IPC 9691 : A

Superseded

USER GUIDE FOR THE IPC-TM-650, METHOD 2.6.25, CONDUCTIVE ANODIC FILAMENT (CAF) RESISTANCE AND OTHER INTERNAL ELECTROCHEMICAL MIGRATION TESTING

Available format(s)

Hardcopy

Superseded date

10-05-2023

Language(s)

English

Publisher

Institute of Printed Circuits

1 SCOPE
2 BACKGROUND
3 PURPOSE
4 INTRODUCTION
5 WHAT IS CONDUCTIVE ANODIC FILAMENT
   GROWTH?
6 OTHER INTERNAL ECM MODES
7 INCREASING INTERNAL ECM RISK TRENDS
8 ADJUSTED CALCE CAF FAILURE MODEL
9 INTERNAL ECM TEST VEHICLE DESIGN
10 INTERNAL ECM TEST BOARD SAMPLE
   PREPARATION & TESTING
11 INTERNAL ECM TEST DATA FORMAT
12 INTERNAL ECM TEST SPACING DATA
   ANALYSIS
13 SAMPLE SIZES
14 RELATING CAF RESISTANCE TEST
   RESULTS TO EXPECTED FIELD LIFE
15 SPECIFYING INTERNAL ECM RESISTANCE
16 LOCATION OF TESTING
17 LOCATING INTERNAL ECM FAILURES
18 FACTORS AFFECTING INTERNAL ECM
   RESISTANCE
19 CONCLUSIONS
20 SUMMARY
APPENDIX A - Other Internal ECM or CAF
             Resistance Test Boards/Coupons

Gives guidance regarding implementation of the User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing to evaluate the effects of mechanical stress, laminate material fracturing, ionic contamination, moisture content prior to press lamination, and other material processing characteristics on formation of conductive paths within laminate material such as conductive anodic filaments (CAF), one specific type of ECM failure mode.

Committee	5-30
DevelopmentNote	Included in IPC C 107. (06/2008) Included in IPC C 105 & IPC C 1000. (07/2008) A2007 Edition is still available in German & Chinese languages, See separate records. (09/2016) Also available in Hardcopy format. (01/2018)
DocumentType	Standard
Pages	32
PublisherName	Institute of Printed Circuits
Status	Superseded
SupersededBy	IPC 9691B:2016
Supersedes	IPC 9691 CHINESE : A2007 IPC 9691 CHINESE : A IPC 9691 : 0

15/30331587 DC : 0	BS EN 61189-5-503 - TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-503: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - CONDUCTIVE ANODIC FILAMENTS (CAF) TESTING OF CIRCUIT BOARDS
BS EN IEC 61189-5-503:2017	Test methods for electrical materials, printed board and other interconnection structures and assemblies General test method for materials and assemblies. Conductive anodic filaments (CAF) testing of circuit boards
IEC 61189-5-503:2017	Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards
EN 61189-5-1:2016	Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
EN 61189-5-503:2017	Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards
IPC 6012 RUSSIAN : C	QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
IPC J STD 001 SWEDISH : E	REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC A 610 DANISH : E	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC J STD 001 RUSSIAN : E	REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC A 610 SPANISH : E	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC J STD 001 TURKISH : E2010	REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC J STD 001 POLISH : E	REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC A 610 ROMANIAN : E	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 600 SWEDISH : H	ACCEPTABILITY OF PRINTED BOARDS
IPC A 600 JAPANESE : H	ACCEPTABILITY OF PRINTED BOARDS
IPC A 600 CHINESE : G	ACCEPTABILITY OF PRINTED BOARDS
IPC 6012 POLISH : C	QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
IPC A 600 GERMAN : H	ACCEPTABILITY OF PRINTED BOARDS
IPC A 610 CZECH : E	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 GERMAN : E	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 600 POLISH : H	ACCEPTABILITY OF PRINTED BOARDS
IPC A 610 HINDI : E2010	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 600 RUSSIAN : H	ACCEPTABILITY OF PRINTED BOARDS
IPC 5702 : 0	GUIDELINES FOR OEMS IN DETERMINING ACCEPTABLE LEVELS OF CLEANLINESS OF UNPOPULATED PRINTED BOARDS
IPC A 610 ESTONIAN : E2010	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 POLISH : E	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 DUTCH : F2014	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 KOREAN : F2014	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 ITALIAN : E	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 FRENCH : F	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC J STD 001 HUNGARIAN : E	REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC A 610 SWEDISH : E	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC J STD 001 GERMAN : F	REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC A 610 HUNGARIAN : E	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC 6013 GERMAN : B	QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE PRINTED BOARDS
IPC HDBK 840 : 0	SOLDER MASK HANDBOOK
IPC 6012 FRENCH : C	QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
IPC A 610 CHINESE : F	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 TURKISH : E2010	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC J STD 001 ROMANIAN : F	REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC A 610 JAPANESE : E	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 600 FRENCH : H	ACCEPTABILITY OF PRINTED BOARDS
IPC J STD 001 DANISH : E	REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC A 610 RUSSIAN : D	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 VIETNAMESE : E	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
BS EN 61189-5-1:2016	Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Guidance for printed board assemblies
IPC J STD 001 CHINESE : F	REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC J STD 001 SPANISH : F	REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC J STD 001 FRENCH : F	REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
CEI EN 61189-5-503 : 1ED 2017	TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARD AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-503: GENERAL TEST METHOD FOR MATERIALS AND ASSEMBLIES - CONDUCTIVE ANODIC FILAMENTS (CAF) TESTING OF CIRCUIT BOARDS
IEC 61189-5-1:2016	Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
I.S. EN 61189-5-503:2017	TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARD AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-503: GENERAL TEST METHOD FOR MATERIALS AND ASSEMBLIES - CONDUCTIVE ANODIC FILAMENTS (CAF) TESTING OF CIRCUIT BOARDS