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IPC 9704 : A

Current
Current

The latest, up-to-date edition.

PRINTED CIRCUIT ASSEMBLY STRAIN GAGE TEST GUIDELINE
Published date

02-03-2012

1 SCOPE
2 APPLICABLE DOCUMENTS
3 GENERAL REQUIREMENTS/GUIDELINES
4 DATA ANALYSIS AND REPORTING
5 CONCLUSIONS
6 FUTURE STUDIES
APPENDIX A - ICT DESIGN CONSIDERATIONS
APPENDIX B - ACRONYMS

Specifies specific guidelines for strain gage testing during the printed board manufacturing process, including board assembly, test, system integration and other types of operations that may induce board flexure.

DevelopmentNote
Included in IPC C 103 & IPC C 1000. (07/2008) Jointly published by IPC and JEDEC. (02/2012) Also available in Chinese Language, See IPC 9704 CHINESE. (09/2012) Also available in Hardcopy format. (01/2018)
DocumentType
Standard
PublisherName
Institute of Printed Circuits
Status
Current
Supersedes

BS EN 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Guidance for printed board assemblies
EN 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
IPC 9707 : 0 SPHERICAL BEND TEST METHOD FOR CHARACTERIZATION OF BOARD LEVEL INTERCONNECTS
IPC 7095 : C DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BGAS
IPC 9701 : A PERFORMANCE TEST METHODS AND QUALIFICATION REQUIREMENTS FOR SURFACE MOUNT SOLDER ATTACHMENTS
IEC 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
IPC 9701 CHINESE : A PERFORMANCE TEST METHODS AND QUALIFICATION REQUIREMENTS FOR SURFACE MOUNT SOLDER ATTACHMENTS

IPC T 50 : M TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
IPC 9703 : 0 IPC/JEDEC MECHANICAL SHOCK TEST GUIDELINES FOR SOLDER JOINT RELIABILITY
IPC 9708 : 0 TEST METHODS FOR CHARACTERIZATION OF PRINTED BOARD ASSEMBLY PAD CRATERING
IPC D 279 : 0 DESIGN GUIDELINES FOR RELIABLE SURFACE MOUNT TECHNOLOGY PRINTED BOARD ASSEMBLIES
IPC 9701 : A PERFORMANCE TEST METHODS AND QUALIFICATION REQUIREMENTS FOR SURFACE MOUNT SOLDER ATTACHMENTS
IPC 9702 : 0 MONOTONIC BEND CHARACTERIZATION OF BOARD-LEVEL INTERCONNECTS
IPC 9707 : 0 SPHERICAL BEND TEST METHOD FOR CHARACTERIZATION OF BOARD LEVEL INTERCONNECTS
IPC 7095 : C DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BGAS

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