF PRINTED BOARDS AND ASSEMBLIES |
| IPC A 630 CHINESE : - | ACCEPTABILITY STANDARD FOR MANUFACTURE, INSPECTION AND TESTING OF ELECTRONIC ENCLOSURES |
| IPC J STD 001 HUNGARIAN : E | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC 4412 CHINESE : B | SPECIFICATION FOR FINISHED FABRIC WOVEN FROM 'E' GLASS FOR PRINTED BOARDS |
| IPC J STD 001 GERMAN : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC WHMA A 620 POLISH : B | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
| IPC 4204 : A | FLEXIBLE METAL-CLAD DIELECTRICS FOR USE IN FABRICATION OF FLEXIBLE PRINTED CIRCUITRY |
| IPC 4202 CHINESE : A | FLEXIBLE BASE DIELECTRICS FOR USE IN FLEXIBLE PRINTED CIRCUITRY |
| IPC 9261 : A | IN-PROCESS DPMO AND ESTIMATED YIELD FOR PCAS |
| IPC J STD 001 ROMANIAN : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC A 600 FRENCH : H | ACCEPTABILITY OF PRINTED BOARDS |
| IPC J STD 001 DANISH : E | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC 4101 CHINESE : C2009 | SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS |
| IPC 4101 GERMAN : C | SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS |
| IPC 9199 : 0 | STATISTICAL PROCESS CONTROL (SPC) QUALITY RATING |
| IPC WHMA A 620 ESTONIAN : B2012 AMD 1 2013 | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
| IPC WHMA A 620 KOREAN : B2012 AMD 1 2013 | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
| DD IEC/PAS 61249-6-3:2011 | Specification for finished fabric woven from “E?? glass for printed boards |
| IPC 9194 : 0 | IMPLEMENTATION OF STATISTICAL PROCESS CONTROL (SPC) APPLIED TO PRINTED BOARD ASSEMBLY MANUFACTURE GUIDELINE |
| IEC 61191-2:2017 | Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies |
| I.S. EN 61191-4:2017 | PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES |
| IPC J STD 001 CHINESE : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| I.S. EN 61191-3:2017 | PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES |
| IPC J STD 001 SPANISH : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC J STD 001 FRENCH : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC WHMA A 620 DANISH : B | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
| BS EN 61191-4:2017 | Printed board assemblies Sectional specification. Requirements for terminal soldered assemblies |
| EIA 557 : 2006 | STATISTICAL PROCESS CONTROL SYSTEMS |
| IPC 4562 : A | METAL FOIL FOR PRINTED BOARD APPLICATIONS |
| IPC A 630 : 0 | ACCEPTABILITY STANDARD FOR MANUFACTURE, INSPECTION AND TESTING OF ELECTRONIC ENCLOSURES |
| IEC PAS 61249-6-3:2011 | Specification for finished fabric woven from "E" glass for printed boards |
| 15/30327712 DC : 0 | BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES |
| IEC 61191-3:2017 | Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies |
| IPC 4562 CHINESE : A | METAL FOIL FOR PRINTED BOARD APPLICATIONS |
| EN 61191-2:2017 | Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies |
| EN 61191-3:2017 | Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies |
| EN 61191-4:2017 | Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies |
| IPC 6011 : 0 | GENERIC PERFORMANCE SPECIFICATION FOR PRINTED BOARDS |
| IPC J STD 001 : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC 4104 : 1999 | SPECIFICATION FOR HIGH DENSITY INTERCONNECT (HDI) AND MICROVIA MATERIALS |
| IPC 4110 : 0 | SPECIFICATION AND CHARACTERIZATION METHODS FOR NONWOVEN CELLULOSE BASED PAPER FOR PRINTED BOARDS |
| IPC 4130 : 0 | SPECIFICATION AND CHARACTERIZATION METHODS FOR NONWOVEN 'E' GLASS MATERIALS |
| IPC 9261 : A | IN-PROCESS DPMO AND ESTIMATED YIELD FOR PCAS |
| IPC 7912 : A | END-ITEM DPMO FOR PRINTED CIRCUIT BOARD ASSEMBLIES |
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