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IPC 9203 : 0

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

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superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

USERS GUIDE TO IPC-9202 AND THE IPC-B-52 STANDARD TEST VEHICLE

Available format(s)

Hardcopy

Superseded date

01-22-2024

Language(s)

English

FOREWORD
1 INTRODUCTION
2 APPLICABLE DOCUMENTS
3 THE IPC B-52 TEST VEHICLE
4 A WALK THROUGH OF IPC-9202
5 OTHER USEFUL INFORMATION
6 FINAL THOUGHTS

Addresses the IPC-B-52 standard test vehicle which can be used to evaluate optimize a manufacturing process or to provide objective evidence that a chosen manufacturing material set and manufacturing process are compatible from a cleanliness standpoint.

DevelopmentNote
Included in IPC C 103. (04/2013) Included in IPC C 108 & IPC C 1000. (07/2013) Also available in Hardcopy format. (01/2018)
DocumentType
Standard
Pages
40
PublisherName
Institute of Printed Circuits
Status
Superseded
SupersededBy

BS EN 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Guidance for printed board assemblies
EN 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
IPC J STD 001 GERMAN : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC J STD 001 ROMANIAN : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC J STD 001 CHINESE : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC J STD 001 SPANISH : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC J STD 001 FRENCH : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
NASA GSFC STD 8002 : 2015 STANDARD QUALITY ASSURANCE REQUIREMENTS FOR THE USE OF WATER SOLUBLE FLUX
IEC 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies

IPC A 52-G : 2006 CLEANLINESS AND RESIDUE EVALUATION TEST BOARD
DEFSTAN 00-10/3(1986) : 1986 AMD 2 1993 GENERAL DESIGN AND MANUFACTURING REQUIREMENTS FOR SERVICE ELECTRONIC EQUIPMENT
IPC J STD 001 : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC J STD 004 : B REQUIREMENTS FOR SOLDERING FLUXES
IPC TM 650 : 0 TEST METHODS MANUAL
IPC A 24 : LATEST SURFACE INSULATION RESISTANCE
IPC 9201 : A SURFACE INSULATION RESISTANCE HANDBOOK
IPC TR 467 : 0 SUPPORTING DATA AND NUMERICAL EXAMPLES FOR J-STD-001 (CONTROL OF FLUXES)
IPC 9202 : 0 MATERIAL AND PROCESS CHARACTERIZATION/QUALIFICATION TEST PROTOCOL FOR ASSESSING ELECTROCHEMICAL PERFORMANCE
IPC 5704 : 0 CLEANLINESS REQUIREMENTS FOR UNPOPULATED PRINTED BOARDS

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