IPC 9702 : 0

Name: IPC 9702 : 0
Brand: IPC

Withdrawn

MONOTONIC BEND CHARACTERIZATION OF BOARD-LEVEL INTERCONNECTS

Withdrawn date

09-14-2023

Published date

12-16-2021

Publisher

Institute of Printed Circuits

1 FOREWORD
2 INTRODUCTION
3 SCOPE
4 TERMS AND DEFINITIONS
5 SYMBOLS AND ABBREVIATED TERMS
6 SAMPLING
7 APPARATUS
  7.1 Universal Tester
  7.2 Strain Measurement Equipment
  7.3 Continuity Monitoring Equipment
8 PROCEDURE
  8.1 Component Sample
  8.2 Test Board Material
  8.3 Test Board Thickness and Metal Layer
  8.4 Test Board Surface Finish
  8.5 Test Board Land Pads
  8.6 Test Board Layout
  8.7 Test Board Daisy-Chain Links
  8.8 Board Assembly
  8.9 Storage
  8.10 Strain Gages
  8.11 Set-Up Test Board
  8.12 Four-Point Bend Test
9 FAILURE CRITERIA AND ANALYSIS
ANNEX A
ANNEX B

Describes a common method of establishing the fracture resistance of board-level device interconnects to flexural loading during non-cyclic board assembly and test operations.

DevelopmentNote	Included in IPC C 103 & IPC C 1000. (07/2008) Also available in Chinese langugae, See IPC 9702 CHINESE. (09/2011) Also available in Hardcopy format. (01/2018)
DocumentType	Standard
PublisherName	Institute of Printed Circuits
Status	Withdrawn

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