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IPC
IPC-9701B:2022

IPC-9701B:2022

Current

Current

The latest, up-to-date edition.

Thermal Cycling Test Method for Fatigue Life Characterization of Surface Mount Attachments

Available format(s)

Hardcopy

Language(s)

English

Published date

02-01-2022

Publisher

Institute of Printed Circuits

The IPC-9701B standard establishes a thermal cycling test method to characterize the fatigue lifetimes of surface mount solder attachments of electronic assemblies.

DocumentType
Test Method
ISBN
978-1-63816-072-4
Pages
24
PublisherName
Institute of Printed Circuits
Status
Current
Supersedes

JEDEC JESD 22-B113B:2018 Board Level Cyclic Bend Test Method for Interconnect Reliability Characterization of SMT ICs for Handheld Electronic Products

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Hardcopy - English
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